Z Microsystems
Z MPU
FIELD-READY
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Component Overview
TranzPak 7
SCM
2.0
2.1
Hot swap TranzPak 7 Modules contain
environmentally sealed IDE or SCSI hard drives.
Hot swap SCM’s contain environmentally sealed COTS motherboards. Keep your
configurations current with the latest Intel/Sun motherboards.
Internal DC Power Input
and Switched USB
External I/O
Connectors
Inside Look
2.2
Transition
Board
Dedicated 28 VDC
Power and ATX
Interface Board
PCI Card
Heatsinks
conduct thermal
energy to module
cover for
dispersion
Dedicated Disk
(SCSI or IDE)
ATX Motherboard
(Intel or Sun)
Operator Front
Each docking slot has a transition board that mates with the removable SCM and its dedicated TranzPak 7 disk module. Inside each SCM
an interface board generates the required voltages and transitions the motherboard’s I/O signals to the outside world.
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Shared Peripherals & System Administration
Peripheral Sharing
3.0
•
Shared Peripheral Clusters
The Peripheral Device Layer
organizes an array of the most
popular USB devices (CDW, floppy,
PCMCIA) and an external hub into
four switchable clusters that can
be individually and dynamically
switched to any SCM.
Peripheral Cluster
3.1
•
Maximum Flexibility
Each SCM has two independent
internal USB busses that are
assignable to any of the four
peripheral clusters.
Peripheral assignments can be
made locally using the front panel
or remotely via the SysAdmin
network facility.
Remote SysAdmin
3.2
• Web Based SysAdmin
An embedded multiprocessor
monitors system health and
watch-dog activity.
An HTML web page provides
network capability for remote
monitoring and system
administration.
The ability to independently
control power, reboot, monitor
environmental performance,
execute failover strategies, and
administer system functions
across the network allows the
system to be located in “lights
out” inaccessible locations.
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Z Microsystems - Multi Processor Unit
System Architecture
6.0
Future Proof Technology Insertion
(SCM)
Sealed
computer
module
stack
TranzPak 7
removable
disk module
External
connector
transition
board
DC Power In
Peripheral
clusters
Quad
modulated
fan array
provides
front to
back
cooling
Fan array
control
board
Switched
peripheral
and power
distribution
backplane
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7.0 Schematics
7.1 Specifications
7.2
Options
Motherboards
Intel and Sun ATX form
factor
Shipping Humidity
Non Op. Altitude
Operating Altitude
Operating Vibration
5% to 95% Non condensing
-1,300 to 40,000 ft.
Storage Options
Dimensions
SCSI and/or IDE
10.5” H x 17.5" W x 22" D
110 lbs. (depending on
device)
-1,300 to 10,000 ft.
Wheeled and tracked vehicles, fixed
and rotary wing aircraft.
Net Weight
Mil-Std-167 (in transit case)
Mil-Std-810E, Method 516, 30g’s
Non Nutrients / contaminants
Z MPU 2X
Power
Shock Operating
Fungus
DC Voltage:
22 – 29 VDC
DC Current:
18A @ 28VDC Typ.
85 – 264 VAC @ 47-63 Hz
5.6A @ 120VAC Typ.
Reliability
Operating Life
Maintainability
Regulatory
Safety
AC Voltage:
10 years
AC Current :
<20 minutes
Environmental
Operating Temp.
Non Op. Temp.
Operating Humidity
Non Op. Humidity
5º to + 50º Celsius
UL 1950
-40º to + 65º Celsius
EMI
FCC Class A
5% to 95% Non condensing
5% to 95% Non condensing
Quality/Workmanship IPC / ISO 9002 and applicable section
of MIL-HDBK-454
Z MPU 4X
Z Microsystems 5945 Pacific Center Blvd., Suite 505 San Diego, CA 92121-4309 T: 858.657.1000 F: 858.657.1001 www.zmicro.com
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