HP Hewlett Packard Computer Drive DL785 User Manual

HP ProLiant DL785 Server Maintenance and  
Service Guide Generation 5 and Generation  
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Maintenance and Service Guide  
HP Part Number: AH233-9002A_ed7  
Published: January 2010  
Edition: 7  
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Table of Contents  
Table of Contents  
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Table of Contents  
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1 Customer self repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time  
and allow for greater flexibility in performing defective parts replacement. If during the diagnosis  
period HP (or HP service providers or service partners) identifies that the repair can be  
accomplished by the use of a CSR part, HP will ship that part directly to you for replacement.  
There are two categories of CSR parts:  
Mandatory Parts for which customer self repair is mandatory. If you request HP to replace  
these parts, you will be charged for the travel and labor costs of this service.  
Optional Parts for which customer self repair is optional. These parts are also designed  
for customer self repair. If, however, you require that HP replace them for you, there may  
or may not be additional charges, depending on the type of warranty service designated for  
your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer  
warranty, HP requires that an authorized service provider replace the part. These parts are  
identified as "No" in the Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business  
day delivery. Same day or four-hour delivery may be offered at an additional charge where  
geography permits. If assistance is required, you can call the HP Technical Support Center and  
a technician will help you over the telephone. HP specifies in the materials shipped with a  
replacement CSR part whether a defective part must be returned to HP. In cases where it is  
required to return the defective part to HP, you must ship the defective part back to HP within  
a defined period of time, normally five (5) business days. The defective part must be returned  
with the associated documentation in the provided shipping material. Failure to return the  
defective part may result in HP billing you for the replacement. With a customer self repair, HP  
will pay all shipping and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service  
provider. For the North American program, refer to the HP website  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par  
le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces  
défectueuses. Si pendant la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés)  
détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HP vous l'envoie  
directement. Il existe deux catégories de pièces CSR:  
Obligatoire Pièces pour lesquelles la réparation par le client est obligatoire. Si vous  
demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du  
service vous seront facturés.  
Facultatif Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont  
également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois,  
si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée,  
selon le type de garantie applicable à votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer  
lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement  
de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention  
"Non" dans le Catalogue illustré.  
Réparation par le client (CSR)  
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Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon  
votre situation géographique. Si votre situation géographique le permet et que vous demandez  
une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une  
assistance téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés  
avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse.  
Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La  
pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez  
pas la pièce défectueuse, HP se réserve le droit de vous facturer les coûts de remplacement. Dans  
le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de retour, et détermine  
la société de courses ou le transporteur à utiliser.  
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local.  
Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di  
parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati  
direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro  
di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP  
lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne  
affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il  
servizio.  
Opzionali Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di  
componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad  
HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per  
il prodotto.  
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per  
rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza  
autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.  
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna  
entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta  
con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza  
telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte  
di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta  
la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo  
di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito  
con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del  
componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione  
da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da  
utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona.  
Per il programma in Nord America fare riferimento al sito Web HP  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren  
und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein  
HP Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert  
werden kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in  
zwei Kategorien unterteilt:  
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Customer self repair  
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Zwingend Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist.  
Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt-  
und Arbeitskosten für diesen Service berechnet.  
Optional Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind  
auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von  
HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt  
vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch  
des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im  
illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag  
geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier  
Stunden gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische  
Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien,  
die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an  
HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP  
zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel  
innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen Dokumentation  
in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das  
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle  
von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf  
und bestimmt den Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem  
Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf  
der HP Website unter (http://www.hp.com/go/selfrepair).  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar  
(Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor  
flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase  
de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación  
puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente  
directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria.  
Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo  
de los gastos de desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin  
embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales,  
dependiendo del tipo de servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario.  
Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de  
servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican  
con la palabra "No" en el catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que  
lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede  
solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia  
técnica, puede llamar al Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte  
de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará  
si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea  
necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado,  
Reparaciones del propio cliente  
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normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda  
la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso  
requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve  
a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y  
escogerá la empresa de transporte que se utilice para dicho servicio.  
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP,  
póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para  
Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur  
tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen  
groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP  
(of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met  
een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel  
daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt  
deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon  
in rekening gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen  
zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen  
voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk  
van het type garantieservice voor het product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In  
verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service  
Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus  
aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering  
op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten  
worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt  
u een HP Service Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt  
in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet  
worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u  
het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren  
aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd  
in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP  
u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt  
HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke  
koerier/transportonderneming hiervoor wordt gebruikt.  
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair  
programma van HP. Informatie over Service Partners vindt u op de HP website  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de  
modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças  
com defeito. Se, durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço  
da HP) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição  
será enviada diretamente ao cliente. Existem duas categorias de peças CSR:  
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Customer self repair  
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Obrigatória Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua  
essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
Opcional Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas  
para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou  
não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao  
produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A  
fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.  
Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia  
útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em  
quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato  
com o Centro de suporte técnico da HP para que um técnico o ajude por telefone. A HP especifica  
nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida  
à HP. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à HP dentro do  
período determinado, normalmente cinco (5) dias úteis. A peça com defeito deve ser enviada  
com a documentação correspondente no material de transporte fornecido. Caso não o faça, a HP  
poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a HP paga todas as despesas  
de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.  
• Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em  
contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da  
Reparo feito pelo cliente  
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12  
Customer self repair  
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2 Illustrated Parts Catalog  
In this section  
Mechanical components  
IMPORTANT: The list of part numbers is current and correct as of the publication of the  
document. Part numbers change often. Check the HP Partsurfer website, http://partsurfer.hp.com/,  
to ensure you have the latest part numbers associated with this server.  
Customer self repair  
Item  
Description  
Access panel  
Front bezel  
Assembly part number Spare part number  
Mandatory1  
1
2
3
4
AH233-2115A  
AH233-2118B  
491715-001  
491209-001  
392613-001  
449433-001  
Mandatory1  
Blank, SAS hard drive 376383-001  
Mandatory1  
Blank, SAS hard drive 443259-001  
bay cover  
Mandatory1  
5
6
6
Blank, media drive  
bay cover  
AH233-2132A  
AH233-2109D  
AH233-3401B  
492134-001  
491104-001  
492132-001  
Mandatory1  
Optional2  
Processor memory  
cell  
Processor memory  
cell bezel  
Mandatory1  
Mechanical components  
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Customer self repair  
Item  
Description  
Assembly part number Spare part number  
Filler, memory air  
AH233-3417A  
491911-001  
Mandatory1  
blocker (DIMM filler)*  
Mezzanine filler*  
AH233-2117E  
AH233-3402A  
491102-001  
492133-001  
Optional2  
Mezzanine filler  
bezel*  
Mandatory1  
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Blank, power supply 440204-001  
Tool, Torx, T-15*  
107473-001  
449433-001  
199630-001  
Mandatory1  
Mandatory1  
*Not shown  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace  
these parts, you will be charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for  
customer self repair. If, however, you require that HP replace them for you, there may or may  
not be additional charges, depending on the type of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer  
warranty, HP requires that an authorized service provider replace the part. These parts are  
identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si  
vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du  
service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces  
sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois,  
si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée,  
selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même  
la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce  
soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le  
Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il  
cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera  
per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque  
di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad  
HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il  
prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del  
cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di  
assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei  
componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt  
werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und  
Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile  
sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von  
HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt  
vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
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3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch  
des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im  
illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es  
obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse  
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional.  
Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin  
embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales,  
dependiendo del tipo de servicio de garantía correspondiente al producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el  
usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor  
de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se  
identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP  
verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze  
onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen  
voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk  
van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband  
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden  
vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met  
"Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP  
substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são  
projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode  
haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado  
ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A  
fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.  
Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.  
Mechanical components  
15  
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Illustrated Parts Catalog  
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IMPORTANT: The list of part numbers is current and correct as of the publication of the  
document. Part numbers change often. Check the HP Partsurfer website, http://partsurfer.hp.com/,  
to ensure you have the latest part numbers associated with this server.  
Assembly part  
number  
Customer self repair  
Item Description  
Spare part number  
1
Power supplies  
Power supply (G5)  
440785-001  
441830-001  
498152-001  
Mandatory1  
Mandatory1  
Power supply (G6) (HP 1200W CS HE 500172-B21  
Power Supply Kit)  
Power supply (G6) (HP Z 1200W 12V 500173-B21  
Hotplug ACC Pwr Supply)  
498152-001  
Mandatory1  
2
Internal hot-plug fan  
Rear hot-plug fan  
AH233-2113A  
AH233-2125A  
491200-001  
491201-001  
Mandatory1  
Mandatory1  
not  
shown  
Boards  
3
SPI assembly (G5)  
AH233-60001  
512020-001  
or  
512020-002  
No3  
SPI assembly (G6)  
512020-002  
491198-001  
449420-001  
491716-001  
491717-001  
491199-001  
491104-001  
No3  
4
5
6
Media module (SID assembly)  
SAS backplane  
AH233-2124A  
013151-001  
Optional2  
Optional2  
No3  
Midplane board  
AH233-60002  
AH233-60003  
AH233-60008  
AH233-2109D  
Mezzanine boardx  
Optional2  
No3  
7
Power supply backplane assembly  
Processor memory cell assemblyx  
(G5)  
Optional2  
Processor memory cell assemblyx  
(G6)  
AH233-2109E  
588797-001  
Optional2  
8
PCIe I/O backplane assembly  
AH233-60009  
AH233-60010  
587976-001  
587977-001  
No3  
No3  
Combo PCIe HTx I/O backplane  
assemblyx  
10  
Media drive options  
DVD/CD-RW drive  
383696-002  
395911-001  
395910-001  
399959-001  
399402-001  
397928-001  
Mandatory1  
Mandatory1  
Mandatory1  
DVD+RW drive, 8x (optional)  
DVD drive, 8/24x  
11  
Processor options  
Heatsink kit, DL785 G5  
AH233-2127A  
491101-001  
448407-001  
Optional2  
Optional2  
AMD Opteron 8360SE 2.5 GHz 105W 448202-001  
replacement kit (G5)  
AMD Opterton 8358SE 2.4 GHz 105W 448202-002  
replacement kit (G5)  
448406-001  
Optional2  
System components  
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Assembly part  
number  
Customer self repair  
Item Description  
Spare part number  
AMD Opteron 8356 2.3 GHz 75W  
448208-001  
448208-002  
509498-001  
500540-001  
500539-001  
448405-001  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
replacement kit (G5)  
AMD Opteron 8354 2.2 GHz 75W  
replacement kit (G5)  
448404-001  
508593-001  
500517-001  
500516-001  
518005-001  
570009-001  
534242-001  
534243-001  
535708-001  
AMD Opteron 8384 2.7 GHz 75W  
replacement kit (G5)  
AMD Opteron 8380 2.5 GHz 75W  
replacement kit (G5)  
AMD Opteron 8378 2.4 GHz 75W  
replacement kit (G5)  
AMD Opteron 8376 HE 2.3 GHz 55W 495647-004  
replacement kit (G5)  
AMD Opteron 8393 SE 3.1 GHz 105W 535363-001  
replacement kit (G5)  
AMD Opteron 8389 2.9 GHz 75W  
replacement kit (G5)  
530520-003  
AMD Opteron 8387 2.8 GHz 75W  
replacement kit (G5)  
530520-002  
AMD Opteron 8381 HE 2.5 GHz 55W 530531-002  
replacement kit (G5)  
AMD Opteron 8425 HE 2.1 GHz (G6) 539686-001  
572551-001  
539661-001  
539659-001  
Optional2  
Optional2  
Optional2  
AMD Opteron 8431 2.4 GHz (G6)  
539451-002  
AMD Opteron 8439 SE 2.8 GHz (G6) 539449-001  
12  
Memory  
1 GB, 667 MHz 12 (dual rank)  
2 GB, 667 MHz (dual rank)  
4 GB, 667 MHz (dual rank)  
8 GB, 667 MHz (dual rank)  
405475-051  
405476-051  
405477-061  
495605-B21  
430450-001  
432668-001  
432670-001  
432671-001  
488608-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
1 GB, PC2-5300, Low Power (single 487004-061  
rank)  
2 GB, PC2-5300, Low Power (single 405476-061  
rank)  
430451-001  
487945-001  
Mandatory1  
Mandatory1  
4 GB, PC2-5300, Low Power (dual  
rank)  
487005-061  
4 GB, PC2-6400, Low Power  
504465-061  
504589-001  
501157-001  
501158-001  
Mandatory1  
Mandatory1  
Mandatory1  
2 GB, 800 MHz PC2-6400, (dual rank) 499276-061  
4 GB, 800 MHz PC2-6400, (dual rank) 499277-061  
Hard drivesx  
36 GB 10k single port SAS hard drive 375863-003  
36 GB 15k single port SAS hard drive 418373-006  
36 GB 15k dual port SAS hard drive 418373-002  
376596-001  
432322-001  
418397-001  
Mandatory1  
Mandatory1  
Mandatory1  
18  
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Assembly part  
number  
Customer self repair  
Item Description  
Spare part number  
404785-001  
72 GB 10k SAS single port hard drive 375861-B21  
72 GB 15k single port SAS hard drive 418373-008  
72 GB 10k dual port SAS hard drive 375863-004  
72 GB 15k dual port SAS hard drive 418373-004  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
432321-001  
376597-001  
418398-001  
146 GB 10k single port SAS hard  
drive  
375863-012  
432320-001  
146 GB 10k dual port SAS hard drive 375863-010  
SAS parts  
418399-001  
Mandatory1  
13  
14  
Smart Array cache module 256 MB 012764-004  
405836-001  
398648-001  
Optional2  
Optional2  
Smart Array BBWC battery pack 256 381573-001  
MB  
Cablesx  
Upper fan cable assembly  
Lower fan cable assembly  
Power cable midplane assembly  
Power cable I/O assembly  
Power signal cable assembly  
GPU power cable assembly  
SAS power assembly  
AH233-2001A  
AH233-2002A  
AH233-2003B  
AH233-2004A  
AH233-2005A  
AH233-2006A  
AH233-2008A  
356452-004  
491202-001  
491203-001  
491204-001  
491205-001  
491206-001  
491207-001  
491208-001  
No3  
No3  
No3  
No3  
No3  
Optional2  
Optional2  
CA assembly , CD MULTIBAY,40"  
Cable kit  
None  
449432-001  
No3  
Miscellaneousx  
Battery, 3 V, Lithium  
166899-001  
374503-001  
391222-291  
153099-001  
377839-001  
515763-001  
Mandatory1  
Mandatory1  
Mandatory1  
Rack mount kit, universal  
ac power cord: HP 3.6m  
C19-NEMA515P JP  
xNot shown  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace  
these parts, you will be charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for  
customer self repair. If, however, you require that HP replace them for you, there may or may  
not be additional charges, depending on the type of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer  
warranty, HP requires that an authorized service provider replace the part. These parts are  
identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si  
vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du  
service vous seront facturés.  
System components  
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2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces  
sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois,  
si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée,  
selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même  
la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce  
soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le  
Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il  
cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera  
per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque  
di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad  
HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il  
prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del  
cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di  
assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei  
componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt  
werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und  
Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile  
sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von  
HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt  
vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch  
des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im  
illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es  
obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse  
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional.  
Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin  
embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales,  
dependiendo del tipo de servicio de garantía correspondiente al producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el  
usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor  
de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se  
identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP  
verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze  
onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen  
voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk  
van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband  
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden  
vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met  
"Nee".  
20  
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1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP  
substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são  
projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode  
haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado  
ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A  
fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.  
Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.  
System components  
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3 Removal and replacement procedures  
In this section  
Required tools  
You need the following items for some removal and replacement procedures:  
Torx T-15 screwdriver (provided with the server, see “Rear panel components” (page 68))  
Phillips screwdriver  
Flathead screwdriver  
Diagnostics Utility  
Safety considerations  
Before performing service procedures, review the following safety information.  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting  
up the system and handling parts. A discharge of static electricity from a finger or other conductor  
can damage system boards or other static-sensitive devices. This type of damage can reduce the  
life expectancy of the server, component or port.  
Required tools  
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To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free  
workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Server warnings and cautions  
Before installing a server, be sure that you understand the following warnings and cautions.  
WARNING! To reduce the risk of electric shock or damage to the equipment:  
Do not disable the power cord grounding plug. The grounding plug is an important safety  
feature.  
Plug the power cord into a grounded electrical outlet that is easily accessible at all times.  
Unplug the power cord from the power supply to disconnect power to the equipment.  
Do not route the power cord where it can be walked on or pinched by items placed against  
it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends  
from the server.  
WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
Preparation procedures  
To access some components and perform certain service procedures, you must perform one or  
more of the following procedures:  
If you must remove a server from a rack or remove a non-hot-plug component from a server,  
first power down the server.  
If you are performing service procedures in an HP, Compaq branded, telco, or third-party  
rack, you can use the locking feature of the rack rails to support the server and gain access  
to internal components.  
For more information about telco rack solutions, refer to the RackSolutions.com website  
If the rack environment, cabling configuration, or server location in the rack creates awkward  
conditions, remove the server from the rack.  
If you are servicing internal components, remove the access panel.  
24  
Removal and replacement procedures  
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Power down the server  
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.  
To power down the server:  
1. Shut down the OS as directed by the OS documentation.  
2. Press the Power On/Standby button to place the server in standby mode. When the server  
enters standby power mode, the system power LED changes to amber.  
3. Disconnect the power cords.  
The system is now without power.  
WARNING! To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some  
internal circuitry remain active until ac power is removed.  
Extending the server from the rack  
The design of the server enables you to access several components through the front of the server.  
Installing or accessing the following components will not require extending the server from the  
rack:  
Processors  
Processor memory cell  
DIMMs  
DVD or CD drive  
Hard drives  
WARNING! To reduce the risk of personal injury or equipment damage, be sure that the rack  
is adequately stabilized before extending a component from the rack.  
To extend the server from the rack:  
1. Pull down the quick-release levers on each side of the server to release the server from the  
rack.  
2. Extend the server on the rack rails until the server rail-release latches engage.  
Preparation procedures  
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NOTE: The release latches will lock into place when the rails are fully extended.  
WARNING! To reduce the risk of personal injury, be careful when pressing the server  
rail-release latches and sliding the server into the rack. The sliding rails could pinch your  
fingers.  
3. After performing the installation or maintenance procedure, slide the server into the rack  
by pressing the server rail-release latches.  
Removing the server from the rack  
To remove the server from an HP, Compaq branded, telco, or third-party rack:  
1. Power down the server, see “Power down the server” (page 25).  
2. Disconnect the cabling from the server.  
3. Extend the server from the rack, see “Extending the server from the rack” (page 25).  
4. Remove the server from the rack. For more information, refer to the documentation that  
ships with the rack mounting option.  
26  
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5. Place the server on a sturdy, level surface.  
Removing the access panel  
WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
To remove the access panel:  
1. Extend the server from the rack (“Extending the server from the rack” (page 25)).  
2. If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch.  
NOTE: The T-15 Torx screwdriver is shipped with the server and can be located on the  
3. Lift up on the hood latch and remove the access panel.  
Preparation procedures  
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4. After installing hardware options, replace the access panel. Be sure that the panel is securely  
locked into place before powering up the server.  
Media module (SID assembly)  
To remove the media module:  
1. Power down the server (“Power down the server” (page 25)).  
2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Disconnect all cabling from the media module.  
5. Press the media module release latch.  
6. Pull the media module away from the server.  
To replace the component, reverse the removal procedure.  
28  
Removal and replacement procedures  
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NOTE: The release latch does not need to be pressed to reinsert the media module.  
Front Bezel  
To remove the front bezel:  
1. Power down the server (“Power down the server” (page 25)).  
2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
3. Remove processor memory cell 1 (“Processor memory cell” (page 29)).  
4. Remove the serial number tag.  
5. Remove the eight screws (four on each side) that secure the bezel to the server.  
6. Hold the top two corners of the bezel and pull the bezel away from the server until the two  
soft release tabs under the hard drive cage release.  
7. Hold open the release latches at the bottom corners of the bezel.  
8. Slide the bezel to the right to release it from the tabs on the bottom corners of the chassis  
and pull it away from the server.  
Reverse the procedure to replace the front bezel.  
Mezzanine filler  
To remove the mezzanine filler:  
1. Power down the server (“Power down the server” (page 25)).  
2. Press the release button.  
3. Open the lever.  
4. Grasp the lever and slide the mezzanine filler from the enclosure. Place a hand under the  
component to support it as you remove it from the enclosure.  
To replace the mezzanine filler reverse the procedure.  
IMPORTANT: If replacing the mezzanine filler with a new mezzanine filler, the mezzanine  
board must be moved to the new mezzanine filler (see “Mezzanine board” (page 29)).  
Mezzanine filler bezel  
To remove the mezzanine filler bezel:  
1. Power down the server (“Power down the server” (page 25)).  
2. Pull out the mezzanine filler enough to access the bezel (“Mezzanine filler” (page 29)).  
3. Press the two release tabs and remove the component.  
To replace the mezzanine filler bezel reverse the procedure.  
Mezzanine board  
To remove the mezzanine board:  
1. Power down the server (“Power down the server” (page 25)).  
2. Remove the mezzanine filler (“Mezzanine filler” (page 29)).  
3. Use a T-15 Torx screwdriver to remove the six screws holding the mezzanine board to the  
mezzanine filler.  
To replace the mezzanine board reverse the procedure.  
Processor memory cell  
To remove the processor memory cell:  
Front Bezel  
29  
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1. Power down the server (“Power down the server” (page 25)).  
2. Press the release button.  
3. Open the lever.  
4. Grasp the lever and slide the processor memory cell from the enclosure. Place a hand under  
the component to support it as you remove it from the enclosure.  
CAUTION: Always place the processor memory cell on a flat, level, antistatic surface when  
working with the component.  
To replace the processor memory cell reverse the procedure.  
Processor memory cell bezel  
To remove the processor memory cell bezel:  
1. Power down the server (“Power down the server” (page 25)).  
2. Pull out the processor memory cell enough to access the bezel (“Processor memory cell”  
3. Press the back of the bezel, slide it upward, and remove the component.  
To replace the component, reverse the removal procedure.  
Processor memory cell airflow baffle  
To remove the processor memory cell airflow baffle:  
1. Power down the server (“Power down the server” (page 25)).  
2. Remove the processor memory cell (“Processor memory cell” (page 29)).  
3. Press the two airflow baffle release tabs, pivot the airflow baffle up, and remove the  
component.  
To replace the component, reverse the removal procedure.  
Processors  
The server supports a four- or eight-processor configuration.  
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CAUTION: The cell filler is required to be place in cells 3 – 6 in a four-processor configuration.  
CAUTION: Before starting this procedure, read the information about protecting against  
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor  
configurations must contain processors with the same part number.  
CAUTION: All supported AMD Opteron quad-core processors 3.1 GHz or greater and all  
supported AMD Opteron six-core processors require the system maintenance switch, located on  
the I/O backplane, (SW1) position 5 to be in the On position.  
HP recommends updating to the latest version of firmware. Earlier firmware versions might not  
validate the required switch setting for these processors.  
NOTE: Six-core AMD Opteron Processors might show a 1 MB reduction in available L3 cache  
when performance enhancing HT Assist is enabled because HT Assist requires 1MB of L3 cache  
per CPU to operate.  
To replace a processor:  
1. Power down the server (“Power down the server” (page 25)).  
2. Remove the processor memory cell (“Processor memory cell” (page 29)).  
3. Remove the processor memory cell airflow baffle (“Processor memory cell airflow baffle”  
WARNING! To reduce the risk of personal injury from hot surfaces, allow the heatsink to  
cool before touching it.  
4. Open the heatsink retaining bracket.  
Processors  
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5. Remove the heatsink.  
6. Open the processor retaining latch and the processor socket retaining bracket.  
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7. Using your fingers, remove the failed processor.  
8. If the processor has separated from the installation tool, carefully reinsert the processor in  
the tool.  
IMPORTANT: Be sure the replacement processor remains inside the processor installation  
tool.  
9. Align the processor installation tool with the socket and install the spare processor.  
CAUTION: The processor is designed to fit one way into the socket. Use the alignment  
guides on the processor and socket to properly align the processor with the socket.  
10. Press down firmly until the processor installation tool clicks and separates from the processor,  
then remove the processor installation tool.  
Processors  
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11. Close the processor retaining latch and the processor socket retaining bracket.  
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12. Clean the old thermal grease from the heatsink with an alcohol swab. Allow the alcohol to  
evaporate before continuing.  
13. Apply all the new grease to the top of the processor in one of the following patterns to ensure  
even distribution.  
14. Install the heatsink.  
15. Close the heatsink retaining bracket.  
16. Replace the processor memory airflow baffle.  
Processors  
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17. Install the processor memory cell into the server.  
18. Power up the server.  
DIMMs  
Each processor memory cell can hold two to eight DIMMs, At least one pair of DIMMs must be  
installed in slots 1A and 2A on each processor memory cell to operate the server. The following  
DDR2 667-MHz DIMM sizes are supported:  
1 GB  
2 GB  
4 GB  
8 GB  
Number of processors  
Minimum memory  
Maximum memory  
4
8
8 GB (eight 1-GB DIMMS)  
16 GB (16 1-GB DIMMS)  
256 GB (32 8-GB DIMMS)  
512 GB (64 8-GB DIMMS)  
Observe the following DIMM installation guidelines to add additional memory to the server:  
DIMMs must be installed in pairs.  
DIMM installed on the same memory bank (DIMM pairs) must have the same part number.  
DIMMs installed in different memory banks can be of different sizes.  
A minimum of two DIMMs must be installed per processor memory cell.  
DIMM pairs must be installed evenly across processor memory cells.  
DIMMs must be installed in decreasing capacity with the largest DIMMs installed in the  
banks furthest away from each processor.  
NOTE: If all four banks on a memory node are populated, the maximum memory clock  
speed is 533 MHz. If two or fewer banks on a memory node are populated, the maximum  
memory clock speed is 677 MHz.  
CAUTION: DIMM fillers are required to cover pairs of empty DIMM slots.  
To remove a DIMM:  
1. Power down the server (“Power down the server” (page 25)).  
2. Remove the processor memory cell (“Processor memory cell” (page 29)).  
3. Remove the processor memory cell airflow baffle (“Processor memory cell airflow baffle”  
4. Open the DIMM slot latches.  
5. Remove the DIMM.  
To replace the component, reverse the removal procedure.  
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SAS hard drive blank  
To remove a SAS hard drive blank:  
1. Squeeze the tabs on the front of the filler to release it from the slot in the drive bay.  
2. Pull gently until the filler slides out of the chassis.  
SAS hard drives  
CAUTION: Always power down the server if the boot partition resides on the drive you are  
replacing or if you are replacing the only drive in the server.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove a SAS hard drive:  
1. Determine the status of the hard drive from the hot-plug hard drive LEDs (“SAS and SATA  
2. Back up all data on the hard drive.  
3. Remove the hard drive.  
SAS hard drive blank  
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To replace the component, reverse the removal procedure.  
DVD, CD drive or blank  
To remove a DVD, CD drive or blank:  
1. Power down the server (“Power down the server” (page 25)).  
2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Remove the media module (“Media module (SID assembly)” (page 28)).  
5. Lift the DVD release tab on the left side of the media module and push the drive out from  
the rear.  
To replace the component, reverse the removal procedure.  
Power supply blank  
To remove a power supply blank, squeeze the thumb lever and pull the power supply blank out  
of the server.  
To replace the component, reverse the removal procedure.  
Power supply  
The server supports three or six hot-plug power supplies. Six are required to provide 3+3  
redundant power to the system in the event of a failure in a primary power supply. You can  
install or replace a redundant hot-plug power supply without powering down the server.  
WARNING! To reduce the risk of electric shock, do not disassemble the power supply or attempt  
to repair it. Replace it only with the specified replacement part.  
CAUTION: If only three power supply are installed, do not remove a power supply unless the  
server has been powered down. Removing a primary operational power supply causes an  
immediate power loss to the server.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
IMPORTANT: For maximum server availability, be sure that the primary and redundant power  
supplies are powered by separate ac power sources.  
See “Power supply LED” (page 70) for information on the current status of the power supply.  
To remove a power supply:  
1. Disconnect the power cord from the power supply.  
2. Press the thumb lever.  
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3. Remove the power supply.  
To replace the component, reverse the removal procedure.  
Hot-plug fans  
The server supports redundant hot-plug fans, each with two individual fans rotors, in a 5+1  
configuration to provide proper airflow to the server. The airflow strategy contains two thermal  
zones with three fan units in the bottom zone (accessed from the server rear), and three fan units  
in the upper zone (accessed internally). See “Fan locations” (page 75).  
WARNING! To prevent personal injury from hazardous energy:  
Remove watches, rings, or other metal objects.  
Use tools with insulated handles.  
Do not place tools or metal parts on top of batteries.  
Rear accessed hot-plug fans  
To replace a rear accessed hot-plug fan:  
1. Identify the failed fan by locating an amber LED on the Systems Insight Display.  
Hot-plug fans  
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2. Pull on the fan tray release bar, pull the fan housing unit straight out from the rear of the  
chassis until it stops, and tilt the tray down to expose the fan housing unit.  
3. Insert your thumb and forefinger into the openings on the top of the fan and squeeze until  
the fan releases from the socket.  
4. Pull the fan straight up and out of the chassis.  
IMPORTANT: Remove and replace only one fan at a time. If the system detects two fan  
failures, the server shuts down to avoid thermal damage.  
5. Install a new hot-plug fan.  
CAUTION: To prevent server components from overheating, replace a fan within 20 seconds.  
Failure to observe this caution results in the server automatically shutting down to prevent  
an overtemperature condition.  
NOTE: The fan unit is keyed to fit into the fan housing in the correct orientation only.  
6. Push the fan housing unit toward the front of the chassis until it clicks into place.  
7. Check the Systems Insight Display LED that corresponds to the replaced fan unit.  
NOTE: It can take up to ten seconds after installation for the Systems Insight Display fan  
LED to turn off.  
If the front panel internal system health LED is not green after you install hot-plug fans,  
reseat the hot-plug fan or refer to the troubleshooting section.  
Internally accessed hot-plug fans  
To replace an internally accessed hot-plug fan:  
1. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
2. Remove the access panel (“Removing the access panel” (page 27)).  
3. Identify the failed fan by it the lit LED on the Systems Insight Display.  
4. Insert thumb and forefinger into the openings on the top of the fan and squeeze until the  
fan releases from the socket.  
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5. Pull the fan straight up and out of the chassis.  
IMPORTANT: Remove and replace only one fan at a time. If the system detects two fan  
failures, the server shuts down to avoid thermal damage.  
6. Install a new hot-plug fan.  
CAUTION: To prevent server components from overheating, replace a fan within 20 seconds.  
Failure to observe this caution results in the server automatically shutting down to prevent  
an overtemperature condition.  
NOTE: The fan unit is keyed to fit into the fan housing in the correct orientation only.  
7. Check the Systems Insight Display LED that corresponds to the replaced fan unit.  
NOTE: It can take up to ten seconds after installation for the Systems Insight Display fan  
LED to turn off.  
If the front panel internal system health LED is not green after you install hot-plug fans,  
reseat the hot-plug fan or refer to the troubleshooting section.  
8. Replace the access panel.  
9. Slide the server into the rack.  
Expansion slot covers  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all expansion slots have either an expansion slot cover or an expansion board installed.  
To remove an expansion slot cover:  
1. Power down the server (“Power down the server” (page 25)).  
2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Open the latch and remove the expansion slot cover.  
Expansion slot covers  
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To replace the component, reverse the removal procedure.  
Expansion boards  
PCIe I/O backplane  
Item  
Description  
1
2
3
4
5
6
7
PCI Express x8 non-hot-plug expansion slot 11  
PCI Express x16 non-hot-plug expansion slot 10  
PCI Express x8 non-hot-plug expansion slot 9  
PCI Express x16 non-hot-plug expansion slot 8  
PCI Express x4 non-hot-plug expansion slot 7  
PCI Express x4 non-hot-plug expansion slot 6  
PCI Express x16 non-hot-plug expansion slot 5  
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PCIe I/O backplane  
Item  
8
Description  
PCI Express x4 non-hot-plug expansion slot 4  
PCI Express x4 non-hot-plug expansion slot 3  
PCI Express x4 non-hot-plug expansion slot 2  
PCI Express x8 non-hot-plug expansion slot 1  
9
10  
11  
Combo PCIe/HTx I/O backplane  
Item  
1
Description  
Blank slot  
2
HyperTransport non-hot-plug expansion slot 9  
Blank slot  
3
4
HyperTransport non-hot-plug expansion slot 8  
PCI Express x4 non-hot-plug expansion slot 7  
PCI Express x4 non-hot-plug expansion slot 6  
PCI Express x16 non-hot-plug expansion slot 5  
PCI Express x4 non-hot-plug expansion slot 4  
PCI Express x4 non-hot-plug expansion slot 3  
PCI Express x4 non-hot-plug expansion slot 2  
PCI Express x8 non-hot-plug expansion slot 1  
5
6
7
8
9
10  
11  
IMPORTANT: Install high powered graphics cards in PCIe 16x slots for optimum performance.  
The server can power a maximum of four auxiliary high powered graphics card power  
connections.  
To remove a non-hot-plug expansion board:  
1. Power down the server (“Power down the server” (page 25)).  
Expansion boards  
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2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Disconnect any internal or external cables attached to the expansion board.  
5. Push and hold the spring loaded latch to the side of the server, and lift up on the hinge.  
6. Unlock the retaining clip (for full-length expansion boards).  
7. Remove the board from the server.  
To replace the component, reverse the removal procedure.  
SAS backplane  
To remove the SAS backplane:  
1. Power down the server (“Power down the server” (page 25)).  
2. Remove all the hard drives (“SAS hard drives” (page 37)).  
3. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
4. Remove the access panel (“Removing the access panel” (page 27)).  
5. Disconnect all cables from the SAS backplane.  
6. Slide the retaining bracket to the front of the server.  
7. Lift the backplane, slide the board over the anchoring pins, and, tilting the board, lift it out  
of the server.  
To replace the component, reverse the removal procedure.  
Battery-backed write cache procedures  
Three procedures are provided for the BBWC option:  
Removal and replacement of failed components:  
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CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching  
the cable causes any unsaved data in the cache module to be lost.  
Removing the cache module  
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED  
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds,  
do not remove the cable from the cache module. The cache module is backing up data, and data  
is lost if the cable is detached.  
1. Power down the server (“Power down the server” (page 25)).  
2. Extend the server from the rack (“Extending the server from the rack” (page 25)).  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. If the existing cache is connected to a battery, observe the BBWC Status LED (“Battery pack  
If the LED is blinking every two seconds, data is still trapped in the cache. Restore  
system power and repeat the previous steps.  
If the LED is not lit, disconnect the battery cable from the cache.  
5. Remove the cache module from the controller.  
To replace the component, reverse the removal procedure.  
Removing the BBWC battery pack  
1. Power down the server (“Power down the server” (page 25)).  
2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
Battery-backed write cache procedures  
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3. Remove the access panel (“Removing the access panel” (page 27)).  
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or  
remove the battery pack while an array capacity expansion, RAID level migration, or stripe  
size migration is in progress.  
CAUTION: After the server is powered down, wait 15 seconds and then check the amber  
LED before unplugging the cable from the cache module. If the amber LED blinks after 15  
seconds, do not remove the cable from the cache module. The cache module is backing up  
data, and data is lost if the cable is detached.  
4. Remove the BBWC battery pack.  
5. Disconnect the cable from the cache module only if the battery pack is not being used to  
recover data from the server or transfer data to another server.  
CAUTION: Detaching the cable that connects the battery pack to the cache module while  
it is being used to recover data from the server or transfer data to another server causes any  
unsaved data in the cache module to be lost.  
To replace the component, reverse the removal procedure.  
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IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST  
error message displays when the server is powered up, indicating that the battery pack is  
temporarily disabled. No action is necessary. The internal circuitry automatically recharges the  
batteries and enables the battery pack. This process can take up to four hours. During this time,  
the cache module functions properly, but without the performance advantage of the battery  
pack.  
NOTE: The data protection and the time limit also apply if a power outage occurs. When power  
is restored to the system, an initialization process writes the preserved data to the hard drives.  
Recovering data from the battery-backed write cache  
If the server fails, you can recover any data temporarily trapped in the BBWC by using the  
following procedure.  
CAUTION: Before starting this procedure, read the information about protecting against  
1. Perform one of the following tasks:  
Set up a recovery server station using an identical server model. Do not install any  
internal drives or BBWC in this server. (This is the preferred option.)  
Find a server that has enough empty drive bays to accommodate all the drives from  
the failed server and that meets all the other requirements for drive and array migration.  
2. Power down the failed server. If any data is trapped in the cache module, an amber LED on  
the module blinks every 15 seconds.  
CAUTION: Do not detach the cable that connects the battery pack to the cache module.  
Detaching the cable causes any unsaved data in the cache module to be lost.  
3. Transfer the hard drives from the failed server to the recovery server station.  
4. Remove the BBWC module (“Removing the cache module” (page 45)) and battery pack  
5. Perform one of the following tasks:  
Install the BBWC into an empty BBWC DIMM socket on the system board of the recovery  
server.  
Install the BBWC into an empty BBWC DIMM socket on any Smart Array Controller  
in the recovery server.  
6. Power up the recovery server. A 1759 POST message displays, stating that valid data was  
flushed from the cache. This data is now stored on the drives in the recovery server. You  
can now transfer the drives (and controller, if one was used) to another server.  
Power supply backplane  
To remove the power supply backplane:  
1. Power down the server (“Power down the server” (page 25)).  
2. Remove the server from the rack (“Removing the server from the rack” (page 26)).  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Remove all power supplies (“Power supply” (page 38)).  
5. Disconnect all cables from the power supply backplane.  
6. Slide the retaining bracket to the rear of the server.  
7. Lift the backplane, slide the board over the anchoring pins, and lift the board straight out  
of the server.  
Power supply backplane  
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To replace the component, reverse the removal procedure.  
SPI (core I/O) board  
The System Peripheral Interconnect (SPI) board implements all the logic to support the internal  
devices and the standard connectivity of the product. The board includes a RAID5 SAS controller  
which supports up to eight of the sixteen embedded SAS disk drives.  
CAUTION: Only authorized technicians trained by HP should attempt to remove the SPI board.  
If you believe the SPI board requires replacement, contact HP Technical Support before  
proceeding.  
The procedures for removing and replacing the SPI board are the same as other expansion boards.  
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server serial  
Re-entering the server serial number and product ID  
After you replace the SPI board, you must re-enter the server serial number and the product ID.  
1. During the server startup sequence, press F9 to access RBSU.  
2. Select the Advanced Options menu.  
3. Select Serial Number. The following warning displays:  
Warning: The serial number should ONLY be modified by qualified service personnel. This value should always  
match the serial number located on the chassis.  
4. Press Enter to clear the warning.  
5. Enter the serial number.  
6. Select Product ID. The following warning displays:  
Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always  
match the Product ID located on the chassis.  
7. Enter the product ID and press Enter.  
8. Press Escape to close the menu.  
9. Press Escape to exit RBSU.  
10. Press F10 to confirm exiting RBSU. The server automatically reboots.  
System battery  
CAUTION: Before starting this procedure, read the information about protecting against  
If the server no longer automatically displays the correct date and time, you might need to replace  
the battery that provides power to the real-time clock. Under normal use, battery life is five to  
ten years.  
WARNING! The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare battery designated for this product.  
To remove the battery:  
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1. Power down the server (“Power down the server” (page 25)).  
2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Locate the battery on the SPI board (“SPI board components” (page 72)).  
5. Remove the battery.  
To replace the component, reverse the removal procedure.  
Run the RBSU to configure the server after replacing the battery. For more detailed information  
see the HP ROM-Based Setup Utility User Guide on the Documentation CD.  
I/O backplane assembly  
To remove the I/O backplane assembly:  
1. Power down the server (“Power down the server” (page 25)).  
2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Disconnect all cables.  
5. Remove all expansion boards and the SPI board (“Expansion boards” (page 42)  
6. Slide the latch to unlock the release lever.  
7. Pull up on the release lever to disengage the I/O backplane assembly from the midplane  
board.  
I/O backplane assembly  
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8. Pull the I/O backplane assembly out of the chassis.  
To replace the component, reverse the removal procedure.  
Midplane board  
CAUTION: Before starting this procedure, read the information about protecting against  
TIP: HP recommends troubleshooting the system using port 85 codes before replacing the  
codes and troubleshooting procedures.  
To remove the midplane board:  
1. Power down the server (“Power down the server” (page 25)).  
2. Remove the server from the rack (“Removing the server from the rack” (page 26)).  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Remove all processor memory cells (“Processor memory cell” (page 29)).  
5. Remove the cell filler (“Mezzanine filler” (page 29)).  
6. Remove the I/O backplane assembly (“I/O backplane assembly” (page 49)).  
7. Disconnect the cables from the midplane board.  
8. Use a T-15 Torx screwdriver to remove the three screws securing the midplane board to the  
chassis.  
9. Slide the midplane board to the right, over the anchoring pins.  
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CAUTION: When removing the midplane board do not allow the lower connectors to touch  
the chassis. Allowing the midplane board connectors to touch the chassis can damage the  
board.  
10. Tilt the board to avoid contact between the lower connectors and the chassis, and pull the  
board out through the front of the server.  
To replace the component, reverse the removal procedure.  
Midplane board  
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4 Diagnostic tools  
In this section  
SmartStart software  
SmartStart is a collection of software that optimizes single-server setup, providing a simple and  
consistent way to deploy server configuration. SmartStart has been tested on many ProLiant  
server products, resulting in proven, reliable configurations.  
SmartStart assists the deployment process by performing a wide range of configuration activities,  
including:  
Configuring hardware using embedded configuration utilities, such as RBSU and ORCA  
Preparing the system for installing "off-the-shelf" versions of leading operating system  
software  
Installing optimized server drivers, management agents, and utilities automatically with  
every assisted installation  
Testing server hardware using the Insight Diagnostics Utility (“HP Insight Diagnostics”  
Installing software drivers directly from the CD. With systems that have internet connection,  
the SmartStart Autorun Menu provides access to a complete list of ProLiant system software.  
Enabling access to the Array Configuration Utility, Array Diagnostic Utility, and Erase  
Utility  
SmartStart is included in the HP ProLiant Essentials Foundation Pack. For more information  
about SmartStart software, refer to the HP ProLiant Essentials Foundation Pack or the HP website  
SmartStart Scripting Toolkit  
The SmartStart Scripting Toolkit is a server deployment product that delivers an unattended  
automated installation for high-volume server deployments. The SmartStart Scripting Toolkit is  
designed to support ProLiant BL, ML, and DL servers. The toolkit includes a modular set of  
utilities and important documentation that describes how to apply these new tools to build an  
automated server deployment process.  
Using SmartStart technology, the Scripting Toolkit provides a flexible way to create standard  
server configuration scripts. These scripts are used to automate many of the manual steps in the  
SmartStart software  
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server configuration process. This automated server configuration process cuts time from each  
server deployed, making it possible to scale server deployments to high volumes in a rapid  
manner.  
For more information, and to download the SmartStart Scripting Toolkit, refer to the HP website  
HP Instant Support Enterprise Edition  
ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and  
devices, a feature of HP support. ISEE provides continuous hardware event monitoring and  
automated notification to identify and prevent potential critical problems. Through remote  
diagnostic scripts and vital system configuration information collected about your systems, ISEE  
enables fast restoration of your systems. Install ISEE on your systems to help mitigate risk and  
prevent potential critical problems.  
For more information on ISEE, refer to the HP website  
To download HP ISEE, visit the HP website  
For installation information, refer to the HP ISEE Client Installation and Upgrade Guide  
Option ROM Configuration for Arrays  
Before installing an operating system, you can use the ORCA utility to create the first logical  
drive, assign RAID levels, and establish online spare configurations.  
The utility also provides support for the following functions:  
Reconfiguring one or more logical drives  
Viewing the current logical drive configuration  
Deleting a logical drive configuration  
Setting the controller to be the boot controller  
If you do not use the utility, ORCA will default to the standard configuration.  
For more information regarding array controller configuration, refer to the controller user guide.  
For more information regarding the default configurations that ORCA uses, refer to the HP  
ROM-Based Setup Utility User Guide on the Documentation CD.  
HP ROM-Based Setup Utility  
RBSU, an embedded configuration utility, performs a wide range of configuration activities that  
may include:  
Configuring system devices and installed options  
Enabling and disabling system features  
Displaying system information  
Selecting the primary boot controller  
Configuring memory options  
Language selection  
For more information on RBSU, refer to the HP ROM-Based Setup Utility User Guide on the  
Documentation CD or the HP website (http://www.hp.com/support/smartstart/  
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ROMPaq utility  
The ROMPaq utility enables you to upgrade the system firmware (BIOS) or Lights-Out 100  
firmware. To upgrade the firmware, insert a ROMPaq diskette into the diskette drive or ROMPaq  
USB Key into an available USB port and boot the system.  
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available  
ROM revisions.  
For more information about the ROMPaq utility, refer to the HP website (http://www.hp.com/  
System Online ROM flash component utility  
The Online ROM Flash Component Utility enables system administrators to efficiently upgrade  
system or controller ROM images across a wide range of servers and array controllers. This tool  
has the following features:  
Works offline and online  
Supports Microsoft®Windows NT®, Windows® 2000, Windows Server2003, Novell  
Netware, and Linux operating systems  
IMPORTANT: This utility supports operating systems that may not be supported by the  
server. For operating systems supported by the server, refer to the HP website  
Integrates with other software maintenance, deployment, and operating system tools  
Automatically checks for hardware, firmware, and operating system dependencies, and  
installs only the correct ROM upgrades required by each target server  
To download the tool and for more information, refer to the HP website  
Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps  
each event with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within Survey Utility  
From within operating system-specific IML viewers  
For NetWare: IML Viewer  
For Windows®: IML Viewer  
For Linux: IML Viewer Application  
From within the iLO 2 user interface  
From within HP Insight Diagnostics (“HP Insight Diagnostics” (page 56))  
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation  
Pack.  
Integrated Lights-Out 2 technology  
The iLO 2 subsystem is a standard component of selected ProLiant servers that provides server  
health and remote server manageability. The iLO 2 subsystem includes an intelligent  
microprocessor, secure memory, and a dedicated network interface. This design makes iLO 2  
independent of the host server and its operating system. The iLO 2 subsystem provides remote  
ROMPaq utility  
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access to any authorized network client, sends alerts, and provides other server management  
functions.  
Using iLO 2, you can:  
Remotely power up, power down, or reboot the host server.  
Send alerts from iLO 2 regardless of the state of the host server.  
Access advanced troubleshooting features through the iLO 2 interface.  
Diagnose iLO 2 using HP SIM through a web browser and SNMP alerting.  
For more information about iLO 2 features, refer to the iLO 2 documentation on the Documentation  
CD or on the HP website (http://www.hp.com/servers/lights-out).  
Automatic Server Recovery  
ASR is a feature that causes the system to restart when a catastrophic operating system error  
occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts  
when the System Management driver, also known as the Health Driver, is loaded. When the  
operating system is functioning properly, the system periodically resets the timer. However,  
when the operating system fails, the timer expires and restarts the server.  
ASR increases server availability by restarting the server within a specified time after a system  
hang or shutdown. At the same time, the HP SIM console notifies you by sending a message to  
a designated pager number that ASR has restarted the system. You can disable ASR from the  
HP SIM console or through RBSU.  
HP Systems Insight Manager  
HP SIM is a web-based application that allows system administrators to accomplish normal  
administrative tasks from any remote location, using a web browser. HP SIM provides device  
management capabilities that consolidate and integrate management data from HP and third-party  
devices.  
IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for  
processors, SAS and SCSI hard drives, and memory modules.  
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation  
Pack or the HP SIM website (http://www.hp.com/go/hpsim).  
HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online  
versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators  
who verify server installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing  
while the OS is not running. To run this utility, launch the SmartStart CD.  
HP Insight Diagnostics Online Edition is a web-based application that captures system  
configuration and other related data needed for effective server management. Available in  
Microsoft® Windows® and Linux versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, refer to the HP website  
USB support  
HP provides both standard USB support and legacy USB support. Standard support is provided  
by the operating system through the appropriate USB device drivers. HP provides support for  
USB devices before the operating system loads through legacy USB support, which is enabled  
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by default in the system ROM. HP hardware supports USB version 1.1 or 2.0, depending on the  
version of the hardware.  
Legacy USB support provides USB functionality in environments where USB support is normally  
not available. Specifically, HP provides legacy USB functionality for:  
POST  
RBSU  
Diagnostics  
DOS  
Operating environments which do not provide native USB support  
For more information on ProLiant USB support, refer to the HP website  
Troubleshooting the system using port 85 codes  
For example, if the port 85 code displays "31h," see “Processor-related port 85 codes” (page 57)  
for more information.  
Port 85 code  
Description  
3xh  
Port 85 codes in this format indicate processor-related  
for more information.  
4xh  
Port 85 codes in this format indicate memory-related  
more information.  
6xh  
Port 85 codes in this format indicate expansion  
board-related errors. See “Expansion board-related port  
85 codes” (page 58) for more information.  
All other codes, including 00h, 01h, and 5xh  
Port 85 codes in this range cover several areas. See  
information.  
Processor-related port 85 codes  
Processor-related port 85 codes Processor-related port 85 codes display in the format 3xh.  
IMPORTANT: Reboot the server after completing each numbered step. If the error condition  
continues, proceed with the next step.  
To troubleshoot processor-related error codes:  
1. Bring the server to base configuration by removing all components that are not required by  
the server to complete POST. This process can include removing all:  
IMPORTANT: The server requires a minimum of processor memory cells 1, 2, 7, 8 and  
the cell filler populated with the minimum number of processors and DIMMs at all  
times or the server does not function properly.  
Peripheral devices  
2. Reseat the processor in socket 1.  
Troubleshooting the system using port 85 codes  
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3. Reseat the remaining processors, rebooting after each installation to identify any failed  
processors.  
4. Replace the processor in socket 1.  
5. Replace the processor board, if applicable.  
6. Replace the midplane board.  
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server  
Memory-related port 85 codes  
Memory-related port 85 codes display in the format 4xh.  
IMPORTANT: Reboot the server after completing each numbered step. If the error condition  
continues, proceed with the next step.  
To troubleshoot memory-related error codes:  
1. Check the memory LEDs (see “System Insight Display LEDs” (page 64)) for any identified  
errors or failed DIMMs, and take corrective action.  
2. Bring the server to base configuration by removing all components that are not required by  
the server to complete POST. This process can include removing all:  
IMPORTANT: The server requires a minimum of processor memory cells 1, 2, 7, 8 and  
the cell filler populated with the minimum number of processors and DIMMs at all  
times or the server does not function properly.  
Peripheral devices  
3. Reseat the remaining memory boards, rebooting after each installation to isolate any failed  
memory boards, if applicable.  
4. Replace the DIMMs with a remaining bank of memory.  
5. Replace the memory board, if applicable.  
6. Replace the midplane board.  
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server  
Expansion board-related port 85 codes  
Expansion board-related port 85 codes display in the format 6xh.  
IMPORTANT: Reboot the server after completing each numbered step. If the error condition  
continues, proceed with the next step.  
To troubleshoot expansion board-related error codes:  
1. Reseat all expansion boards.  
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2. Bring the server to base configuration by removing all components that are not required by  
the server to complete POST. This process can include removing all:  
IMPORTANT: The server requires a minimum of processor memory cells 1, 2, 7, 8 and  
the cell filler populated with the minimum number of processors and DIMMs at all  
times or the server does not function properly.  
Peripheral devices  
3. Install the expansion boards one at a time, rebooting between each installation to isolate the  
failed expansion board.  
4. Replace the failed expansion board, if applicable.  
5. Replace the PCI riser board, if applicable.  
6. Replace the midplane board.  
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server  
Miscellaneous port 85 codes  
To troubleshoot all other port 85 codes:  
IMPORTANT: Reboot the server after completing each numbered step. If the error condition  
continues, proceed with the next step  
1. Bring the server to base configuration by removing all components that are not required by  
the server to complete POST. This process can include removing all:  
IMPORTANT: The server requires a minimum of processor memory cells 1, 2, 7, 8 and  
the cell filler populated with the minimum number of processors and DIMMs at all  
times or the server does not function properly.  
Peripheral devices  
2. Install each remaining system component, rebooting between each installation to isolate  
any failed components.  
3. Clear the system NVRAM.  
4. Replace the midplane board.  
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server serial  
Troubleshooting the system using port 85 codes  
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Item  
8
Description  
Hard drive bay 3 right  
Hard drive bay 4 right  
Hard drive bay 5 right  
Hard drive bay 6 right  
Hard drive bay 7 right  
Hard drive bay 8 right  
9
10  
11  
12  
13  
not shown Hard drive bay 1 left (optional)  
not shown Hard drive bay 2 left (optional)  
not shown Hard drive bay 3 left (optional)  
not shown Hard drive bay 4 left (optional)  
not shown Hard drive bay 5 left (optional)  
not shown Hard drive bay 6 left (optional)  
not shown Hard drive bay 7 left (optional)  
not shown Hard drive bay 8 left (optional)  
14  
15  
16  
17  
18  
19  
20  
21  
Processor memory cell 1  
Processor memory cell 2  
Processor memory cell 3  
Processor memory cell 4  
Processor memory cell 5  
Processor memory cell 6  
Processor memory cell 7  
Processor memory cell 8  
1
1
1
1
1
Occupied by a cell filler in four-processor servers.  
62  
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Front panel LEDs and buttons  
Item  
Description  
Color  
Status  
1
UID button and LED  
Off  
UID button is not activated  
Solid blue  
UID button is activated for server  
identification  
Flashing blue  
Off  
Server is being remotely managed  
2
3
4
External health LED  
Internal health LED  
NIC 1 LED  
Normal (system is off or in standby  
mode)  
Solid green  
Normal (system is powered on)  
Flashing amber  
Redundant power supply failure  
(system power supply is no longer  
redundant)  
Flashing red  
Off  
Critical power supply failure  
Normal (system is off or in standby  
mode)  
Solid green  
Normal (system is powered on)  
Flashing amber  
System degraded (standby mode or  
powered on)  
Flashing red  
Off  
System critical (standby mode or  
powered on)  
NIC not used  
NOTE: Rear panel NIC can show link  
or activity while in standby mode.  
Solid green  
Linked to the network  
Flashing green  
Linked with activity on the network  
Front panel LEDs and buttons  
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Item  
Description  
Color  
Status  
5
NIC 2 LED  
Off  
NIC not used  
NOTE: Rear panel NIC can show link  
or activity while in standby mode.  
Solid green  
Flashing green  
Off  
Linked to the network  
Linked with activity on the network  
No ac power to the system  
6
Power button and LED  
Solid amber  
System has ac power and is in standby  
mode  
Solid green  
System has ac power and is powered  
on  
System Insight Display LEDs  
The front panel health LEDs indicate only the current hardware status. In some situations, HP  
SIM might report server status differently than the health LEDs because the software tracks more  
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system attributes. The System Insight Display LEDs identify components experiencing an error,  
event, or failure.  
CAUTION: Do not block airflow by pushing the SID flush against the server while it is in the  
down position.  
IMPORTANT: When removing the access panel to view the Systems Insight Display LEDs, leave  
the server powered on. The Systems Insight Display LEDs are cleared when the server is powered  
off.  
NOTE: The system management driver must be installed for the internal system health LED  
to provide pre-failure and warranty conditions.  
LED  
Component  
POWER  
System power  
INT HEALTH  
EXT HEALTH  
TEMP  
Internal component health  
External component health  
Over temperature  
FAN X  
Fan  
PS X  
Power supply  
IO BOARD  
SPI BRD  
I/O backplane power  
SPI board power  
SPI ILK  
SPI board not fully seated into the I/O backplane  
I/O backplane not fully seated into the midplane board  
MP INTERLOCK  
CPU INTERLOCK  
Processor memory board cell 8 (boot CPU) not fully seated into the midplane  
board  
PROCESSOR/MEMORY BOARD X DIMM slot  
DIMM 1A-8D  
System Insight Display LEDs  
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LED  
Component  
PROCESSOR/MEMORY BOARD X Processor  
PROC X  
PROCESSOR/MEMORY BOARD X Processor DIMM board  
BOARD X  
SAS and SATA hard drive LEDs  
Item  
Description  
Color  
Status  
1
Fault/UID LED  
Amber  
Drive failure  
Flashing amber  
Blue  
Fault-process activity  
Unit identification is active  
No fault-process activity  
Drive activity  
Off  
2
Online/activity LED  
Green  
Flashing green  
High activity on the drive or the drive is being  
configured as part of an array  
Off  
No drive activity  
SAS and SATA hard drive LED combinations  
Online/activity LED Fault/UID LED  
(green)  
(amber/blue)  
Interpretation  
On, off, or  
flashing  
Alternating amber The drive has failed, or a predictive failure alert has been received for this  
and blue  
drive; it also has been selected by a management application.  
On, off, or  
flashing  
Solid blue  
The drive is operating normally and has been selected by a management  
application.  
On  
Flashing amber  
(1Hz)  
A predictive failure alert has been received for this drive. Replace the drive  
as soon as possible.  
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Online/activity LED Fault/UID LED  
(green)  
(amber/blue)  
Interpretation  
On  
Off  
The drive is online, but is not currently active.  
Flashing (1 Hz)  
Flashing amber  
(1Hz)  
CAUTION: Do not remove the drive. Removing a drive can terminate the  
current operation and cause data loss.  
The drive is part of an array that is undergoing capacity expansion or stripe  
migration, but a predictive failure alert has been received for this drive. To  
minimize the risk of data loss, do not replace the drive until the expansion  
or migration is complete.  
Flashing (1 Hz)  
Off  
CAUTION: Do not remove the drive. Removing a drive can terminate the  
current operation and cause data loss.  
The drive is rebuilding, or it is part of an array that is undergoing capacity  
expansion or stripe migration.  
Flashing  
irregularly  
Flashing amber  
(1Hz)  
The drive is active, but a predictive failure alert has been received for this  
drive. Replace the drive as soon as possible.  
Flashing  
irregularly  
Off  
The drive is active and is operating normally.  
Off  
Off  
Off  
Solid amber  
A critical fault condition has been identified for this drive and the controller  
has placed it offline. Replace the drive as soon as possible.  
Flashing amber  
(1Hz)  
A predictive failure alert has been received for this drive. Replace the drive  
as soon as possible.  
Off  
The drive is: offline, a spare, or not configured as part of an array.  
Processor memory cell components  
Item  
Description  
1
2
3
4
5
DIMM slot 1A  
DIMM slot 2A  
DIMM slot 3B  
DIMM slot 4B  
DIMM slot 5C  
Processor memory cell components  
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Item  
Description  
6
7
8
9
DIMM slot 6C  
DIMM slot 7D  
DIMM slot 8D  
Processor socket  
Rear panel components  
Item  
1
Description  
NIC connector 1  
2
Keyboard connector  
USB connector  
3
4
Video connector  
5
Serial connector  
6
iLO 2 connector  
7
Mouse connector  
8
NIC connector 2  
9
Power supply 1  
10  
11  
12  
13  
14  
15  
16  
17  
Power supply 2  
Power supply 3  
Redundant power supply 4 (optional)  
Redundant power supply 5 (optional)  
Redundant power supply 6 (optional)  
PCI Express or HTx expansion slots  
T-15 Torx screwdriver  
Fan 4  
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Item  
18  
Description  
Fan 5  
19  
Fan 6  
Rear panel LEDs and buttons  
Item  
Description  
LED Color  
Status  
1
UID  
Solid blue  
Activated  
Flashing blue  
Server remotely managed  
Deactivated  
Off  
2
3
LAN Link LED  
Green  
Linked to network  
Not linked to network  
Network activity  
No network activity  
Off  
LAN Activity LED  
Green (solid or flashing)  
Off  
Rear panel LEDs and buttons  
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Power supply LED  
Color  
Status  
Off  
No ac power  
Blinking green  
Solid green  
Blinking amber  
ac power; standby power on  
Full power on; normal operation  
Power supply failure  
Internal components  
Item  
Description  
1
2
3
Media module  
Fan 3  
Fan 2  
70  
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Item  
4
Description  
Fan 1  
5
System maintenance switch SW6  
System maintenance switch SW1  
SPI Board  
6
7
8
PCI Express x8 non-hot-plug expansion slot 11  
PCI Express x16 non-hot-plug expansion slot 10  
PCI Express x8 non-hot-plug expansion slot 9  
PCI Express x16 non-hot-plug expansion slot 8  
PCI Express x4 non-hot-plug expansion slot 7  
PCI Express x4 non-hot-plug expansion slot 6  
PCI Express x16 non-hot-plug expansion slot 5  
PCI Express x4 non-hot-plug expansion slot 4  
PCI Express x4 non-hot-plug expansion slot 3  
PCI Express x4 non-hot-plug expansion slot 2  
PCI Express x8 non-hot-plug expansion slot 1  
BBWC battery pack  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
Power supply backplane  
BBWC battery pack (optional)  
SAS backplane (optional)  
SAS backplane  
Combo PCIe/HTx I/O backplane  
Item  
Description  
1
2
Blank slot  
HyperTransport non-hot-plug expansion slot 9  
Internal components  
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Combo PCIe/HTx I/O backplane  
Item  
3
Description  
Blank slot  
4
HyperTransport non-hot-plug expansion slot 8  
PCI Express x4 non-hot-plug expansion slot 7  
PCI Express x4 non-hot-plug expansion slot 6  
PCI Express x16 non-hot-plug expansion slot 5  
PCI Express x4 non-hot-plug expansion slot 4  
PCI Express x4 non-hot-plug expansion slot 3  
PCI Express x4 non-hot-plug expansion slot 2  
PCI Express x8 non-hot-plug expansion slot 1  
5
6
7
8
9
10  
11  
SPI board components  
SPI (core I/O) board  
Item  
Description  
1
2
3
BBWC module connections  
Serial peripheral interface board  
System battery  
System maintenance switch (SW6)  
The system maintenance switch (SW6) is an eight position switch that is used for system  
configuration. The default position for all eight positions is Off (closed).  
Position  
Description  
Switch  
Off  
Function  
1
iLO 2 security  
iLO 2 security is enabled  
iLO 2 security is disabled  
On  
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Position  
Description  
Switch  
Off  
On  
Function  
2
Configuration lock  
System configuration can be changed  
System configuration is locked  
Reserved  
3
4
5
Reserved  
Reserved  
Reserved  
Password protection override Off  
On  
Password is enabled  
Password is disabled  
Switch has no function  
ROM reads system configuration as invalid  
6
Reset configuration  
Off  
On  
7
8
POST LED switch 1  
POST LED switch 2  
See Table 5-1 (page 73) for details.  
Table 5-1 System Maintenance Switch Positions 7 and 8 Detail  
Position 7  
Off  
Position 8  
Off  
Displayed on LED8–LED1  
Port 85  
Off  
On  
Port 84  
On  
Off  
iLO  
On  
On  
Embedded SAS status  
System maintenance switch (SW6)  
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System maintenance switch (SW1)  
CAUTION: All supported AMD Opteron quad-core processors 3.1 GHz or greater and all  
supported AMD Opteron six-core processors require the system maintenance switch, located on  
the I/O backplane, (SW1) position 5 to be in the On position.  
HP recommends updating to the latest version of firmware. Earlier firmware versions might not  
validate the required switch setting for these processors.  
Battery pack LEDs  
Item ID  
LED  
Color  
Description  
1
2
3
BBWC status  
Green  
To interpret the illumination patters of this LED, see Table 5-2 (page 74)  
To interpret the illumination patters of this LED, see Table 5-2 (page 74)  
Battery health Amber  
Auxiliary  
power  
Green  
This LED glows solid when 3.3 V auxiliary voltage is detected. The auxiliary  
voltage preserves BBWC data and is available any time that the system  
power cords are connected to a power supply.  
4
System power Green  
This LED glows solid when the system is powered up and 12 V system  
power is available. This power supply maintains the battery charge and  
provides supplementary power to the cache microcontroller.  
Table 5-2 Battery health and BBWC status LED patterns  
LED 3 pattern  
LED 4 pattern  
Interpretation  
Flashing (1/2 Hz)  
The system is powered down, and the cache contains data that has not yet  
been written to the drives. Restore system power as soon as possible to  
prevent data loss.  
Data preservation time is extended any time that 3.3 V auxiliary power is  
available, as indicated by LED 2. In the absence of auxiliary power, battery  
power alone preserves the data. A fullycharged battery can normally preserve  
data for at least two days.  
None  
The battery lifetime also depends on the cache module size. For further  
information, refer to the controller QuickSpecs on the HP website  
Double flash, then The cache microcontroller is waiting for the host controller to communicate.  
pause  
None  
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Table 5-2 Battery health and BBWC status LED patterns (continued)  
LED 3 pattern  
LED 4 pattern  
Interpretation  
Flashing (1 Hz)  
The battery pack is below the minimum charge level and is being charged.  
Features that require a battery (such as write cache, capacity expansion,  
stripe size migration, and RAID migration) are temporarily unavailable until  
charging is complete. The recharge process takes between 15 minutes and  
two hours, depending on the initial capacity of the battery.  
None  
Solid  
Off  
The battery pack is fully charged, and posted write data is stored in the  
cache.  
None  
None  
The battery pack is fully charged, and there is no posted write data in the  
cache.  
Flashing (1 Hz) Flashing (1 Hz)  
An alternating green and amber flash pattern indicates that the cache  
microcontroller is executing from within its boot loader and receiving new  
flash code from the host controller.  
Solid  
There is a short circuit across the battery terminals or within the battery  
pack. BBWC features are disabled until the battery pack is replaced. The life  
expectancy of a battery pack is typically more than three years.  
None  
Flashing (1 Hz)  
None  
There is an open circuit across the battery terminals or within the battery  
pack. BBWC features are disabled until the battery pack is replaced. The life  
expectancy of a battery pack is typically more than three years.  
Fan locations  
Fan locations  
75  
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Item  
Description  
Fan 1  
1
2
3
4
5
6
Fan 2  
Fan 3  
Fan 4  
Fan 5  
Fan 6  
76  
Component identification  
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6 Cabling  
In this section  
Cabling overview  
This section provides guidelines that help you make informed decisions about cabling the server  
and hardware options to optimize performance.  
For information on cabling peripheral components, refer to the white paper on high-density  
deployment at the HP website (http://www.hp.com/products/servers/platforms).  
BBWC cabling  
Cabling overview  
77  
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SAS and SATA hard drive cabling  
CAUTION: When routing cables, always be sure that the cables are not in a position where they  
can be pinched or crimped.  
SAS expander cabling  
To install a SAS expander:  
1. Power down the server (“Power down the server” (page 25)).  
2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)  
3. Remove the access panel (“Removing the access panel” (page 27)).  
4. Disconnect the cable connecting the SAS backplane and SPI board. Retain the cable for future  
use.  
5. Connect the SAS expander to the Smart Array Controller.  
78  
Cabling  
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6. Install together the Smart Array Controller into slot 1 and the SAS expander into slot 2  
7. Route and connect the cables from the SAS expander to the SAS backplanes.  
SAS expander cabling  
79  
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TIP: For best cable management route the cable to SAS backplane 1 under the power cable at  
the power supply backplane and the cable to SAS backplane 2 under other cables in the center  
cable routing channel.  
High power graphics card cabling  
IMPORTANT: Install high powered graphics cards in PCIe 16x slots for optimum performance.  
The server can power a maximum of four auxiliary high powered graphics card power  
connections.  
80  
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7 Specifications  
In this section  
Environmental specification  
Specification  
Value  
Temperature range  
Operating  
1
10°C to 35°C (50°F to 95°F)  
2
Non-operating  
-30°C to 60°C (-22°F to 140°F)  
28°C (82.4°F)  
Maximum wet bulb temperature  
Relative humidity (noncondensing)  
Operating  
3
10% to 90% relative humidity (Rh), 28°C (82.4°F)  
maximum wet bulb temperature, non-condensing.  
Non-operating  
5% to 95% relative humidity (Rh), 38.7°C (101.7°F)  
maximum wet bulb temperature, non-condensing.  
Altitude  
Operating  
3050 m (10,000 ft). This value may be limited by the type  
and number of options installed. Maximum allowable  
altitude change rate is 457 m/min (1500 ft/min).  
Non-operating  
9144 m (30,000 ft). Maximum allowable altitude change  
rate is 457 m/min (1500 ft/min).  
1
10° to 35°C (50° to 95°F) at sea level with an altitude derating of 1.0°C per every 305 m (1.8°F per every 1000 ft) above  
sea level to a maximum of 3050 m (10,000 ft), no direct sustained sunlight. Maximum rate of change is 10°C/hr  
(18°F/hr). The upper limit may be limited by the type and number of options installed.  
System performance may be reduced if operating with a fan fault or above 30°C (86°F).  
Maximum rate of change is 20°C/hr (36°F/hr).  
2
3
Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for  
storage corresponds to a pressure minimum of 70 KPa.  
Server specifications  
Specification  
Dimension  
Height  
Value  
30.58 cm (12.04 in)  
69.6 cm (27.4 in)  
44 cm (17.32 in)  
72 kg (160 lbs)  
Depth  
Width  
1
Weight (maximum )  
2
Weight (minium )  
67 kg (147 lbs)  
3
Input requirement  
Low line  
High line  
100 - 120 V ac  
200 - 240 V ac  
Rated input voltage  
90 - 132 V ac  
180 - 264 V ac  
Environmental specification  
81  
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Specification  
Value  
Rated input frequency  
Rated input current  
Rated input power  
BTUs per hour  
47- 63 Hz  
47- 63 Hz  
14A at 200 V ac  
2800 W  
24A at100 V ac  
2400 W  
8189  
9554  
3
Power supply output  
Power supply output  
Low line  
High line  
800 W per P.S.U. at 3 P.S.U. active  
1200 W per P.S.U. at 3 P.S.U. active  
4
Acoustic Noise  
Idle  
LWAd 7.6 B  
LpAm 58 dBa  
LWAd 7.6B  
Operating  
LpAm 58 dBa  
1
2
3
all hard drives, power supplies, and processors installed  
one hard drive, three power supplies, and four processor cells installed  
IMPORTANT: To ensure the ProLiant DL785 G5 Server has sufficient power during normal operation, a server  
configured with HP supported high powered graphics cards rated at 225 W or more require high line (200 - 240 V)  
ac server configuration. As a precaution, if these cards are installed on a low line (100 - 127 V) ac configured server  
the server will halt at Power-On Self-Test with a "Power Supply Solution not Sufficient" message and only boot to  
RBSU.  
At POST, the ProLiant DL785 G5 server automatically detects whether the power supplies are connected to high-line  
power or low-line power. If the server is configured with high powered graphics cards, the system will halt if it  
detects that the server is plugged into low-line power. This occurs by design because system configured high power  
graphics cards, with a large amount of memory, hard drives, or other options might require more power than can  
be provided by low-line power. POST halts this low-line configuration as a precaution against the server having  
insufficient power during operation.  
If a you wish to operate a server with high power graphics cards when utilizing low-line power, the power supply  
solution should be verified as sufficient using the ProLiant DL785 G5 power calculator at http://  
is not deemed sufficient, the server may not have sufficient power to operate normally. If the solution is deemed  
sufficient, a ROM-Based Setup Utility option, outlined below, can be used to allow the system to operate in this  
configuration.  
If the ProLiant DL785 G5 power calculator has determined that the server can be reliably powered at low-line power  
with high power graphics cards installed, perform the following steps to override the Power Supply Requirements  
setting in ROM-Based Setup Utility (RBSU):  
1. Power down the server and remove the high power graphics cards.  
2. Power the server back on and press F9 during POST to access RBSU.  
3. Select Advanced Options.  
4. Scroll down to Power Supply Requirements Override and choose to enable it.  
5. Power down the server and reinstall the graphics cards previously removed.  
4
Listed are the declared A-Weighted sound power levels (LWAd) and declared average bystander position A-Weighted  
sound pressure levels (LpAm) when the product is operating in a 23°C ambient environment. Noise emissions were  
measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109).  
82  
Specifications  
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8 Technical support  
In this section  
Before you contact HP  
Be sure to have the following information available before you call HP:  
Technical support registration number (if applicable)  
Product serial number  
Product model name and number  
Applicable error messages  
Add-on boards or hardware  
Third-party hardware or software  
Operating system type and revision level  
HP contact information  
For the name of the nearest HP authorized reseller:  
In the United States, see the HP US service locator webpage  
In other locations, see the Contact HP worldwide (in English) webpage  
For HP technical support:  
In the United States, for contact options see the Contact HP United States webpage  
phone:  
Call 1-800-HP-INVENT (1-800-474-6836). This service is available 24 hours a day, 7 days  
a week. For continuous quality improvement, calls may be recorded or monitored.  
If you have purchased a Care Pack (service upgrade), call 1-800-633-3600. For more  
information about Care Packs, refer to the HP website (http://www.hp.com).  
In other locations, see the Contact HP worldwide (in English) webpage  
Before you contact HP  
83  
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A Acronyms and abbreviations  
ABEND  
ACU  
ADU  
AMD  
ASR  
BBWR  
BIOS  
CSA  
abnormal end  
Array Configuration Utility  
Array Diagnostics Utility  
Advanced Micro Devices  
Automatic Server Recovery  
battery-backed write cache  
Basic Input/Output System  
Canadian Standards Association  
Customer Self Repair  
CSR  
DIMM  
DOS  
dual inline memory module  
disk operating system  
ESD  
electrostatic discharge  
HTx  
HyperTransport  
IEC  
iLO 2  
IML  
International Electrotechnical Commission  
Integrated Lights-Out 2  
Integrated Management Log  
Instant Support Enterprise Edition  
keyboard, video, and mouse  
National Electrical Manufacturers Association  
National Fire Protection Association  
network interface controller  
nickel metal hydride  
non-volatile memory  
Option ROM Configuration for Arrays  
operating system  
ISEE  
KVM  
NEMA  
NFPA  
NIC  
NiMH  
NVRAM  
ORCA  
OS  
PCI-X  
PCIe  
PDU  
POST  
PPM  
PSP  
peripheral component interconnect extended  
peripheral component interconnect express  
power distribution unit  
Power-On Self Test  
processor power module  
ProLiant Support Pack  
RAID  
RBSU  
RDP  
redundant array of inexpensive (or independent) disks  
ROM-Based Setup Utility  
Rapid Deployment Pack  
RILOE II  
ROM  
SAS  
Remote Insight Lights-Out Edition II  
read-only memory  
serial attached SCSI  
SCSI  
SFF  
small computer system interface  
small form-factor  
SID  
System Insight Display  
SIM  
Systems Insight Manager  
SNMP  
Simple Network Management Protocol  
85  
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TMRA  
UID  
recommended ambient operating temperature  
unit identification  
UPS  
USB  
uninterruptible power system  
universal serial bus  
VCA  
Version Control Agent  
86  
Acronyms and abbreviations  
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Index  
front bezel, 29  
A
access panel, 27  
H
ASR (see Automatic Server Recovery (ASR))  
Automatic Server Recovery (ASR), 56  
hard drives (see SAS, hard drives)  
HP  
contacting, 83  
B
HP Insight Diagnostics, 56  
HP Instant Support Enterprise Edition (ISEE), 54  
HP ROM-Based Setup Utility (see RBSU (HP ROM-Based  
Setup Utility))  
battery-backed write cache  
battery pack, 45  
data recovery, 47  
battery-backed write cache (BBWC), 44  
BBWC (see battery-backed write cache)  
LED (see LED, battery pack)  
blanks  
HP SIM (see HP Systems Insight Manager)  
HP Systems Insight Manager, 56  
I
DVD or CD, 38  
illustrated parts catalog, 13  
hard drive, 37  
iLO 2 (Integrated Lights-Out 2), 55  
IML (see Integrated Management Log (IML))  
Integrated Lights-Out 2 (see iLO 2 (Integrated Lights-Out  
2))  
power supply, 38  
C
cabling, 77–80  
Integrated Management Log (IML), 55  
ISEE (see HP Instant Support Enterprise Edition (ISEE))  
BBWC, 77  
hard drive, 78  
high power graphics card, 80  
SAS expander, 78–80  
components  
L
LED  
battery pack, 74–75  
front panel, 63  
hard drive, 66  
power supply, 70  
rear, 69  
front, 61  
internal, 70–72  
mechanical, 13  
processor memory cell, 67  
rear, 68  
System Insight Display, 64  
system, 16  
core I/O board (see SPI board)  
CSR (see customer self repair (CSR))  
customer self repair (CSR), 7  
M
media module, 28  
mezzanine board, 29  
mezzanine filler, 29  
mezzanine filler bezel, 29  
midplane board, 50  
D
diagnostic tools, 53  
DIMMs, 36  
installation guidelines, 36  
O
ORCA (Option ROM Configuration for Arrays), 54  
E
electrostatic discharge, 23  
ESD (see electrostatic discharge)  
expansion boards, 42  
expansion slot  
P
port 85 code, 57–59  
expansion board-related, 58  
memory-related, 58  
miscellanious, 59  
processor-related, 57  
power supply, 38  
backplane, 47  
covers, 41  
expansion slots  
combo PCIe/HTx I/O backplane, 43  
PCIe I/O backplane, 42  
powering down, 25  
preparation procedures, 24  
processor memory cell, 29  
airflow baffle, 30  
bezel, 30  
F
fan  
location, 75  
fans, 39  
internal, 40  
rear, 39  
processors, 30  
87  
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R
rack  
extending server from, 25  
removing server from, 26  
RBSU (HP ROM-Based Setup Utility), 54  
removal and replacement procedures, 23  
required tools, 23  
ROM  
updating, 55  
ROMPaq Utility, 55  
S
safety considerations, 23  
SAS  
backplane, 44  
hard drives, 37  
serial number, 48  
SID (see System Insight Display)  
SmartStart Scripting Toolkit, 53  
SmartStart software, 53  
specifications  
environmental, 81  
server, 81  
SPI board, 72  
system battery, 48  
System Insight Display, 64  
system maintenance switch  
SW1, 74  
SW6, 72  
Systems Insight Manager (see HP Systems Insight  
Manager)  
T
technical support, 83  
U
USB  
support, 56  
88  
Index  
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89  
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*AH233-9002A_ed7*  
Printed in the US  
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