User’s Manual
IE-703079-MC-EM1
In-circuit Emulator Option Board
Target device
V850/SF1™
Document No. U15447EJ1V0UM00 (1st edition)
Date Published September 2001 N CP(K)
2001
©
Printed in Japan
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V850 Family and V850/SF1 are trademarks of NEC Corporation.
Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States
and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
Ethernet is a trademark of Xerox Corporation.
•
The information in this document is current as of May, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
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No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
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liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
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Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
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(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
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Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
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Device availability
Ordering information
Product release schedule
Availability of related technical literature
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
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Santa Clara, California
Tel: 408-588-6000
800-366-9782
NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd.
Benelux Office
Hong Kong
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Tel: 040-2445845
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Fax: 2886-9022/9044
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Fax: 040-2444580
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Fax: 0211-65 03 490
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Electron Devices Division
Guarulhos-SP, Brasil
Tel: 11-6462-6810
Fax: 11-6462-6829
J01.2
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INTRODUCTION
Target Readers
Purpose
This manual is intended for users who design and develop application systems using
the V850/SF1™.
The purpose of this manual is to describe the proper operation of the IE-703079-MC-
EM1 and its basic specifications.
Organization
This manual is divided into the following parts.
•
•
•
Overview
Names and functions of components
Cautions
How to Read This Manual
It is assumed that the reader of this manual has general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
The IE-703079-MC-EM1 is used connected to the IE-703002-MC in-circuit emulator.
This manual explains the basic setup procedure and switch settings of the IE-
703002-MC when it is connected to the IE-703079-MC-EM1. For the names and
functions of parts, and the connection of elements, refer to the IE-703002-MC User’s
Manual (U11595E).
To learn about the basic specifications and operation methods
→ Read this manual in the order of the CONTENTS.
To learn the operation methods and command functions, etc., of the IE-703002-MC
and IE-703079-MC-EM1
→ Read the user’s manual of the debugger (sold separately) that is used.
Conventions
Note:
Footnote for item marked with Note in the text
Caution:
Remark:
Information requiring particular attention
Supplementary information
…
Numeral representation: Binary
Decimal
xxxx or xxxxB
…
xxxx
…
Hexadecimal
xxxxH
Prefix indicating the power of 2 (address space, memory capacity):
K (kilo):
210 = 1024
220 = 10242
M (mega):
Terminology
The meanings of terms used in this manual are listed below.
Target device
Target system
The device that is targeted for emulation.
The system (user-built system) that is targeted for debugging. This
includes the target program and user-configured hardware.
5
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Related Documents
When using this manual, refer to the following manuals.
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
{ Documents related to development tools (user’s manuals)
Document Name
Document
Number
IE-703002-MC In-circuit emulator
IE-703079-MC-EM1 In-circuit emulator option board
U11595E
U15447E
U15024E
U15025E
U15026E
U15027E
CA850 C Compiler package Ver. 2.40
or later
Operation
C Language
Project Manager
Assembly Language
Operation
ID850 Integrated debugger Ver.2.40
WindowsTM based
To be
prepared
SM850 System simulator Ver.2.40
Windows based
Operation
To be
prepared
SM850 System simulator Ver.2.00 or
later
External Part User Open
Interface Specifications
U14873E
RX850 Real-time OS Ver.3.13 or later
RX850 Pro Real-time OS Ver.3.13
Basics
U13430E
U13410E
U13431E
U13773E
U13774E
U13772E
U13737E
U13916E
U14410E
Installation
Technical
Basics
Installation
Technical
RD850 Task debugger Ver.3.01
RD850 Pro Task debugger Ver.3.01
AZ850 System performance analyzer Ver.3.0
6
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CONTENTS
CHAPTER 1 OVERVIEW.........................................................................................................................10
1.1
1.2
1.3
1.4
1.5
1.6
Hardware Configuration...............................................................................................................................10
Features (When Connected to IE-703002-MC) ...........................................................................................11
Function Specifications (When Connected to IE-703002-MC)..................................................................11
System Configuration ..................................................................................................................................12
Contents in Carton .......................................................................................................................................13
Connection Between IE-703002-MC and IE-703079-MC-EM1....................................................................15
CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS ...............................................................18
2.1
2.2
Component Names and Functions of IE-703079-MC-EM1 ........................................................................18
Clock Settings...............................................................................................................................................20
2.2.1
2.2.2
Main system clock setting.................................................................................................................20
Subsystem clock setting...................................................................................................................21
2.3
2.4
Illegal Access Detection ROM Setting ........................................................................................................22
CPU Operation Voltage Range Switching Setting .....................................................................................22
CHAPTER 3 FACTORY SETTINGS........................................................................................................23
CHAPTER 4 CAUTIONS .........................................................................................................................24
4.1
4.2
4.3
4.4
4.5
VDD0 and PORTVDD of Target System ..........................................................................................................24
NMI Signal .....................................................................................................................................................25
VPP Signal ......................................................................................................................................................25
NMI Signal Mask Function ...........................................................................................................................25
Bus Interface Pin ..........................................................................................................................................26
CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT....28
APPENDIX PACKAGE DRAWINGS ........................................................................................................34
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LIST OF FIGURES
Figure No.
Title
Page
1-1
1-2
1-3
1-4
System Configuration ........................................................................................................................................12
Contents in Carton.............................................................................................................................................13
Accessories .......................................................................................................................................................14
Connection Between IE-703002-MC and IE-703079-MC-EM1..........................................................................16
2-1
IE-703079-MC-EM1...........................................................................................................................................18
4-1
4-2
Schematic Diagram of Power Supply Acquisition..............................................................................................24
NMI Signal Flow Path ........................................................................................................................................25
5-1
Equivalent Circuit of Emulation Circuit...............................................................................................................29
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LIST OF TABLES
Table No.
Title
Page
2-1
2-2
2-3
2-4
Main System Clock Setting................................................................................................................................20
Subsystem Clock Setting...................................................................................................................................21
JP1 Setting in IE-703002-MC............................................................................................................................22
JP3 and JP4 Setting in IE-703002-MC..............................................................................................................22
4-1
Bus Interface Pin Operation List........................................................................................................................26
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CHAPTER 1 OVERVIEW
The IE-703079-MC-EM1 is an option board for the IE-703002-MC in-circuit emulator. By connecting the IE-
703079-MC-EM1 and IE-703002-MC, hardware and software can be debugged efficiently in system development
using the V850/SF1.
In this manual, the basic setup procedure and switch settings of the IE-703002-MC when connecting the IE-
703079-MC-EM1 are described. For the names and functions of the parts of the IE-703002-MC, and for the
connection of elements, refer to the IE-703002-MC User’s Manual (U11595E).
1.1 Hardware Configuration
Optional hardware
In-circuit emulator (IE-703002-MC)
Option board
By adding this board, the IE-703002-MC can be used as in-circuit
emulator for V850/SF1.
(IE-703079-MC-EM1)
Optional hardware
Extension probe
General-purpose extension probe made by TOKYO ELETECH
CORPORATION
SWEX-100SD (for GC/GF package)Note 1
GF-N17DT (for GF package)Note 1
PC interface board
IE-70000-PC-IF-CNote 2
IE-70000-98-IF-CNote 2
IE-70000-PCI-IF-A
IE-70000-CD-IF-A
This board is used to connect the IE-703002-MC to a personal
computer. This board is inserted in the expansion slot of the
personal computer.
IE-70000-PC-IF-C: for IBM PC/ATTM compatible ISA bus
IE-70000-98-IF-C: for PC-9800 series C bus
IE-70000-PCI-IF-A: for PCI bus
IE-70000-CD-IF-A: for PCMCIA socket
Network module
This module is used when a workstation controls the IE-703002-MC
via Ethernet™.
(IE-70000-MC-SV3)
Power adapter
AC adapter for in-circuit emulator made by NEC Corporation.
(IE-70000-MC-PS-B)
Notes 1. For further information, contact Daimaru Kogyo Co., Ltd.
Tokyo Electronics Department (TEL +81-3-3820-7112)
Osaka Electronics Department (TEL +81-6-6244-6672)
2. Cannot be used for PC98-NX series
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CHAPTER 1 OVERVIEW
1.2 Features (When Connected to IE-703002-MC)
{
{
{
{
Maximum operating frequency: 16 MHz (at 5.0 V operation)
Extremely lightweight and compact
Higher equivalence with target device can be achieved by omitting buffer between signal cables.
The following pins can be masked.
RESET, NMI, WAIT, HLDRQ
{
{
Two methods of connection to target system:
• Pod tip direct connection (For information on the pod, refer to the IE-703002-MC User’s Manual (U11595E))
• Attach an extension probe (sold separately) to the pod tip for connection
The dimensions of the IE-703079-MC-EM1 are as follows.
Parameter
Power consumption (Max. value at 5.0 V supply voltage)
Value
2.5 W (at 16 MHz operation frequency)Note
External dimensions
(Refer to APPENDIX PACKAGE
DRAWINGS)
Height
Length
Width
50 mm
130 mm
252 mm
300 g
Weight
Note 12.5 W when IE-703002-MC connected to IE-703079-MC-EM1
1.3 Function Specifications (When Connected to IE-703002-MC)
Parameter
Specification
Emulation memory capacity
Internal ROM
256 KB
2 MB
External
memory
In ROMless mode
When using iROM
1 MB
Coverage memory capacity for
execution/pass detection
Internal ROM
256 KB
2 MB
External
memory
In ROMless mode
When using iROM
1 MB
Coverage memory capacity for
memory access detection
External memory
1 MB
Coverage memory capacity for
branching entry number counting
Internal ROM
256 KB
2 MB
External
memory
In ROMless mode
When using iROM
1 MB
Caution
Some of the functions may not be supported, depending on the debugger used.
11
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CHAPTER 1 OVERVIEW
1.4 System Configuration
The system configuration when connecting the IE-703002-MC to the IE-703079-MC-EM1 and a personal computer
(PC-9800 series or PC/AT (or compatibles)) is shown below.
Figure 1-1. System Configuration
<13>
<5>
<6>
<7>
[Magnified drawing: example of use of
connector for target connection]
<12>
<14>
<8>
<4>
<10>
Target
system
<11>
<9>
<3>
<10>
<11>
<1>, <2>
Target system
Remark
<1> Personal computer (PC-9800 series or PC/AT or compatibles)
<2> Debugger (ID850: sold separately)
<3> PC interface board
(IE-70000-98-IF-C/IE-70000-PC-IF-C, IE-70000-PCI-IF-A/IE-70000-CD-IF-A: sold separately)
<4> PC interface cable (included with IE-703002-MC)
<5> In-circuit emulator (IE-703002-MC: sold separately)
<6> In-circuit emulator option board (IE-703079-MC-EM1: this product)
<7> External logic probe (included with IE-703002-MC)
<8> Socket for target connection (YQSOCKET100SDN: sold separately)
<9> Extension probe (for GC package: SWEX-100SD, for GF package: SWEX-100SD/GF-N17DT)
<10> Connector for emulator connection (YQPACK100SD: included)
<11> Connector for target connection (NQPACK100SD: included)
<12> Power adapter (IE-70000-MC-PS-B: sold separately)
<13> AC100V power cable (sold separately: included with IE-70000-MC-PS-B)
<14> AC220V power cable (sold separately: included with IE-70000-MC-PS-B)
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CHAPTER 1 OVERVIEW
1.5 Contents in Carton
The carton of the IE-703079-MC-EM1 contains a main unit, guarantee card, packing list, and accessory bag.
Make sure that the accessory bag contains this manual and the connector accessories. If there are missing or
damaged items, please contact an NEC sales representative or an NEC distributor.
Figure 1-2. Contents in Carton
<1> IE-703079-MC-EM1
<4> Packing list
<3> Guarantee card
<2> Accessory bag
<1> IE-703079-MC-EM1 × 1
<2> Accessory bag × 1
<3> Guarantee card × 1
<4> Packing list × 1
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CHAPTER 1 OVERVIEW
Check that the accessory bag contains this manual, an accessory list (× 1), and the following accessories.
(a) Spacers × 4
(b) Screws/washers × 4 sets
(including screws and washer × 4)
Figure 1-3. Accessories
(a) Spacers
(b) Screws/washers
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CHAPTER 1 OVERVIEW
1.6 Connection Between IE-703002-MC and IE-703079-MC-EM1
The procedure for connecting the IE-703002-MC and IE-703079-MC-EM1 is described below.
Caution
Connect carefully so as not to break or bend connector pins.
<1> Remove the pod cover (upper and lower) of the IE-703002-MC.
<2> Set the PGA socket lever of the IE-703079-MC-EM1 to the OPEN position as shown in Figure 1-4 (b).
<3> Connect the IE-703079-MC-EM1 to the PGA socket at the back of the IE-703002-MC pod (refer to Figure 1-4
(c)). When connecting, position the IE-703002-MC and IE-703079-MC-EM1 so that they are horizontal.
<4> Set the PGA socket lever of the IE-703079-MC-EM1 to the CLOSE position as shown in Figure 1-4 (b).
<5> Set the IE-703002-MC pod jumpers (JP1 to JP3).
The factory settings of JP2 are pins 1 and 2 shorted.
<6> Place the supplied spacers in the four corner holes of the IE-703079-MC-EM1. Fix the spacers with the
supplied screws.
<7> Fix the IE-703002-MC pod cover (upper) end with nylon rivets.
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CHAPTER 1 OVERVIEW
Figure 1-4. Connection Between IE-703002-MC and IE-703079-MC-EM1 (1/2)
(a) Overview
Screw
Upper cover
Washer
IE-703079-MC-EM1
Nylon rivets
IE-703002-MC
Spacer
(b) PGA socket lever of IE-703079-MC-EM1
CLOSE
OPEN
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CHAPTER 1 OVERVIEW
Figure 1-4. Connection Between IE-703002-MC and IE-703079-MC-EM1 (2/2)
(c) Connecting part (IE-703079-MC-EM1)
Pin A1 position
: Insertion guide
: IE-703002-MC insertion area
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
This chapter describes the names, functions, and switch settings of components in the IE-703079-MC-EM1. For
the details of the pod, jumper, and switch positions, etc., refer to the IE-703002-MC User’s Manual (U11595E).
2.1 Component Names and Functions of IE-703079-MC-EM1
Figure 2-1. IE-703079-MC-EM1
(a) Top view
(b) Bottom view
Direction of pin 1 of connector
for target connection
Direction of pin 1 of connector
for target connection
Connector for target connection
CP15
CP1
V850/SF1
I/O chip
FPGA
V850/SF1
I/O chip
JP2
Connector for
IE-703002-MC connection
CP2
CP13
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
(1) TEST pins (CP1, CP2, CP13, CP15)
These are pins used for testing the analog signals of the standalone emulator.
• CP1: GND
• CP2: GND
• CP13: GND
• CP15: GND
(2) JP1
This is a pin board for supplying the main system clock.
(3) JP2
This is the switch jumper for the main system clock supply source. Use and retain the factory settings (pins 1
and 2 shorted).
(4) JP3
This is a pin board for supplying the subsystem clock (for details, refer to 2.2 Clock Settings).
(5) Connector for IE-703002-MC connection
This is a connector for connecting with the IE-703002-MC.
(6) Connector for target connection
This is a connector for connecting with the target system or the extension probe.
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.2 Clock Settings
This section describes the clock settings.
For the position of the JP1 and JP2 in the IE-703079-MC-EM1, refer to Figure 2-1.
For the jumper switch position in the IE-703002-MC, refer to the IE-703002-MC User’s Manual (U11595E).
2.2.1 Main system clock setting
Table 2-1. Main System Clock Setting
Emulator Use
Environment
Clock Supply
Method
IE-703079-MC-EM1 Setting
IE-703002-MC Setting
SW2 JP2
JP1
JP2
2
SW1
ON
When using
emulator as
Internal clock
OFF
1
1
3
3
7
8
1
2
standalone unit
1
1
7
7
When using
emulator with
target system
Internal clock
2
Caution Emulation cannot be performed by inputting a clock from the target board.
The specifications of JP1 are as follows.
V850/SF1
I/O
chip
X1
X2
1 MΩ
GND
GND
1
7
10 pF
16 MHz
10 pF
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.2.2 Subsystem clock setting
Table 2-2. Subsystem Clock Setting
Emulator Use
Environment
Clock Supply Method
IE-703079-MC-EM1 Setting
JP3
When using emulator as
standalone unit
Internal clockNote 1
Internal clockNote 1
Oscillator mounted (a 32.768 kHz oscillator is mounted when
shipped)Note 2
When using emulator with
target system
Oscillator mounted (a 32.768 kHz oscillator is mounted when
shipped)Note 2
Notes 1. The internal clock does not support the clock input by an oscillator.
2. To use a subsystem clock frequency other than 32.768 kHz, remove the resonator on JP3 and mount
any oscillator.
The specifications of JP3 are as follows.
V850/SF1
I/O chip
XT1
XT2
XT1
GND
GND
7
1
27 pF
32.768 kHz
27 pF
Caution Emulation cannot be performed by inputting a clock from the target board.
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.3 Illegal Access Detection ROM Setting
If using the IE-703002-MC for an in-circuit emulator for the V850/SF1 by connecting the IE-703079-MC-EM1, set
JP1 of the IE-703002-MC as follows.
Table 2-3. JP1 Setting in IE-703002-MC
JP1
Description
OpenNote
Illegal access detection ROM (mounted on IE-703079-MC-EM1) for V850/SF1 is
used.
JP1
Note When JP1 is set open, keep the removed jumper contact attached to one pin
as shown in the drawing on the right.
Jumper
contact
2.4 CPU Operation Voltage Range Switching Setting
If using the IE-703002-MC for an in-circuit emulator for the V850/SF1 by connecting the IE-703079-MC-EM1, set
JP3 and JP4 of the IE-703002-MC as follows.
Table 2-4. JP3 and JP4 Setting in IE-703002-MC
JP3, JP4
Description
JP3
JP4
The operation voltage range of the IE-703002-MC is 3.0 to 5.5 V.
1
2
(Short)
(Open)
The power supply for PORTVDD is generated on the IE-703079-MC-EM1.
1
2
3
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CHAPTER 3 FACTORY SETTINGS
Item
Description
Remark
JP1
16 MHz clock supplied for main system clock
Oscillator mounted
JP2Note
Internal clock used for main system clock
1
2
3
(1-2 Shorted)
JP3
Oscillator mounted
32.768 kHz clock supplied for subsystem clock
Note Use JP2 with the factory settings.
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CHAPTER 4 CAUTIONS
4.1 VDD0 and PORTVDD of Target System
(1) VDD0 in the target system is used to sense the level for target system power supply ON/OFF.
• When VDD0 is lower than 1 V, it is judged that the target system is not connected, and mapping of the target
memory cannot be performed with a debugger (FCAN cannot be used).
• When VDD0 is 1 V or higher, it is judged that the target system is connected, and mapping of the target
memory can be performed with a debugger (FCAN can be used).
(2) PORTVDD in the target system is not supplied directly to the emulator chip; it is connected to the target voltage
emulation circuit.
• When PORTVDD is lower than 3 V, VCC (5 V) in the internal emulator is supplied to the emulator chip.
• When PORTVDD is 3 V or higher, a voltage of the same potential as PORTVDD in the target system is
generated and supplied to the emulator chip.
Figure 4-1. Schematic Diagram of Power Supply Acquisition
IE-703079-MC-EM1
IE-703002-MC
ON/OFF?
VDD (8 pins)
V850/SF1
I/O chip
Target
system
Relay
Evaluation
chip
VCC (5 V)
PORTVDD
(66 pins)
Target voltage
emulation
24
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CHAPTER 4 CAUTIONS
4.2 NMI Signal
The input signal (NMI signal) from the target system is delayed (tpD = 0.25 ns (TYP.)) because it passes through
QS3125 (Q switch), and I/O signals (ports 4, 5, 6, 9, 11) pass through QS3384 (Q switch) before it is input to the
emulator chip.
In addition, the DC characteristics change. The input voltage becomes VIH = 2.0 V (MIN.), VIL = 0.8 V (MAX.), and
the input current becomes IIN = 0.5 µA (MAX.).
Figure 4-2. NMI Signal Flow Path
IE-703079-MC-EM1
NMI signal
NMI pin
QS3125
Target
system
Emulator chip
Port signal
Port pin
QS3125
4.3 VPP Signal
The VPP signal from the target system is left open in the emulator.
4.4 NMI Signal Mask Function
When using the P00/NMI pin in the port mode, do not mask the NMI signal.
25
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CHAPTER 4 CAUTIONS
4.5 Bus Interface Pin
The operation of the pin for the bus interface differs between the emulator and the target device as follows.
Table 4-1. Bus Interface Pin Operation List (1/2)
(a) During break
Pin Name
Internal Memory
External Memory
Emulation RAM Target System
Memory Used by
Emulator
Internal
ROM
Internal RAM
Internal
Peripheral I/O
F
R
W
R
R
W
R
W
R
W
R
W
A16 to A21
AD0 to AD15
ASTB
Hold the last accessed address
Active
Active
Active
Active
H
Active
Active
Active
Active
Active
Active
Active
Maskable
Maskable
H or L
H
Hi-Z
H
R/W
H
DSTB
H
LBEN
H
Active
Active
Maskable
Maskable
H or L
H
UBEN
WAIT
H
Invalid
HLDRQ
HLDAK
WRL
Maskable
H or L
H
H
H
Note
Note
H
WRH
H
H
RD
H
Note
Note Active
Caution When accessing an FCAN register with the external memory expanded, a bus cycle for FCAN
access is generated in AD0 to AD15 and A16 to A21. However, R/W, DSTB, LBEN, UBEN, WRL,
WRH, and RD are inactive.
Remarks 1. F:
Fetch
R:
W:
Read
Write
2. H:
L:
High-level output
Low-level output
Hi-Z: High-impedance
26
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CHAPTER 4 CAUTIONS
Table 4-1. Bus Interface Pin Operation List (2/2)
(b) During run
Pin
Internal Memory
External Memory
Emulation RAM Target System
Name
Internal ROM
Internal RAM
Internal
Peripheral I/O
F
R
F
R
W
R
W
F
R
W
F
R
W
A16 to
A21
Hold the last accessed address
Active
Active
AD0 to
AD15
Hi-Z
Active
Active
ASTB
R/W
H
Active
Active
H
Active
Active
Active
Active
Active
Maskable
Maskable
H or L
H
H
DSTB
LBEN
UBEN
WAIT
HLDRQ
HLDAK
WRL
H
H
Active
Active
Maskable
Maskable
H or L
H
H
Invalid
Maskable
H or L
H
H
H
Note
Note
H
WRH
RD
H
H
H
Note
Note Active
Caution When accessing an FCAN register with the external memory expanded, a bus cycle for FCAN
access is generated in AD0 to AD15 and A16 to A21. However, R/W, DSTB, LBEN, UBEN, WRL,
WRH, and RD are inactive.
Remarks 1. F:
Fetch
R:
W:
Read
Write
2. H:
L:
High-level output
Low-level output
Hi-Z: High-impedance
27
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CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT
Differences between the signal lines of the target device and the signal lines of the IE-703079-MC-EM1 target
interface circuit are described in this chapter.
The target device is a CMOS circuit, whereas the target interface circuit of the IE-703079-MC-EM1 is configured
with an emulation circuit such as a gate array TTL or CMOS-IC.
When debugging the IE system connected to the target system, the IE system emulates as if the real target device
is operating on the target system.
Small differences occur however, because the IE system is emulating actual operation.
(1) Signals input/output to/from the emulation CPU µPD70F3079Y
(2) Other signals
The IE-703079-MC-EM1 circuit regarding the (1) and (2) signals described above is as follows.
(1) Signals input/output to/from the emulation CPU µPD70F3079Y
• P00
• P07/INTP6 to P01/INTP0
• P15/SCK1/ASCK0 to P10/SO0/SDA0
• P27 to P20/SI3/RXD1
• P34/VM45/TI71 to P30/TI2/TO2
• P77/ANI7 to P70/ANI0
• P83/ANI11 to P80/ANI8
• P107/KR7/TO1 to P100/KR0/TO7
(2) Other signals
• NMI
• P47/AD7 to P40/AD0
• P57/AD15 to P50/AD8
• P65/A21 to P60/A16
• P96/HLDRQ to P90/LBEN
• P117/CANRX2 to P110/WAIT
• X1, XT1
• RESET
• CLKOUT
• PORTVDD
• CPUREG
• VPP/MODE
• X2, XT2
• GND0, GND1, GND2, PORTGND
28
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CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT
Figure 5-1. Equivalent Circuit of Emulation Circuit (1/5)
Probe side
IE system side
IN/OUT
P00/NMI
QS3125
(P00/NMI)
P01/INTP0
P02/INTP1
P03/INTP2
P04/INTP3
P05/INTP4/ADTRG
P06/INTP5
P07/INTP6
IN/OUT
IN/OUT
P10/SI0/SDA0
P11/SO0
P12/SCK0/SCL0
P13/SI1/RXD0
P14/SO1/TXD0
P15/SCK1/ASCK0
µ
PD70F3079Y
P20/SI3/RXD1
P21/SO3/TXD1
P22/SCK3/ASCK1
P23/SI4
IN/OUT
P24/SO4
P25/SCK4
P26
P27
P30/TI2/TO2
P31/TI3/TO3
P32/TI4/TO4
P33/TI5/TO5
P34/VM45/TI71
IN/OUT
PD70F3079Y
µ
IN/OUT
QS3384
QS3384
Connector
74VHC125
PD703091R
µ
(AD7 to AD0)
P40/AD0
P41/AD1
P42/AD2
P43/AD3
P44/AD4
P45/AD5
P46/AD6
P47/AD7
OUT
(P47 to P40)
FPGA
OR2T40A
IN
29
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CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT
Figure 5-1. Equivalent Circuit of Emulation Circuit (2/5)
Probe side
IE system side
IN/OUT
QS3384
QS3384
Connector
74VHC125
µ
PD703091R
(AD15 to AD8)
P50/AD8
P51/AD9
P52/AD10
P53/AD11
P54/AD12
P55/AD13
P56/AD14
P57/AD15
OUT
(P57 to P50)
FPGA
OR2T40A
IN
OUT
QS3384
QS3384
Connector
74VHC125
PD703091R
µ
(A21 to A16)
P60/AD16
P61/AD17
P62/AD18
P63/AD19
P64/AD20
P65/AD21
OUT
(P65 to P60)
FPGA
OR2T40A
IN
P70/ANI0
P71/ANI1
P72/ANI2
P73/ANI3
P74/ANI4
P75/ANI5
P76/ANI6
P77/ANI7
IN
PD70F3079Y
µ
P80/ANI8
P81/ANI9
P82/ANI10
P83/ANI11
IN
OUT
µ
QS3384
QS3384
Connector
74VHC125
PD703091R
(HLDAC to LBEN)
P90/LBEN
P91/UBEN
P92/R/W
OUT
P93/DSTB
P94/ASTB
P95/HLDAC
(P95 to P90)
FPGA
OR2T40A
IN
30
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CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT
Figure 5-1. Equivalent Circuit of Emulation Circuit (3/5)
Probe side
IE system side
IN
QS3384
QS3384
Connector
74VHC125
µ
PD703091R
(HLDRQ)
OUT
P96/HLDRQ
(P96)
FPGA
OR2T40A
IN
P100/KR0/TO7
P101/KR1/TI70
P102/KR2/TI00
P103/KR3/TI01
P104/KR4/TO0
P105/KR5/TI10
P106/KR6/TI11
P107/KR7/TO1
IN/OUT
µ
PD70F3079Y
P110/WAIT
P111
IN
P112
P113
FPGA
74VHC125
74VHC125
OR2T40A
OUT
QS3384
QS3384
OUT
P114/CANTX1
P116/CANTX2
FPGA
OR2T40A
IN
OUT
µ
PD70F3079F
QS3384
QS3384
74VHC125
OUT
P115/CANRX1
P117/CANRX2
FPGA
OR2T40A
IN
IN
µ
PD70F3079Y
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CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT
Figure 5-1. Equivalent Circuit of Emulation Circuit (4/5)
Probe side
IE system side
X1
X2
1-2 shorted
2 3
X1
µ
PD70F3079Y
1 MΩ
1
JP2
7
1
JP1
XT1
XT2
XT1
PD70F3079Y
µ
7
1
JP3
3 V
5.1 kΩ
RESET
Socket
Socket
µ
PD703091R
PD703091R
CLKOUT
µ
VCC
100 Ω
Relay
PORTVDD
Internal circuit
VCC
1 MΩ
µ
100
F
−
+
G6H-2F
VCC
−
2.2 kΩ
+
3.3 kΩ
µ
PC393
32
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CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT
Figure 5-1. Equivalent Circuit of Emulation Circuit (5/5)
Probe side
IE system side
ADCVDD
ADCGND
CPUREG
VPP/MODE
X2
Open
Open
Open
Open
µ
0.1
F
3.3 V
µ
PD70F3079Y
JP1
JP3
XT2
GND0
GND1
GND2
PORTGND
33
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APPENDIX PACKAGE DRAWINGS
IE-703002-MC + IE-703079-MC-EM1 (Unit: mm)
571
103
166
302
Top view
Pin 1 direction
Side view
IE-703002-MC
IE-703079-MC-EM1
Bottom view
Top view
33.0
34
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