User Ser vice Gu id e
H P In tegr it y Su p er d om e/sx2000 Ser ver
Secon d Ed ition
Ma n u fa ct u r in g P a r t Nu m b er : A9834-9001B
Sep tem b er 2006
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Server History and Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Server Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Power System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
AC Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
DC Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
System Power On Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Enabling 48 Volts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Cooling System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Utilities Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Platform Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
IPF Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
UGUY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
CLU Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
PM3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
System Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Managemant Processor (SBCH and SBC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Compact Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
HUCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Backplane (Fabric) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Crossbar Chip - XBC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Switch Fabrics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Backplane Monitor and Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
I2C Bus Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Clock Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Cabinet ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Cell ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Backplane Power Requirements and Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
CPUs and Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Cell Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Processor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Cell Memory System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
PDC Functional Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Platform Dependant Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Cell OL*. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
I/O Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
PCI-X Backplane Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
New Server Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
M-Link Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
E-Link Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Server Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Server Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Protection Domain Access Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
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Hardware Corrected Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Global Shared Memory Errrors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Hardware Uncorrectable Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Fatal Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Blocking Timeout Fatal Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Deadlock Recovery Reset Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Error Logging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Dimensions and Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Component Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Component Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Shipping Dimensions and Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Circuit Breaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
System Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Component Power Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
I/O Expansion Cabinet Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
I/O Expansion Cabinet Power Cords . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Temperature and Humidity Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Acoustic Noise Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Airflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Communications Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Electrostatic Discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Public Telecommunications Network Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Unpacking and Inspecting the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Verifying Site Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Checking the Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Inspecting the Shipping Containers for Damage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Unpacking and Inspecting Hardware Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Unpacking the PDCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Returning Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Setting Up the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Moving the System and Related Equipment to the Installation Site . . . . . . . . . . . . . . . . . . . . . . . . . 91
Unpacking and Installing the Blower Housings and Blowers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Attaching the Side Skins and Blower Side Bezels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Attaching the Leveling Feet and Leveling the Cabinet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Installing the Front Door Bezels and the Front and Rear Blower Bezels . . . . . . . . . . . . . . . . . . . . . 97
Wiring Check. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
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Installing and Verifying the PDCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Voltage Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Removing the EMI Panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Connecting the Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Routing the I/O Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Installing the Support Management Station . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Configuring the Event Information Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Turning On Housekeeping Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Connecting the MP to the Customer LAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Connecting the MP to the Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Setting the Customer IP Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Booting and Verifying the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Connecting to the Management Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Powering On the System 48 V Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Booting the HP Integrity Superdome/sx2000 to a EFI Shell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Verifying the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Running J ET Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Running J UST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Power Cycling After Using J ET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Offline Diagnostic Environment (ODE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Attaching the Rear Kick Plates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Performing a Visual Inspection and Completing the Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Conducting a Post Installation Check. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Operating Systems Supported on Cell-based HP Servers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
System Boot Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
HP Integrity Boot Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Booting and Shutting Down HP-UX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
HP-UX Support for Cell Local Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Adding HP-UX to the Boot Options List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Booting HP-UX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Shutting Down HP-UX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Booting and Shutting Down HP OpenVMS I64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
HP OpenVMS I64 Support for Cell Local Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
Adding HP OpenVMS to the Boot Options List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
Booting HP OpenVMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
Shutting Down HP OpenVMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
Booting and Shutting Down Microsoft Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
Microsoft Windows Support for Cell Local Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
Adding Microsoft Windows to the Boot Options List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
Booting Microsoft Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Shutting Down Microsoft Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
Booting and Shutting Down Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
Linux Support for Cell Local Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
Adding Linux to the Boot Options List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
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Booting Red Hat Enterprise Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
Booting SuSE Linux Enterprise Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
Shutting Down Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
MP Command: BO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
MP Command: CA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
MP Command: CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
MP Command: CP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
MP Command: DATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
MP Command: DC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
MP Command: DF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
MP Command: DI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
MP Command: DL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
MP Command: EL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
MP Command: HE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
MP Command: ID. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
MP Command: IO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
MP Command: IT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
MP Command: LC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
MP Command: LS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
MP Command: MA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
MP Command: ND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
MP Command: PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
MP Command: PE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
MP Command: PS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
MP Command: RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
MP Command: RL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
MP Command: RR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
MP Command: RS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
MP Command: SA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
MP Command: SO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
MP Command: SYSREV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
MP Command: TC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
MP Command: TE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
MP Command: VM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
MP Command: WHO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
MP Command: XD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
Shutting Down the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
Checking System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
Shutting Down the Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Preparing the Partitions for Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
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Powering Off the System Using the pe Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
Turning On Housekeeping Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
Powering On the System Using the pe Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
Templates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
Equipment Footprint Templates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
Computer Room Layout Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
In d ex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
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Table 1-1. HSO LED Status Indicator Meaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 1-2. Supported Processors and Minimum Firmware Version Required . . . . . . . . . . . . . . . . . 42
Table 2-1. Server Component Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 2-2. I/O Expansion Cabinet Component Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 2-3. System Component Weights. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 2-4. I/O Expansion Cabinet Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 2-5. Miscellaneous Dimensions and Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 2-6. Available Power Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 2-7. Option 6 and 7 Specifics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 2-8. Power Requirements (Without Support Management Station) . . . . . . . . . . . . . . . . . . . . 65
Table 2-11. I/O Expansion Cabinet Component Power Requirements . . . . . . . . . . . . . . . . . . . . . . . 67
Table 2-12. I/O Expansion Cabinet ac Power Cords . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 2-13. Operational Physical Environment Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 2-14. Nonoperational Physical Environment Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 2-15. Typical HP Integrity Superdome/sx2000 for Dual-core CPU Configurations . . . . . . . . 69
Table 2-16. Typical HP Integrity Superdome/sx2000 for Single-core CPU Configurations . . . . . . . 70
Table 2-17. Physical Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Table 3-1. Available Power Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 3-2. Power Cord Option 6 and 7 Specifics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 3-3. 4- and 5-Wire Voltage Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Table A-1. Front Panel LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
Table A-2. Power and OL* LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
Table A-3. OL* LED States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
Table A-4. PDH Status and Power Good LED States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
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Figure 1-1. Superdome Cabinet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 1-2. UGUY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 1-3. Management Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 1-4. HUCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 1-5. Locations of HSO and RCS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 1-6. Backplane Power Supply Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 1-7. Backplane (Rear View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 1-8. Cell Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 1-9. Cell Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 1-10. I/O Rope Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 1-11. Backplane Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Figure 2-1. PDCA Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure 2-2. Airflow Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Figure 3-1. Normal Tilt Indicator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Figure 3-2. Abnormal Tilt Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Figure 3-3. Front of Cabinet Container . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Figure 3-4. Cutting Polystrap Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 3-5. Removing the Ramps from the Pallet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Figure 3-6. Location of Power Supply Mounting Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Figure 3-7. I/O Chassis Mounting Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 3-8. Shipping Strap Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Figure 3-9. Removing the Mounting Brackets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Figure 3-10. Positioning the Ramps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Figure 3-11. Rolling the Cabinet Down the Ramp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 3-12. Blower Housing Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Figure 3-13. Removing Protective Cardboard from the Housing . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Figure 3-14. Installing the Rear Blower Housing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Figure 3-15. Installing the Front Blower Housing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Figure 3-16. Installing the Blowers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Figure 3-17. Attaching the Rear Side Skin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Figure 3-18. Attaching the Front Side Skins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Figure 3-19. Attaching the Side Bezels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Figure 3-20. Attaching the Leveling Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Figure 3-21. Installing the Lower Front Door Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Figure 3-22. Installing the Upper Front Door Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Figure 3-23. Installing the Rear Blower Bezel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Figure 3-24. Installing the Front Blower Bezel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Figure 3-25. PDCA Assembly for Options 6 and 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Figure 3-26. A 4-Wire Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Figure 3-27. A 5-Wire Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Figure 3-28. Installing the PDCA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Figure 3-29. Checking PDCA Test Points (5-Wire). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Figure 3-30. Wall Receptacle Pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
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Figure 3-31. Power Supply Indicator LED Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Figure 3-32. Removing Front EMI Panel Screw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Figure 3-33. Removing the Back EMI Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Figure 3-34. Cable Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Figure 3-35. Routing I/O Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Figure 3-36. Front Panel with Housekeeping (HKP) Power On and Present LEDs . . . . . . . . . . . 118
Figure 3-37. BPS LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Figure 3-38. MP LAN Connection Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure 3-39. LAN Configuration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Figure 3-40. The ls Command Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Figure 3-41. Connecting to Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Figure 3-42. Main MP Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Figure 3-43. MP Command Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Figure 3-44. MP Virtual Front Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Figure 3-45. Example of Partition State—Cabinet Not Powered Up . . . . . . . . . . . . . . . . . . . . . . . 125
Figure 3-46. MP Console Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Figure 3-47. HP Integrity Superdome/sx2000 EFI Boot Manager . . . . . . . . . . . . . . . . . . . . . . . . . 127
Figure 3-48. EFI Shell Prompt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Figure 3-49. HP Integrity Superdome/sx2000 Partitions at System Firmware Console . . . . . . . . 129
Figure 3-50. Power Status First Window. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Figure 3-51. Power Status Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Figure 3-52. Power Status Showing State of UGUY LEDs (and Other Status) . . . . . . . . . . . . . . 130
Figure 3-53. Attaching Rear Kick Plates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Figure 3-54. Cell Board Ejectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Figure 3-55. Front EMI Panel Flange and Cabinet Holes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Figure 3-56. Reinstalling the Back EMI Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Figure A-1. Utilities LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
Figure A-2. PDH Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
Figure C-1. Connecting to Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
Figure C-2. Main MP Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
Figure C-3. Checking for Other Users . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
Figure C-4. Checking Current System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
Figure C-5. MP Virtual Front Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
Figure C-6. Example of Partition State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Figure C-7. Partition Consoles Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Figure C-8. Issuing an rr Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
Figure C-9. Using the de -s Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
Figure C-10. Power Entity Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
Figure C-11. Power Status First Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
Figure C-12. Power Status Second Window. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Figure C-14. BPS LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Figure C-15. Power Entity Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
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F igu r es
Figure C-16. Power Status First Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
Figure C-17. Power Status Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
Figure D-1. Cable Cutouts and Caster Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Figure D-2. SD16 and SD32 Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
Figure D-3. SD64 Space Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
Figure D-4. Computer Floor Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Figure D-5. Computer Floor Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
Figure D-6. Computer Floor Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
Figure D-7. Computer Floor Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
Figure D-8. Computer Floor Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
Figure D-9. SD32 and SD64, and I/O Expansion Cabinet Templates . . . . . . . . . . . . . . . . . . . . . . . 238
Figure D-10. SD32 and SD64, and I/O Expansion Cabinet Templates . . . . . . . . . . . . . . . . . . . . . . 239
Figure D-11. SD32 and SD64, and I/O Expansion Cabinet Templates . . . . . . . . . . . . . . . . . . . . . . 240
Figure D-12. SD32 and SD64, and I/O Expansion Cabinet Templates . . . . . . . . . . . . . . . . . . . . . . 241
Figure D-13. SD32 and SD64, and I/O Expansion Cabinet Templates . . . . . . . . . . . . . . . . . . . . . . 242
Figure D-14. SD32 and SD64, and I/O Expansion Cabinet Templates . . . . . . . . . . . . . . . . . . . . . . 243
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F igu r es
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Ab ou t Th is Docu m en t
This document contains a system overview, system specific parameters, how to install the system, and
operating system specifics for the system.
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In ten d ed Au d ien ce
This document is intended for HP trained Customer Support Consultants.
Docu m en t Or ga n iza t ion
This document is organized as follows:
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Appendix A
Appendix B
Appendix C
Appendix D
This chapter presents an historical view of the Superdome server family, describes the
various server components, and describes how the server components function together.
This chapter contains the dimensions and weights for the server and various components.
Electrical specifications, environmental requirements, and templates are also included.
This chapter involves unpacking and inspecting the system, setting up the system,
connecting the MP to the customer LAN, and steps to complete the installation.
This chapter has information for booting and shutting down the server operating system
(OS) for each OS supported.
This appendix contains tables that describe the various LED states for the front panel,
power and OL* states, and OL* states for I/O chassis cards.
This appendix provides a summary for each management processor (MP) command. Screen
output is provided for each command so you can see the results of the command.
This appendix provides procedures to power off and power on the system when the removal
and replacement of a component requires it.
This appendix contains templates for: cable cutouts and caster locations, SD16, SD32,
SD64, and I/O expansion cabinets, and the computer room floor.
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Typ ogr a p h ic Con ven t ion s
The following typographic conventions are used in this publication.
WARNING
CAUTION
A w a r n in g list s r eq u ir em en t s th a t you m u st m eet t o a void p er son a l in ju r y.
A caution provides information required to avoid losing data or avoid losing system
functionality.
IMPORTANT Provides essential information to explain a concept or to complete a task.
NOTE
A note highlights useful information such as restrictions, recommendations, or important
details about HP product features.
• Commands and optionsare represented using this font.
• Text that you type exactly as shownis represented using this font.
• Text to be replaced with text that you supplyis represented using this font.
Example:
“Enter the ls -l filenamecommand” means you must replace filenamewith your own text.
•
•
Keyboard keys and graphical interface items (such as buttons, tabs, and menu items) are represented using this
font.
Examples:
The Control key, the OK button, the General tab, the Options menu.
Menu —> Submenu represents a menu selection you can perform.
Example:
“Select the Partition —> Create Partition action” means you must select the Create Partition menu item from
the Partition menu.
• Example screen outputis represented using this font.
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Rela t ed In for m a t ion
You can find other information on HP server hardware management, Microsoft® Windows®, and diagnostic
support tools at the following Web sites.
Web Site for HP Technical Documentation:
http://docs.hp.com
This is the main Web site for HP technical documentation. This site offers comprehensive information about
HP products available for free.
Server Hardware Information:
http://docs.hp.com/hpux/hw/
This Web site is the systems hardware portion of the docs.hp.com site. It provides HP nPartition server
hardware management details, including site preparation, installation, and more.
Diagnostics and Event Monitoring: Hardware Support Tools:
http://docs.hp.com/hpux/diag
This site contains complete information about HP hardware support tools, including online and offline
diagnostics and event monitoring tools. This site has manuals, tutorials, FAQs, and other reference material.
Web Site for HP Technical Support:
http://us-support2.external.hp.com
The HP IT resource center Web site provides comprehensive support information for IT professionals on a
wide variety of topics, including software, hardware, and networking.
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P u b lish in g H ist or y
The publishing history of this document includes the following editions. Updates are made to this document
on an unscheduled as needed basis. The updates consist of a complete replacement manual and pertinent
Web-based or CD documentation.
First Edition
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . March 2006
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . September 2006
Second Edition
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HP E n cou r a ges You r Com m en t s
note that you will not receive an immediate reply. All comments are appreciated.
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1 Over view
The HP superscalable sx2000 processor chipset is the new chipset for the Superdome high-end platform. It
supports up to 128 PA-RISC or Intel Itanium 2 processors and provides an enterprise server upgrade path
for the Superdome line of systems. The sx2000 provides the final major hardware upgrade to the Superdome
platform. Modifications include changes to the following components:
- A new chipset
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Overview
- A new cell board
- A new system backplane and it’s power board
- A new I/O backplanes and it’s power board
- New I/O - backplane cables
- And the addition of a redundant, hot swappable clock source.
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Overview
Server History and Specifications
Ser ver H ist or y a n d Sp ecifica t ion s
Superdome was introduced as the new platform architecture for HP high-end servers in 2000-2004.
Superdome represented the first collaborative hardware design effort between traditional HP and Convex
technologies. Superdome was designed to replace T and V Class servers and to prepare for the transition from
PA-RISC to Intel Itanium 2 processors (IA). The new design was to enable the ability running different
operating systems on the same server. The design also included several new high availability features.
Initially, Superdome was released with the legacy core electronics complex (CEC) which included a 552Mhz
PA-8600 processor. The legacy CEC supported two additional cpu speeds; a 750 Mhz PA-8700, followed by an
875 Mhz PA-8700 processor.
The HP Integrity server project was acually four projects based around the sx1000 CEC chipset and the
Integrity cell boards. The initial release was the sx1000 chipset, Integrity cell boards, IA firmware and a
1.2Mhz Intel processor. This initial release included PCI-X and PCI I/O mixes. The Integrity systems were
compatible with the legacy Superdome IOX.
A second release was still based upon the sx1000 CEC and included Integrity cell boards, but also added PA
firmware and a dual-core PA processor. The release also included a 2GB DIMM and a new HP-UX version.
The processors, processor power pods, memory, firmware, and operating system all changed for this release.
A third release, still based upon the sx1000 chipset, included the Integrity cell boards, IA firmware and a 1.5
Mhz IA CPU. The CPU module is composed of a dual-core processor with a new cache controller. The firmware
now allowed for mixing cells within a system. All three DIMM sizes were supported. Actual firmware and
operating system changes were minor changes from the earlier versions.
Today, the HP super scalable sx2000 processor chipset is the forth and final Superdome release, based upon a
new CEC that supports up to 128 PA-RISC or IA processors. It is targeted to be the last generation of
Superdome servers to support the PARISC family of processors. Modifications include the new chipset and
board changes including cell board, system and I/O backplanes and their associated power boards,
interconnect, and the addition of a redundant, hot swappable clock source.
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Overview
Server Components
Ser ver Com p on en t s
A Superdome system consists of the following types of cabinet assemblies:
At least one Superdome left cabinet. The Superdome cabinets contain all of the processors, memory, and core
devices of the system. They also house most (usually all) of the system's PCI cards. Systems can include both
left and right cabinet assemblies containing a left or right backplane (SD64) respectively.
One or more HP Rack System/E cabinets. These rack cabinets are used to hold the system peripheral devices
such as disk drives.
Optionally, one or more I/O expansion cabinets (Rack System/E). An I/O expansion cabinet is required when a
customer requires more PCI cards than can be accommodated in the Superdome cabinets.
The width of the cabinet assemblies accommodates moving them through standard-sized doorways. The
intake air to the main (cell) card cage is filtered. This filter is removable for cleaning and replacement while
the system is fully operational.
A status display is located on the outside of the front and rear doors of each cabinet. You can therefore
determine basic status of each cabinet without opening any cabinet doors.
The Superdome is a cell-based system. Cells communicate with other via the crossbar on the backplane.
Every cell has its own I/O interface, which can be connected to one 12-slot I/O-card cage via two system bus
adapter (SBA) link cables. Not all SBA links are connected by default due to a physical limitation of four
I/O-card cages per cabinet or node. In addition to these components each node consists of a power subsystem
and a utility subsystem. Three types of Superdome are available: an SD16, an SD32, and an SD64
two-cabinet system (with single-CPU cell board sockets). The SD## represents the maximum number of
available CPU sockets.
An SD16 contains the following components:
- Up to four cell boards
- Four I/O card cages
- Five I/O fans,
- Four system cooling fans,
- Four bulk power supplies (BPS)
- Two Power Distribution Control Assemblies (PDCA)
Two backplane N+1 power supplies provide power for the SD16. The four cell boards are connected to one pair
of crossbar chips (XBC). The backplane of an SD16 is the same as a backplane of an SD32, but the SD16 has
one set of XBCs and the EEPROM is different. On the HUCB utility pcb is a switch that should be set to
TYPE= 1.
An SD32 has up to eight cell boards. All eight cell boards are connected to two pairs of crossbar chips (XBCs).
The SD32 backplane is designed to allow for a system upgrade to an SD64. On an SD32, four of the eight
connectors should use U-Turn cables. The U-Turn cables double the number of links and the bandwidth
between the XBCs and are recommended to achieve best performance.
An SD64 has up to 16 cell boards and requires two cabinets. All 16 cell boards are connected to four pairs of
XBCs. The SD64 consists of a left backplane and a right backplane cabinets which are connected using 12
M-Link cables.
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Overview
Server Components
When the PA dual-core or the IA dual-core processors are used, the CPU counts are doubled by the use of the
dual-die processors, as supported on the Itanium cell boards. Up to 128 processors can be supported.
F igu r e 1-1
Su p er d om e Ca bin et
Blowers
Blowers
Cell
Backplane
Power
Backplane
Cables
Utilities
I/O Fans
I/O Chassis
I/O Chassis
PDCA
Cable Groomer
Power Supplies
Leveling Feet
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Overview
Power System
P ow er Syst em
The power subsystem consists of the following components:
- 1 or 2 Power Distribution Component Assembly (PDCA)
- 1 Front End Power Supply (FEPS)
- Up to 6 Bulk Power Supplies (BPS)
- 1 power board per cell
- An HIOB power system
- Backplane power bricks
- Power monitor (PM) on the Universal Glob of Utilities (UGUY)
- And local power monitors (LPM) on the cell, the HIOB and the backplanes.
AC Pow er
The AC power system includes one or two PDCAs and one FEPS.
The FEPS is a modular, 2n+2 shelf assembly power system that can consume up to 17 KVA of power from A C
sources. The purpose of the FEPS chassis is to provide interconnect, signal and voltage busing between the
PDCAs and BPSs, between the BPSs and utility subsystem, and between the BPS and the system power
architecture. The FEPS subsystem comprises of three distinct modular assemblies: six BPS, two PDCAs, and
one FEPS chassis.
At least one 3-phase PDCA per Superdome cabinet is required. For redundancy a second PDCA per cabinet
may be provided. The purpose of the PDCA is to receive a single 3-phase input and output three 1-phase
outputs with a voltage range of 200 to 240 volts regardless of the AC source type. The PDCA also provides a
convenience disconnect switch/circuit breaker for service, test points and voltage present LED indicators. The
PDCA is offered as a 4-wire or a 5-wire PDCAdevice . Separate PDCA’s (PDCA-0 and PDCA-1) may be
connected to 4-wire and 5-wire input source simultaneously as long as the PDCA internal wiring matches the
wiring configuration of the AC source
The 4-wire PDCA is used in a phase to phase voltage range of 200 to 240 volts at 50/60 Hz. This PDCA is
rated for a maximum input current of 44 Amps per phase. The AC input power line to the PDCA is connected
with power plugs or is hardwired. When using power plugs, use a power cord [OLFLEX 190 (PN 6008044)
four conductor 6-AWG (16mm), 600 V, 60 Amp, 90°C, UL and CSA approved, conforms to CE directives
GN/YW ground wire].
Following recommend plugs for the 4-wire PDCA are:
- In-line connector: Mennekes ME 460C9, 3-phase, 4-wire, 60 Amp, 250 V, UL approved, color blue, IEC309-1
grounded at 9:00 o'clock.
- Panel-mount receptacle: Mennekes ME 460R9, 3-phase, 4-wire, 60 Amp, 250 V, UL approved, color blue,
IEC309-1 grounded at 9:00 o'clock.
The 5 wire PDCA is used in a phase-to-neutral voltage range of 200 to 240 Vac 50/60Hz. This PDCA is rated
for a maximum input current of 24 Amps per phase. The AC input power line to the PDCA is connected with
power plugs or is hardwired. When using power plugs, a power cord [five conductors, 10-AWG (6 mm),
450/475 V, 32 Amps, <HAR< European wire cordage, GN/YW ground wire]. An alternative is for the customer
to provide the power plug including the power cord and the receptacle. Recommended plugs:
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Overview
Power System
- Inline connector: Mennekes ME532C6-16, 3-phase, 5-wire, 32 Amps, 450/475 V, VDE certified, color
red,IEC309-1, IEC309-2, grounded at 6:00 o'clock.
- Panel-mount receptacle: Mennekes ME532R6-1276, 3-phase, 5-wire, 32 Amp, 450/475 V, VDE certified, color
red, IEC309-1, IEC309-2, grounded at 6:00 o'clock.
- FUSE per phase: 25 Amp (valid for Germany).
DC Pow er
Each power supply output provides 48 V dc up to 60 A (2.88kVA) and 5.3 V dc housekeeping. Normally an
SD32 Superdome cabinet contains six BPS independent from the installed amount of cells and I/O. An SD16
normally has four BPS installed.
System Pow er On Seq u en ce
The general power up sequence order is as follows:
1. AC power cord is pulled in and front end power supply (FEPS) breakers closed.
2. Housekeeping (HKP) power is applied. Utilities initialization and the complex configuration is checked.
3. Power switch on and the cabinet 48V power is enabled.
4. SPU cabinet main backplane powered on and reset. The main system backplane comes up first and
supplies clocks to cells and I/O backplanes. Backplane XBCs must be ready by the time cell controllers
initialize.
5. I/O backplanes are powered on.
6. Cell boards are powered on.
7. SUB queries cells for valid complex profiles. Cells must be powered up with 48 V in addition to HKP. When
one valid cell is located, a timer starts and cell boards not ready, after the timer counts down, will not be
initialized.
8. Early CPU_INIT and cell monarch selections begin.
9. Cell board nitialization begin.
10. Partitions seek rendezvous and perform core-cell selections.
11. Partition domains are Iinitialized.
12. IPL is launched.
En a b lin g 48 Volts
The PM is responsible for enabling 48 V, but it must have permission from the MP. To enable 48 V, the
transition cabinet power switch must be moved from OFF to ON. Or you can use the MP command pe if the
power switch is already on. (If switch is on the cabinet wakes up from power on reset).
If the PM has permission, it sends a PS_CTL_L signal to the FEPS. Then the BPS enables 48 V converters
which send 48 V to the backplane, I/O Chassis, HUCB, cells, fans, and blowers. Once the 48 V is enabled, it is
cabled to the backplane, cells, and I/O chassis(s).
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Overview
Cooling System
Coolin g Syst em
The Superdome has four blowers and five I/O fans per cabinet. These components are all hot-swap devices. All
have LEDs indicating the current status. These LEDs are self-enplanation. Temperature monitoring occurs
for the following:
- Inlet air for temperature increases above normal
- BPS for temperature increases above normal
- The I/O power board over temperature signal is monitored.
The inlet air sensor is on the main cabinet, located near the bottom of cell 1 front. The inlet air sensor and the
BPS sensors are monitored by the PM3 (on the UGUY), and the I/O power board sensors are monitored by the
cabinet level utilities (CLU) (on the UGUY).
The PM controls and monitors the speed of groups of N+1 redundant fans. In a CPU cabinet, fan Group 0
consists of the four main blowers and fan Group 1 consists of the five I/O fans. In an I/O Expansion (IOX)
cabinet, fan Groups 0 thru 3 consist of four I/O fans and fan Group 4 consists of 2 management subsystem
fans. All fans are expected to be populated at all times (with the exception of the OLR of a failed fan).
The main blowers feature a variable speed control. The blowers operate at full speed there is circuitry
available to REDUCE the normal operating speed. All of the I/O fans and managed fans run only at 1 speed.
The PM controls fans through the use of the following resources:
- fanReference D/A (for main fans only)
- tachSelect register
- 930 Port 3.5 (T1) and 930 Timer 1
- FAN_SPEED_HIGH and FAN_SPEED_NORMAL message (for main fans only)
- 16 blower/fan present signals
- 2 manageability fan present signals
- 16 blower/fan fail signals
- 2 management fan fail signals
When the PM queries the entities for their maximum power consumption, the cells also send a value
describing the desired NORMAL main fan speed. Cells of the same architecture send identical values. If the
PM receives differing values, it uses the largest value.
One minute after setting the main blower fanReference to the desired speed or powering on the cabinet, the
PM uses the tach select register to cycle through each fan and measure its speed. When a fan is selected,
Timer 1 is used in counter mode to count the pulses on port T1 over a period of 1 second. If the frequency does
not equal the expected frequency plus some margin of error, the fan is considered to have failed and is
subtracted from the working fan count.
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Cooling System
If the failure causes a transition to N- I/O or main fans in a CPU cabinet, the cabinet is immediately powered
off. If the failure causes a transition to N- I/O fans in an IOX cabinet, the I/O backplanes contained in the I/O
Chassis Enclosure (ICE) containing that fan group are immediately powered off.
Only inlet temperature increases will be monitored by HPUX, all other high temperature increase chassis
codes will not activate the envd daemon to act as configured in the /etc/envd.conf. The PM monitors ambient
(inlet) temperature. The PM polls an analog-to-digital converter to read the current ambient temperature.
The temperature falls into one of four ranges: Normal, OverTempLow, OverTempMid, or OverTempHigh. The
following state codes machine describes the actions taken based on the various temperature state transitions:
OTL_THRESHOLD = 32C -----> send error code PDC_IPR_OLT
OTM_THRESHOLD = 38C ----> send error code PDC_INT_OTM
OTH_THRESHOLD = 40C -----> shut down 48 V
NOTE
In an I/O expansion (IOX) cabinet, the thresholds are set 2 degrees higher to compensate for
the fact that the cabinet sensor is mounted in a hot spot.
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Utilities Subsystem
Ut ilit ies Su b syst em
The Superdome utilities subsystem is comprised of a number of hardware and firmware components located
throughout the Superdome system.
P la tfor m Ma n a gem en t
The sx2000 platform management subsystem consists of a number of hardware and firmware components
located throughout the sx2000 system. The sx2000 uses the sx1000 platform management components, with
firmware changes to support new functionality.
The following list describes the major hardware components of the platform management subsystem and the
changes required for the sx2000:
The PDH microcontroller is located on Cell's PDH Daughter-card assembly. It provides communication
between the Management firmware, the PDH space, and the USB bus. The microcontroller represents a
change from the prior implementation, Intel 80C251 processes, to a more powerful 16-bit microcontroller
(ARM). This microcontroller change enables the PDH daughter-card design to be compatible across all three
new CEC platforms. It also enables the extra processing power to be used to move the console UARTs into
PDH memory space located on the Cell eliminating the sx1000 Core I/O (CIO) card.
The Universal Glob of Utilities (UGUY) on Superdome contains the power monitor (PM), the cabinet level
utilities (CLU), and the system clock source circuitry. No changes are planned for the sx2000 but the entire
clock section on the UGUY assembly is made obsolete by new redundant clock source circuitry.
The CLU circuitry on the UGUY assembly that provides cabinet -evel cable interconnect for backplane and
I/O card cage utility signal communication and scan support.
The PM circuitry on the UGUY assembly monitors and controls the 48 V dc, the cabinet environment
(ambient temperature and fans), and controls power to the entities (cells, I/O bays).
The Management Processor (MP) is a single board computer (SBC) that controls the console (local and
remote), the front panel display and its redirection on the console, maintains logs for the Event IDs,
coordinates messages between devices, and performs other service processor functions.
The SBCH board provides USB hubs into the cabinet from an upstream HUB or the MP. No changes are
planned for the sx2000.
IP F Fir m w a r e
- The firmware supports four different operating systems (HP-UX, Linux, Windows, OpenVMS)
- The firmware is compliant with IPF industry standards (SAL, PAL, ACPI, EFI)
- Provides an IPMI (intelligent platform management interface)
- Supports architecture that extends across product line and next generation systems
- Supports a new interface for user (mfg./diag/), etc.
- Supports PCI hot-plug
- Supports cell hot-plug (online add and delete)
- Supports I/O chassis hot-plug (online add and delete)
- Supports Cell-Local memory
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Utilities Subsystem
- Supports USB for keyboard and mouse at boot
- Supports VGA during boot
- Enables global shared memory (GSM)
- Supports PCI 2.3, PCI-X 1.0, and PCI-X 2.0
UGUY
swappable. Its MP microprocessor controls power monitor functions, executing the Power Monitor 3 (PM3)
firmware and the cabinet-level utility (CLU) firmware.
The UGUY consists of two main components:
- CLU
- PM3
F igu r e 1-2
UGUY
CLU F u n ction a lity
The CLU is responsible for collecting and reporting the configuration information for itself, main backplane,
I/O backplanes, and the SUB/HUB. Each of these boards is furnished with a configuration EEPROM
containing FRU IDs, revision information, and, for the main backplane and I/O backplanes, maximum power
requirements for that entity in its fully configured, fully loaded state. The power requirement information is
sent to the PM3 automatically when HKP is applied or when a new entity is plugged in. The configuration
information is sent to the SUB in response to a get_configcommand.
The CLU gathers the following information over its five I2C buses:
- Board revision information is contained in the board's configuration EEPROM for the UGUY board (UGUY),
the SBCH board (SBCH), the main backplane, the main backplane power boards (HBPB), the I/O backplane
(HIOB), and the I/O backplane power boards (IOPB).
- Power requirements from the configuration EEPROM for the main backplane (HLSB or HRSB), the I/O
backplanes (HIOB). This information is sent to the PM3 processor (via USB) so that it can calculate cabinet
power requirements.
- Power control and status interface. Another function of the UGUY is to use the power_ good signals to drive
power on
- Reset control which includes a reset for each I/O backplane, a main backplane cabinet reset, TRST - J TAG
reset for all J TAG scan chains in entire cabinet, a system clock control margin control
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Utilities Subsystem
- Status LEDs for the SBA cable OL*, the cell OL*, and the I/O backplane OL*
P M3 F u n ction a lit y
The PM3 performs the following functions:
1) FEPS control and monitoring. For each of the BPSs in the FEPS.
Superdome has six BPS and the UGUY sends 5 V to the BPS for use by the fault collection circuitry.
2) FAN control and monitoring.
In addition to the blowers, there are five I/O system fans (above and between I/O bays). These fans run at full
speed all the time (there is no fan speed signal).
3) Cabinet mode and cabinet number fan out.
There is a surface mount DIP switch on the HUCB (UGUY backplane) can be used to configure a Superdome
cabinet for normal use or as an SD16 cabinet. Use the 16-position thumb switch on the UGUY to set the
cabinet number. Numbers 0-7 are for CPU oriented cabinets and numbers 8-15 are for I/O-only cabinets.
4) Local Power Monitor (LPM) interfaces.
Each big board (cell board, I/ O backplane, and main backplane) contains logic that controls conversion of 48
V to lower voltages. The PM3 interfaces to the LPM with the board-present input signal to the PM3 and the
power-enable output signal from the PM3.
5) Front and rear panel board controls.
System Clock s
The sx2000 clocks are supplied from the backplane and to the backplane crossbar ASICs and the cell boards.
There is no distribution of the system clocks to the I/O backplanes. Instead, independent local clock
distribution is provided on the I/O backplane.
Ma n a gem a n t P r ocessor (SBCH a n d SBC)
The management processor (MP) is comprised of two PCBs, the SBC (single-board computer) and the single
board computer hub (SBCH), forms one functional unit. The MP is a hot-swappable unit powered by +5 V
HKP that holds the MP configuration parameters in compact flash and the error and activity logs and the
complex identification information (complex profile) in battery backed NVRAM. It also provides the USB
network controller (MP bus). Each complex has one MP per complex. It cannot be setup for redundancy.
However, it is not a single point of failure for the complex because it can be hot-swapped. If the MP fails, the
complex can still boot and function. However, the following utility functionality is lost until the MP can be
replaced:
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Utilities Subsystem
-The ability to process and store log entries (chassis codes)
- Console functions to every partition
- OL* functions
- Virtual front panel and system alert notification
- The ability to connect to the MP for maintenance, either locally or remotely
- The ability to run diagnostics (ODE and scan)
F igu r e 1-3
Ma n a gem e n t P r ocessor
SBC
SBCH
UGUY
The SBCH provides the physical and electrical interface to the SBC, the fanning out of the universal serial
bus (USB) to internal and external subsystems, and a LAN 10/100BT ethernet connection. It plugs into the
HUCB and is hot swappable. Every CPU cabinet contains one SBCH board, but only one SBCH contains an
SBC board used as the MP for the complex. The remaining SBCH boards act as USB hubs.
The SBC board is an embedded pc running system utility board (SUB) firmware. It is the core of the MP. It
plugs into the SBCH board through a PC104 interface. The SBC provides three external interfaces to the
utility subsystem:
- LAN (10/100BT ethernet) for customer console access
- RS232 port, for remote access from the response center through a modem
- RS232 port, for local console access for manufacturing and field support personnel
The modem function is not included on the SBC and must be external to the cabinet.
Com p a ct F la sh
The compact flash is a PCMCIA-style memory card that plugs into the SBC board. It stores the MPMP
firmware and the customer's MP configuration parameters. The parameters stored in the compact flash are:
- The network configurations for both the public and private LANs
- User name and password combinations for logging in to the MP
- Baud rates for the serial ports
- Paging parameters for a specified alert level
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Utilities Subsystem
HUCB
The HUCB, shown in Figure 1-4, is the backplane of the utility subsystem. It provides cable distribution for
all the utility signals except the clocks. It also provides the customer LAN interface and serial ports. The SMS
connects to the HUCB. The system type switch is located on the HUCB. This board has no active circuits. It is
not hot-swappable.
F igu r e 1-4
H UCB
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Backplane (Fabric)
Ba ck p la n e (Fa b r ic)
The system backplane assembly provides the following functionality in an sx2000 system:
- Interfaces the CLU subsystem to the system backplane and cell modules
- Houses the system crossbar switch fabrics and cell modules
- Provides switch fabric interconnect between multiple cabinets
- Generates system clock sources
- Performs redundant system clock source switching
- Distributes the system clock to crossbar chips and cell modules
- Distributes housekeeping power to cell modules
- Terminates I/O cables to cell modules
The backplane supports up to eight cells, interconnected via the crossbar links. A sustained total bandwidth
of 25.5 GBs is provided to each cell. Each cell connects to three individual XBC ASICs. This connection
enables a single chip crossing when a cell communicates with another cell in its four-cell group. When
transfering data between cells in different groups, two crossbar links are provided to compensate for the
resultant multiple chip crossings. This topology also provides for switch fabric redundancy
Dual rack/backplane systems contain two identical backplanes. These backplanes use 12 high-speed interface
cables as interconnects instead of the flex cable interface previously employed for the legacy Superdome
crossbar. The sustainable bisection bandwidth between cabinets is 72 GBs at a link speed of 2.1 GT/s.
Cr ossba r Ch ip - XBC
The crossbar fabrics in the sx2000 are implemented using the XBC crossbar chip. Each XBC is a
non-bit-sliced, eight-port non-blocking crossbar that can communicate with the CC or XBC ASICs. Each of the
eight ports is full duplex, capable of transmitting and receiving independent packets simultaneously. Each
port consists of 20 channels of IBMs HSS technology. Eighteen channels are used for packet data. One for
horizontal link parity, and one channel as a spare. The HSS channels can run from 2.0- 3.2 GT/s. At 3.0 GT/s,
each port provides 8.5 GBs of sustainable bi-directional data bandwidth.
Like the CC and the SBA, XBC implements link-level retry to recover from intermittent link errors. XBC can
also replace a hard-failed channel with the spare channel during the retry process, which guarantees
continued reliable operation in the event of a broken channel plus single or multibit intermittent errors.
XBC supports enhanced security between hard partitions by providing write protection on key CSRs. Without
protection, CSRs such as the routing tables could be modified by a "rogue" OS, causing other hard partitions
in the system to crash. To prevent this, key CSRs in XBC can only be modified by packets having the "Secure"
bit set. This bit is set by the CC based on a register that is set only by a hard cell reset, which causes secure
firmware to be entered. This bit is cleared by secure firmware before passing control to an OS.
Sw itch Fa br ics
The system backplane houses the switch fabric that connects to each of the cell modules. The crossbar switch
is implemented by a three-link-per-cell topology: three independent switch fabrics connected in parallel. This
topology provides switch fabric redundancy in the crossbar switch. The backplane crossbar can be extended to
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Backplane (Fabric)
an additional crossbar in a second backplane for a dual backplane configuration. The connection is through a
high-speed cable interface to the second backplane. This 12-cable high-speed interface replaces the flex cable
interface previously used on the Superdome system.
Ba ck p la n e Mon it or a n d Con t r ol
The backplane implements the following monitor and control functions.
- Backplane detect and enable functions to and from the CLU
- Backplane LED controls from the CLU
- Backplane J TAG distribution and chains
- Cabinet ID from the CLU
- Reset and power manager FPGA (RPM) and J TAG interface and header for external programming
- XBC reset, configuration and control
- IIC bus distribution to and from the CLU
- Clock subsystem monitor and control
- Power supply monitor and control
- Cell detect, power monitor, reset and rnable to and from the CLU
- J TAG and USB data distribution to and from each cell codule
- Cell ID to each cell module
- OSP FPGA functionality
I2C Bu s Dist r ib u tion
The sx2000 system I2C bus extends to the Superdome backplane (SDBP) assembly through a cable connected
from the CLU subsystem. This cable connects from J 17 on the CLU to J 64 on the SDBP. The clock and data
signals on this cable are buffered through I2C bus extenders on the CLU and on the backplane.
The I2C bus is routed to an I2C multiplexer on the backplane where the bus is isolated into four bus
segments. Three bus segments are dedicated to connections to the three RPMs. The remaining segment is
used to daisy-chain the remaining addressable devices on the bus. Each bus segment is addressed through a
port on the I2C multiplexer.
Clock Su bsystem
The backplane houses two hot-swap oscillator (HSO) modules. Each HSO board generates a system clock
which feeds into the backplane. Each HSO output is routed to the redundant clock source (RCS) module. The
RCS module accepts input from the two HSO modules and produces a single system clock, which is
distributed on the backplane to all cell modules and XBC ASICs.
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Backplane (Fabric)
Syst em Clock Dist r ib u t ion
The following system components receive the system clock are the eight cell boards that plug into to the
backplane, the six XBC crossbar switch chips on the system backplane. Two backplane clock power detectors
– one for each 8-way sine clock power splitter are on the RCS. The backplane power detector sits at the end of
the clock tree and measures the amplitude of the clock from the RCS to determine if it is providing a signal of
the correct amplitude to the cell boards and XBCs. Its output is also an alarm signal to the RPM FPGA.
System clocks can originate from four input sources: the single-ended external clock input MCX connector, the
280 MHz margin oscillator on the redundant clock source (RCS) board, or from one of the 266.667 MHz
oscillators on one of the HSO modules. The source selection is determined either by firmware or by logic in the
RCS.
The clock source has alarm signals to indicate the following health status conditions to the cabinet
management subsystem:
- Loss of power and loss of clock for each of the clock oscillator boards
- Loss of clock output to the backplanes
The sx2000 clock system differs from the sx1000 clock system in that the system clocks are only supplied to
the backplane crossbar ASICs and the cell boards. System clocks are not distributed to the I/O backplanes.
Instead, independent local clock distribution is provided on the I/O backplane.
H ot -Sw a p Oscilla t or
Two hot-swappable clock oscillators combine the outputs of both oscillators to form an N+1 redundant fault
tolerant clock source. The resultant clock source will drive clocks over connector and cable interfaces to the
system backplanes.
The hot-swap oscillator board contains a 266.667 MHz PECL oscillator. The output from this oscillator drives
a 266.667 MHz band-pass SAW filter that drives a monolithic IC power amplifier. The output of the power
amplifier is a 266.667 sine wave clock that goes to the RCS. The module also has two LEDs that are visible
through the module handle. One LED is green and the other is yellow. Table 1-1 describes the HSO LEDs.
The electrical signal that controls the LEDs is driven by the RCS.
Table 1-1
HSO LED Status Indicator Meaning
Gr een LE D
Yellow LED
Mea n in g
on
off
Module OK – HSO is producing a clock of the correct amplitude and
frequency and is plugged into its connector.
off
off
on
Module needs attention – HSO is not producing a clock of the
correct amplitude or frequency and is plugged into its connector.
off
Module power is off.
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Backplane (Fabric)
The HSO connects to the system backplane through an HMZD2X10 right-angle receptacle.
sx2000 R CS Mod u le
The sx2000 RCS module supplies clocks to the Superdome sx2000 backplane, communicates clock alarm to
the RPM, and accepts control input from the RPM. It has an I2C EEPROM on the module so that the the
firmware can inventory the module on system power up.
The RCS supplies 16 copies of the sine wave system clock to the sx2000 system backplane. Eight copies go to
the eight cell boards, six copies to the six XBCs on the system backplane, and two copies to the backplane
clock power detector.
In normal operation the RCS selects one of the two HSOs as the source of clocks for the platform. Which HSO
is selected depends whether the HSO is plugged into the backplane and on whether it has a valid output level.
This selection is overridden if there is a connection from the clock input MCX connector on the master
F igu r e 1-5
Loca t ion s of H SO a n d R CS
HSO 0
HSO 1
RCS
If only one HSO is plugged in and its output is of valid amplitude then it is selected. If its output is valid, then
a green LED on the HSO is lit. If its output is not valid, then a yellow LED on the HSO is lit and an alarm
signal is sent from the RCS to the RPM. The RCS provides a clock that is approximately 100 KHZ less than
the correct frequency even if the output of the HSOs are not of valid amplitude or no HSOs plugged in.
If both HSOs are plugged in and their output amplitudes are valid, then one of the two is selected as the clock
source by logic on the RCS. The green LEDs on both HSOs will be lit.
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Backplane (Fabric)
If one of the HSOs outputs does not have the correct amplitude then the RCS uses the other one as the source
of clocks and sends an alarm signal to the RPM indicating which oscillator failed. The green LED is lit on the
good HSO and the yellow LED is lit on the failed HSO.
If an external clock coax is connected from the master backplane clock output MCX connector to the slave
backplane clock input MCX connector then, this overrides any firmware clock selections. The clock source
from the slave backplane will be the master backplane.
If firmware selects the margin oscillator as the source of clocks, then it is the source of clocks as long as there
is no connection to the clock input MCX connector from the master backplane.
If the firmware selects the external margin clock SMB connectors as the source of clocks, then it is the source
of clocks as long as no connection exists to the clock input MCX connector from the master backplane.
Ca b in et ID
The backplane receives a 6-bit cabinet ID from the CLU interface connector J 64. The cabinet ID is buffered
and routed to each RPM and to each Cell module slot. The RPM decodes the cabinet number from the cabinet
ID and uses this bit to alter the cabinet number bit in the ALBID byte sent to each XBC through the serial bit
stream.
Cell ID
The backplane generates a 3-bit slot ID for each cell slot in the backplane. The slot ID and 5 bits from the
cabinet ID are passed on to each cell module as the cell ID.
Ba ck p la n e Pow er R equ ir em en t s a n d P ow er Distr ib u tion
The dc supply for the backplane assembly is from the cabinet power supply subsystem through two power
cables attached to the backplane. Connectors for the dc supply input have the same reference designators and
are physically located in the same position as on the Superdome system backplane. The power cables are
reused cable assemblies from the Superdome system and the supply connection is not redundant. One cable is
used for 5V housekeeping supply input and the second cable is used for 48 V supply input.
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Backplane (Fabric)
The backplane has two slots for power supply modules. The power supply connector for each slot has a 1-bit
slot address to identify the slot. The address bit for power supply slot 0 is grounded. The address bit for slot 1
is floating on the backplane. The power supply module provides a pull-up resistor on the address line on slot
1. The power supply module uses the slot address bit as bit A0 for generating a unique I2C address for the
FRU ID prom. Figures 1-7 and 1-8 identify and show the location of the backplane power supply modules.
F igu r e 1-6
Ba ck p la n e P ow er Su p p ly Mod u le
Each power supply slot has a power supply modle detect bit used to determine if the power supply module is
inserted into the backplane slot. This bit is routed to an input on the RPM's. The RPM provides a pull-up
resistor for logic 1 when the power supply module is missing. When the power supply module is inserted into
the slot, the bit is grounded by the power supply and logic 0 is detected by the RPM, indicating that the power
supply module is present in the backplane slot.
F igu r e 1-7
Ba ck p la n e (R ea r View )
Power Supply 0
Power Supply 1
XBC
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CPUs and Memories
CP Us a n d Mem or ies
The cell provides the processing and memory resources required by each sx2000 system configuration. Each
cell is comprises the following components: four processor module sockets, a single cell (or coherency)
controller ASIC, a high-speed crossbar interface, a high-speed I/O interface, eight memory controller ASICs,
capacity for up to 32 double-data rate (DDR) DIMMs, high-speed clock distribution circuitry, a management
subsystem interface, scan (J TAG) circuitry for manufacturing test, and a low-voltage DC power interface.
Figure 1-8 shows the locations of the major components.
F igu r e 1-8
Ce ll Boa r d
CPUs
CC
Memory
Power
Cell Con t r oller
The heart of the cell design is the cell controller (CC). The CC provides two front side bus (FSB) interfaces,
with each FSB connected to two processor modules. The communication bandwidth, 6.8 GBs sustained at
266.67 MH, on each FSB. this bandwidth is shared by the two processor modules on the FSB. Interfaces
external to the cell provided by the CC consist of three crossbar links, referred to as the fabric interface, and a
remote I/O subsystem link. The fabric interface enables multiple cells to communicate with each other across
a self-correcting, high-speed communication pathway. Sustained crossbar bandwidth is 8.5 GBs per link at 3.0
GT/s, or 25.5 GBs across the three links.
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CPUs and Memories
The remote I/O link provides a self-correcting, high-speed communication pathway between the cell and the
I/O subsystem through a pair of cables. Sustained I/O bandwidth is 5.5 GBs for a 50 percent inbound and
outbound mix, and roughly 4.2 GBs for a range of mixes. The CC interfaces to the cell's memory system. The
memory interface is capable of providing a sustained bandwidth of 14 to 16 GBs at 266.67 MH to the cell
controller.
P r ocessor In ter fa ce
The CC has two separate FSB interfaces, and each of those FSB is connected to two processor sockets in a
standard three-drop FSB configuration. The CC FSB interface is pinned out exactly like that of its
predecessor CC, in order to preserve past cell routing. The CC pin out was specifically designed to minimize
total routing delay without sacrificing timing skew between the FSB address and data and control signals.
Such tight routing controls allow the FSB to achieve a frequency of 266.67 MH, and the data to be
transmitted on both edges of the interface clock. With the 128-bit Front Side Bus capable of achieving 533.33
MT/s, the desired 8.5 GBs burst data transfer rate can be realized.
P r ocessor s
There are several processor families supported and the processors are already installed on the cell board. All
processors require that a minimum firmware version be installed. See Table 1-2 for the processors supported.
Table 1-2
Supported Processors and Minimum Firmware Version Required
Min im u m F ir m w a r e
P r ocessor Fa m ily
Cor e
F r eq u en cy
Ver sion or La ter
Itanium 2 single-core processors with 9 MB cache
Itanium 2 dual-core processors with 18 MB cache
Itanium 2 dual-core processors with 24 MB cache
4.3e (IPF SFW 004.080.000)
5.5d (IPF SFW 005.024.000)
5.5d (IPF SFW 005.024.000)
1.6 GHz
1.6 GHz
1.6 GHz
Rules for Processor Mixing
• Processor families can not be mixed on a cell board or within a partition
• Processor frequencies can not be mixed on a cell board or within a partition
• Cache sizes can not be mixed on a cell board or within a partition
• Major processor steppings can not be mixed on a cell board or within a partition
Cell Mem or y System
Each cell in the sx2000 system has its own independent memory system. This memory subsystem consists of
four logical memory subsystems that achieve a combined bandwidth of 17 GBs peak, 14-16 GBs sustained.
This cell design is the first of the Superdome designs to support the use of DDR I/O DRAM. These DIMMs are
to be based on DDR-II protocol, and the cell design supports DIMM capacities of 1, 2, 4 or 8 GBytes using
monolithic DRAMs. Non-monolithic, or stacked, DRAMS are not supported on the sx2000, as the additional
capacitive load, and/or requirement for additional chip selects is not accommodated by the new chipset. All
DIMMs used in the sx2000 are compatible with those used in other new CEC platforms, although other
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platforms may support DIMMs based on non monolithic (or stacked) DRAMs, which are incompatible with
the sx2000. There is no support for the use of the older SDRAM DIMMs designed for Superdome. Cell
F igu r e 1-9
Ce ll Mem or y
DIMMs are named according to both physical location and loading order. The physical location is used for
connectivity on the board, and is the same for all quads. Physical location is a letter (A or B) followed by a
number (0, 1, 2, or 3). The letter indicates which side of the quad the DIMM is on, A being the left side, or the
side nearest CC. The DIMMs are then numbered 0 through 3, starting at the outer DIMM and moving
inwards the memory controllers.
Mem or y Con t r oller
The memory controller CEC's primary function is to source address and control signals and multiplex
de-multiplex data between the CC and the devices on the DDR DIMMs. Four independent memory blocks,
consisting of two memory controllers and eight DIMMs, are supported by interface buses running between
the CC and the memory controller. The memory controller converts these link streams to the correct
signaling voltage levels (1.8 V) and timing for DDR2 protocol.
Bandwidth is limited by the memory interface buses that transfer data between the CC and the memory
controller. The memory controller also performs the write (tag update) portion of a read-modify-write (RMW)
access. The memory controller is bit sliced, and two are required to form one 72-bit CC memory interface data
(MID) bus. The CC MID buses are bidirectional, source synchronous, and run at 533.33 MT/s. The memory
side of a pair of memory controller ASICs consists of two 144-bit bidirectional DDR2 SDRAM data buses
operating at 533.33 MT/s. Each bus supports up to four echelons of DRAMs. An echelon consists of two
physical DIMMs (each 72-bits wide).
DIMM Ar ch it ectu r e
The fundamental building block of the DIMM is a DDR2 DRAM with a 4-bit data width. Each DIMM
transfers 72 bits of data on a read/write, and the data is double-clocked at a clock frequency of 266.67 MHz for
an effective peak transfer rate of 533.33 MT/s. Each DIMM comprises 36 DRAM devices for data storage and
two identical custom address buffers. These buffers fanout and check the parity of address and control signals
received from the memory controller. The new sx2000 chipset DIMMs have the same mechanical form factor
as the DIMMs used in Integrity systems, but the DIMM and the connector, will be keyed differently from
previous DIMM designs to prevent improper installation. The DIMM is roughly twice the height of an
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industry-standard DIMM. This increase in height allows the DIMM to accommodate twice as many DRAMs
as an industry-standard DIMM and to provide redundant address and control signal contacts not available on
industry-standard DDR2 DIMMs.
Mem or y In t er con n ect
MID bus data is transmitted via the four 72-bit, ECC-protected MID buses, each with a clock frequency equal
to the CC s core frequency. The data is transmitted on both edges of the clock, so the data transfer rate (533
MT/s) of each MID is twice the MID clock frequency (267 MHz). A configuration of at least eight DIMMs (two
in each quadrant) activates all four MID buses, and the theoretical bandwidth of the memory subsystem can
be calculated as follows: (533 MT/s * 8 Bytes/T * 4) = 17 GBs The MID buses are bit-sliced across two memory
controllers with 36-bits of data going to each memory controller. Each memory controller, in turn, takes that
high-speed data (533 MT/s) from the MID, and combines four consecutive MID transfers to form one 144-bit
DRAM bus. This DRAM bus is routed out in two 72-bit buses to two DIMM sets, which comprise four DIMMs
each. The DDR DRAM bus runs at 267 MT/s, and data is clocked on both edges of the clock.
The DDR DRAM address and control (MIA) signals for each quadrant originate at the CC and are routed to
the DIMMs through the memory controller. On previous systems, these signals did not touch the memory
chips. Instead they were routed to the DIMMs through fan-out buffers. The DRAM address and control
signals are protected by parity so that signaling errors are detected, and do not cause silent data corruption.
The MIA bus, comprised of the SDRAM address and control signals, is checked for parity by the memory
controller. Each of the thirty-two DIMMs can generating a unique parity error signal that is routed to one of
four parity error inputs per memory controller. Each memory controller then logically gates the DIMM parity
error signals it receives with its own internal parity checks for the MIC and MIT buses. This logical gating
results in a single parity error output that is driven to the CC and latched as an event in an internal
memory-mapped register.
Eight unique buses of command and control signals are transmitted from the CC to each memory controller
simultaneously with the appropriate MID bus interconnect. Each memory interface control (MIC) bus
comprises four signals running at 533 MT/s. Each command on the MIC bus takes four cycles to transmit, and
is protected by parity so that signaling errors are detected and not cause silent data corruption.
Four memory interface tag (MIT) buses are routed between the CC and the designated tag memory
controllers. MIT buses run at 533 MT/s and use the same link type as the MID buses. Each MIT bus
comprises six signals and a differential strobe pair for de-skewing. As with the MIA and MIC buses, the MIT
is protected by parity so that signaling errors will be detected and thus not cause silent data corruption.
Mixin g DIMMs of Differ en t sizes
Mixing of different sized DIMMs is allowed, provided the following rules are obeyed:
- An echelon of DIMMs consists of two DIMMs of the same type.
- All supported DIMM sizes may be present on a single cell board at the same time, provided previous rule is
satisfied.
- Memory must be added in increments of one echelon.
- The amount of memory contained in an interleaved group must be 2n bytes.
Mem or y In t er lea vin g
Memory is interleaved in the following ways on the new sx2000 systems:
- MBAT (across DIMMs)
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- Cellmap (across cells)
- Link (across fabrics)
Mem or y Ba n k At tr ib u t e Ta b le
The MBAT interleaving is done on a per-cell basis before the partition is rendezvoused. The cell map and
fabric interleaving are done after the partition has rendezvoused. SDRAM on the cell board is installed in
physical units called echelons. For the new sx2000, there will be 16 independent echelons. Each echlon
consists of two DDR DIMMs. Each rank can have multiple internal logical units called banks, and each bank
contains multiple rows and columns of memory. An interleaving algorithm is used to determine how a rank,
bank, row, or column address is formed for a particular physical address.
The 16 echelons in the memory subsystem can be subdivided as follows: Four independent memory quadrants
are accessed by four independent MID buses. Each quadrant contains two independent SDRAM buses. Four
echelons can be installed on each SDRAM bus. The CC contains four MBATs, one for each memory quadrant.
Each MBAT contains 8 sets of routing CSRs, or one per rank. Each routing CSR specifies the bits of the
address that are masked or compared to select the corresponding rank, referred to as interleave bits. The
routing CSR also specifies how the remaining address bits are routed to bank, row, and column address bits.
To optimize bandwidth, consecutive memory accesses are used to target echelons that are as far from each
other as possible. For this reason, the interleaving algorithm programs the MBATs so that consecutive
addresses target echelons in an order that skips first across quadrants, then across SDRAM buses, then
across echelons per SDRAM bus, then across banks per rank.
Cell Ma p
Cell mapping creates a scheme that is easy to implement in hardware and to enable calculation of the
interleaving parameters for software. In order to do this, part of the physical address performs a lookup into a
table which gives the actual physical cell and the ways of interleaving into memory at this address. In order to
accomplish this there are some constraints:
- A portion of memory that is being interleaved across must start at an offset that is a multiple of the memory
chunk for that entry. For example, to interleave across 16 GB of memory with one entry, the starting address
for this chunk must be 0 GB, 16 GB, 32 GB, 48 GB, and 64 GB. If using three 2 GB entries to interleave across
three cells, then the multiple must be 2 GB, not 6 GB.
- Interleaving is performed across the actual cells within the system. Interleaving may be done across a
minimum of 0.5 GB on a cell, and a maximum interleave across 256 GB per cell.
- Each cell in an interleave group must have the same amount of memory interleaved. That is, you cannot
interleave 2 GB in one cell and 4 GB in another cell.
Lin k In ter lea vin g
The link interleaving functionality did not exist in the sx1000. This logic is new for the sx2000 CC. The
sx2000 allows cells to be connected through multiple paths. In particular, each CC chip has three crossbar
links. When one CC sends a packet to another CC, it must specify which link to use.
The cell controller chip (CC) of the sx2000 chipset interfaces to processors, main memory, the crossbar fabric,
an I/O subsystem and processor dependent hardware (PDH). Two data path cpu bus interfaces are
implemented, with support for up to four processors on each bus. The address bus is 50 bits wide, but only 44
bits are used by the CC. Error correction is provided on the data bus and parity protection is provided on the
address bus.
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Mem or y E r r or P r otect ion
All of the CC cache lines are protected in memory by an error correction code (ECC). The sx2000 memory ECC
scheme is significantly different from the sx1000 memory ECC scheme. An ECC code word is contained in
each pair of 144-bit chunks. The memory data path (MDP) block is responsible for checking for and, if
necessary, correcting any correctable errors.
DR AM Er a su r e
A common cause of a correctable memory error is a DRAM failure, and the ability to correct this type of
memory failure in hardware is sometimes known as chip kill. Address or control bit failure is a common
cause. Chip kill ECC schemes have added hardware logic that allows them to detect and correct more than a
single data bit error when the hardware is programmed to do so. A common implementation of traditional
chip kill is to scatter data bits from each DRAM component across multiple ECC codewords, such that only
one bit from each DRAM is used per ECC codeword.
Double chip kill is an extension to memory chip kill that enables the system to correct multiple ECC errors in
an ECC code word. HP labs developed the ECC algorithm and the first implementation of this technology is in
platforms using the sx2000 chipset. Double chip kill is also known as DRAM erasure.
DRAM erasure is invoked when the number of correctable memory errors exceeds a threshold and can be
invoked on a memory subsystem, bus, rank or bank. PDC tracks the errors that are seen on a memory
subsystem, bus, rank and bank in addition to the error information it tracks in the PDT.
P DC F u n ction a l Ch a n ges
There are three primary threads of control in the processor dependant code (PDC): the bootstrap, the errors
code, and the PDC procedures. The bootstrap is the primary thread of control until the OS is launched. The
boot console handler (BCH) acts as a user interface for the bootstrap, but can also be used to diagnose
problems with the system by HP support.
The PDC procedures are the primary thread of control once the OS has launched. Once the OS has launched,
the PDC code is only active when the OS calls a PDC procedure or there is an error that causes the error code
to be called.
If a correctable memory error occurs during run time, the new chipset logs the error and corrects it in memory
(reactive scrubbing). Diagnostics periodically read memory module states to read the errors logs. When this
PDC call is made, system firmware updates the PDT, and deletes entries older than 24 hours in the structure
that counts how many errors have occurred for each memory subsystem, bus, rank or bank. When the counts
exceed the thresholds, PDC will invoke DRAM erasure on the appropriate memory subsystem, bus, rank or
bank. Invoking DRAM erasure does not interrupt the operation of the OS.
When PDC invokes DRAM erasure, the information returned by reading memory module states indicate the
scope of the invocation and provides information to allow diagnostics to determine why it was invoked. PDC
also sends IPMI events indicating that DRAM erasure is in use. When PDC invokes DRAM erasure, the
correctable errors that caused DRAM erasure are removed from the PDT. Because invoking DRAM erasure
increases the latency of memory accesses and reduces the ability of ECC to detect multi bit errors, it is
important to notify the customer that the memory subsystem needs to be serviced. HP recommends that the
memory subsystem is serviced within a month of invoking DRAM erasure on a customer machine.
The thresholds for invoking DRAM erasure are incremental so that PDC invokes DRAM erasure on the
smallest part of memory subsystem necessary to protect the system against a another bit being in error.
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P la tfor m Dep en d a n t Ha r d w a r e
The platform dependent hardware's (PDH) includes functionality that is required by both system and
management firmware. Features provided by the PDH provide the following features:
- An interface that is capable of passing multiple forms of information between system firmware and the
management processor (MP, on the SBC) by the platform dependant hardware controller (PDHC, on the PDH
daughter card)
- Flash EPROM for PDHC boot code storage.
- PDHC SRAM for operational instruction and data storage
- System management bus (SMBus) for reading the processor module's information EEPROM, scratch
EEPROM, and thermal sensing device
- I2C Bus for reading PDH, cell, and cell power board FRU ID information
- Serial presence detect (SPD) bus for detection and investigation of loaded DIMMs
- PDH resources accessible by the processors (system firmware) and the management subsystem.
- Flash EPROM for system firmware boot-strap code storage and update capability.
- Battery-backed NVRAM and real time clock (RTC) chip to provide wall-clock time
- Memory-mapped registers for configuration related information
Reset
The sequencing and timing of reset signals is controlled by the LPM, a field-programmable gate array (FPGA)
that resides on the cell. The LPM is powered by the housekeeping rail and has a clock input from the PDH
daughter card that runs continuously at 8 MHz. This enables the LPM and the rest of the utility subsystem
interface to operate regardless of the power state of the cell.
Cell reset can be initiated from multiple sources:
- Power enable of the Cell (initial power-on)
- Backplane Reset will cause installed cells to reset or cell reset initiated from PDHC in direct response to an
MP command or during a system firmware update
- System firmware-controlled "soft" reset initiated by writing into the Dillon Test and Reset register
Cell OL*
For an online add (OLA) of a cell, the CC goes through the normal power-on reset sequence.
For an online delete (OLD) of a cell, software does clean up to the I/O (SBA) interface to put it in reset mode
and hold it there. When the I/O (SBA) link is held in reset, the cell is ready for power to be turned off and the
cell to be removed.
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I/O Subsystem
I/O Su b syst em
The sx2000 I/O backplane (SIOBP) is an update of the sx1000 I/O backplane, with a new set of chips that
increase the board’s internal bandwidth and support the newer PCI-X 2.0 protocol. The sx2000 I/O backplane
uses most of the same mechanical parts as the sx1000 I/O backplane. The connections between the I/O chassis
and the rest of the system have changed. The cell board to I/O backplane links are now multichannel,
high-speed serial (HSS) based rather than the earlier parallel-type interface. Because of this, the sx2000 I/O
backplane is intended to be paired with the sx2000 cell board and is not backward compatible with earlier
Superdome cell boards. The term “PCI-X I/O chassis” refers to the assembly containing an SIOBP. All slots
are capable of supporting both PCI and PCI-X cards.
A new concept for the sx2000 is that of a fat rope. A fat rope is logically one rope that has 32 wires. It consists
of two single ropes but has the four command wires in the second single rope removed. The concept of a single
rope remains unchanged. It has 18 signals, of which 10 are bidirectional, single-ended address and data bits.
There are also two pairs of unidirectional, single-ended lines that carry commands in each direction and a
differential strobe pair for each direction. These are all “enhanced ropes,” which support double the
bandwidth of plain ropes and additional protocol behavior. Ropes transfer source-synchronous data on both
edges of the clock and can run at either of two speeds.
The major components in the I/O chassis are the system bus adapter (SBA) ASIC and 12 logical bus adapter
(LBA) ASICs. The high speed serial (HSS) links (one inbound and one outbound) are a group of 20 high-speed
serial differential connections using a cable that allows the I/O chassis to be located as much as 14 feet away
from the cell board. This allows the use of an I/O expansion cabinet to provide more I/O slots than will fit in
the main system cabinet.
Enhanced ropes are fast, narrow links that are connected singly or in pairs between the SBA and four specific
LBAs. Fat ropes are enhanced dual-width ropes that are treated logically as a single rope.
A PCI-X I/O chassis is an assembly consisting of four printed circuit assemblies (the PCI-X I/O backplane, the
PCI-X I/O power board, the PCI-X I/O power transfer board, and the doorbell board) plus the necessary
mechanical components required to support 12 PCI card slots.
The master I/O backplane provides easy connectivity for the I/O chassis. The HSS link and utilities signals
come through the master I/O backplane. Most of the utilities signals travel between the UGUY and the I/O
backplane, with a few passing through to the I/O power board. The I/O power board contains all the power
converters that produce the various voltages needed on the I/O backplane. Both the I/O backplane and the I/O
power board have FRU EEPROMs. An I/O power transfer board is a simple assembly that provides the
electrical connections for power and utility signals between the I/O backplane and I/O power board.
P CI-X Ba ck p la n e F u n ct ion a lity
The majority of the functionality of a PCI-X I/O backplane is provided by a single SBA ASIC plus 12 LBA
ASICs (one per PCI slot). A dual-slot-hot plug controller chip plus related logic is also associated with each
pair of PCI slots. The SBA is the primary I/O component. Upstream, the SBA communicates directly with the
cell controller CC ASIC of the host cell board via a high-bandwidth logical connection known as the HSS link.
Downstream, the SBA spawns 16 logical ropes that communicate with the LBA PCI interface chips. Each PCI
chip produces a single 64-bit PCI-X bus supporting a single PCI or PCI-X add-in card. The SBA and the CC
are components of the sx2000 and are not compatible with the legacy or Integrity CECs.
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SBA Ch ip : CC-t o-R op es
The SBA chip communicates with the CC on the cell board via a pair of high-speed serial unidirectional links
known as HSS or E-links. Each unidirectional E-link consists of 20 serial 8b/10b encoded differential data bits
operating at 2.36 GT/s. This yields a peak total bidirectional HSS link bandwidth of 8.5 GB/s. Internally, SBA
routes this high-speed data to/from one of two rope units. Each rope unit spawns four single ropes and four fat
ropes. A maximum of 2 like ropes can connect to an LBA.
In a default configuration, ropes operate with a 133 MHz clock and so have 266 MT/s for a peak bandwidth
266 MB/s per single rope. In the enhanced configuration, ropes operate with a 266 MHz clock and so have 533
MT/s for a peak bandwidth 533 MB/s per single rope. On the SIOBP, firmware is expected to always configure
the 266 MHz enhanced ropes.
Ropes can be connected to LBAs either individually or in pairs. A single rope can sustain up to PCI 4x data
rates (full bandwidth support for a 64-bit PCI card at 33 or 66 MHz or for a 64-bit PCI-X card at 66 MHz or for
a 32-bit PCI-X card at 133 MHz). A dual rope or fat rope can sustain PCI 8x data rates (64-bit PCI-X card at
133 MHz). A dual fat rope can sustain PCI 16x data rates (64-bit PCI-X card at 266 MHz). Because of the
internal architecture of the SBA, when two ropes are combined, they must be adjacent even/odd pairs. Ropes
0 and 1 can be combined, but not 1 and 2. The two paired ropes must also be of the same type: either single or
fat.
The location of the ropes on the SBA chip determines the rope mapping to PCI slots on the I/O backplane.
F igu r e 1-10
I/O R op e Ma p p in g
Slot 0 (PCI-X 133/66
Slot 1(PCI-X 133/66
Slot 2(PCI-X 133 MHz)
0
LBA
1
4
2
3
LBA
LBA
LBA
Slot 3(PCI-X 133 MHz)
Slot 4(PCI-X 133 MHz)
Slot 5(PCI-X 266 MHz)
5
6
7
LBA
LBA
14
15
SBA
LBA
Slot 6(PCI-X 266 MHz)
Slot 7(PCI-X 133 MHz)
13
12
9
Slot 8(PCI-X 133 MHz)
10
11
Slot 9(PCI-X 133 MHz)
Slot 10 (PCI-X 133/66
Slot 11 (PCI-X 133/66
8
LBA
HMIOB
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P CI Slot s
For maximum performance and availability, each PCI slot is sourced by its own LBA chip and is supported by
its own portion of a hot-plug controller. All slots are designed to Revision 2.2 of the PCI specification and
Revision 2.0a of the PCI-X specification and can support full size. Shorter and smaller cards are supported, as
are 32-bit cards.
Slot 0 support for the core I/O card has been removed on the SIOBP. The core I/O provided a base set of I/O
functions required by Superdome protection domains. In past Superdomes, PCI slot 0 of the I/O backplane
provided a secondary edge connector to support a core I/O card. In the sx2000 chipset, the core I/O function
has been moved onto the PDH card so the extra core I/O sideband connector has been removed from the
SIOBP board.
The SIOBPs ten outermost slots support only 3.3 V signaling (PCI or PCI-X Mode 1). The two innermost slots
support either 3.3 V or 1.5 V (PCI-X Mode 2) signaling. All SIOBP PCI connectors physically prevent 5 V
signaling cards from being installed.
P CI H ot Sw a p Su p p or t
Associated with each pair of PCI slots is a dual-slot hot-swap controller IC plus an assortment of power FETs,
indicator LEDs, and other discrete components. These components enable the online addition, replacement,
and deletion of individual PCI cards without disturbing the operation of other cards in the system. LBAs
provide the control/status signals and internal registers necessary for firmware to control and monitor the
power status of a PCI slot. LBAs also provide firmware control of the attention LED. The slot state LEDs are
driven directly by the hot swap controller IC.
I/O Ba ck p la n e System Con n ect ion s
The connector used for system interconnects to and from the I/O backplane is a modular 2mm hard metric
connector with modules for the HSS link, clocks, and various control signals. In order to support both the
12-slot and the future 6-slot variations of the I/O backplane, four groups of connector modules are provided on
the master I/O backplane for the 24 possible PCI slots, with HSS link, clock, and control connections available
in each group. Even though the width of the SIOBP 12-slot backplane causes it to span two connector groups,
it connects only to the signals in one of these groups. Each connector module group is made up of two
connectors.
I/O Ba ck p la n e P ow er
48 V and 5 V housekeeping for the I/O chassis is brought into the I/O power board from cable assemblies that
are supported directly by the sheet metal of the I/O system sub-frame in the cabinet. On the I/O Power board,
the 48V is converted to +1.5, +3.3, +5, +12, and –12, and brought up through the I/O power transfer board.
+5V housekeeping is also brought up, for the SIOBP FPGA, FRU ID Serial EEPROM, and for the chassis ID
buffers.
P ow er Seq u en cin g
Both the SBA and LBA (Mercury) devices have requirements regarding the order in which the power rails are
brought up. This function is performed by the SIOBP FPGA (formerly called the LPM FPGA when it was on
the SIOPB). The power-on sequence is as follows: 1. +12 V, -12 V 2. +5 V 3. +1.5 V 4. +3.3 V and +2.5 V
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together 5.V +3.3 V auxilary will be on whenever AC is applied. The SIOBP FPGA is responsible for ensuring
that each voltage is stable before enabling the next voltage. The power-down sequence is the opposite of the
power-up sequence, turning off the 3.3 V voltage first and finally turning off the two 12 V supplies.
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New Server Cabling
New Ser ver Ca b lin g
Most of the Superdome cables remain unchanged except three cables designed for the sx2000 to improve data
rate and electrical performance: nn M-link cable, two types (lengths) of L-link cable, and a clock cable.
M-Lin k Ca b le
The M-link cable (A9834-2002A) is the primary backplane to 2nd cabinet backplane high speed interconnect.
The M-link cable connects XBCs between system and I/O backplanes. The cable uses 4x10 HMZD connectors
with Amphenol Spectra-Strip 26AWG twin-ax cable material. The M-link cable is designed with one length
but it is used in several connecting points. Thus, excessive cable length should be managed carefully. The
ideal routing keeps M-link cables from blocking access of power and XBC modules. Twelve high speed cables
should be routed around the backplane frame with the support of mechanical retentions. M-link cable is
designed with a more robust dielectric material than the legacy REO cable and can withstand a tighter bend
radius. However, it is desirable to keep the minimum bend radius at 2 inches.
E-Lin k Ca b le
The E-link cables (A9834-2000B) are seven feet long cables and the external E-link cable (A9834-2001A) is 14
feet long. Both use 2 mm HM connectors with Gore 26AWG PTFE twin-ax cable material. The E-link cable
and connects the cell to the local I/O chassis, and the external E-link cable connects the cells to a remote
PCI-X chassis. Because both E-link and external E-link use the same cable material as the legacy REO cable,
cable routing and management of these cables in sx2000 system remain unchanged relative to SuperDome.
External E-link cable requires bend radius no smaller than 2 inches. The E-link cable requires bend radius no
smaller than 4 inches.
During system installation two internal E-link or two external E-link cables are needed for each cell board
and I/O backplane. Twelve M-link cables are needed for each dual-cabinet configuration.
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Firmware
F ir m w a r e
The newer Intel Itanium® Processor firmware consists of many components loosely coupled by a single
framework. These components are individually linked binary images that are bound together at run time.
Internally, the firmware employs a software database called a device tree to represent the structure of the
hardware platform and to provide a means of associating software elements with hardware functionality.
The IPF firmware incorporates the following main interfaces:
- Processor Abstraction Layer (PAL) provides a seamless firmware abstraction between the processor, the
system software and the platform firmware
- System Abstraction Layer (SAL) provides a uniform firmware interface and initializes and configures the
platform
- Extensible Firmware Interface (EFI) provides an interface between the OS and the platform firmware
Provides a standard environment for booting by using data tables that contain platform-related information,
boot, and runtime service calls that are available to the operating system and its loader.
The Advanced Configuration and Power Interface (ACPI) provides a new standard environment for
configuring and managing server systems. It moves system configuration and management from the BIOS to
the operating system and abstracts the interface between the platform hardware and the OS software,
thereby allowing each to evolve independently of the other.
The firmware supports HP-UX 11i version 2, Linux, Windows, and OpenVMS through the Itanium®
processor family standards and extensions. It includes no operating systems specific functionality. Every OS
is presented the same interface to system firmware, and all features are available to the OS. One exception to
this is that Windows Server 2003 Datacenter does not support the latest ACPI specification (2.0). The
firmware must provide legacy (1.0b) ACPI tables for that OS. Using the acpiconfigcommand, the ACPI
tables presented to the operating system are different. The firmware implements the standard Intel
Itanium® Processor family interfaces with some implementation-specific enhancements that the operating
system can use but is not required to use.
User Interface
Itanium® Processor family firmware employs a user interfaces called the Pre-OS system startup environment
(POSSE). The POSSE Shell is based on the EFI Shell. Several commands have been added to the EFI Shell to
support HP value-added functionality. The new commands encompass functionality similar to BCH
commands on PA-RISC machines. However, the POSSE Shell is not designed to encompass all BCH
functionality. They are separate and distinct interfaces.
Event IDs for Errors and Events
The new system firmware generates event IDs, similar to chassis codes, for errors, events, and forward
progress to the MP through common shared memory. The MP interprets, stores, and reflects these event IDs
back to running partitions. This helps in the troubleshooting process.
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Overview
Server Configurations
Ser ver Con figu r a t ion s
Refer to the HP System Partitions Guide (5990-8170A) for extensive details on the topic of proper
configurations. Also, an interactive program found on the PC SMS, titled “Superdome Partitions Revisited,”
can be very useful.
Basic Configuration Rules
Single-cabinet system:
- Two to 32 CPUs per complex with single-core processors
- Four to 64 CPU cores per complex with dual-core processors
- Minimum of one cell
- Maximum of eight cells
Dual-cabinet system:
- 6 to 64 CPU cores per complex with single-core processors
- Twelve to 128 CPU cores per complex with dual-core processors
- Minimum of 3 cells
- Maximum of 16 cells
- No master/checker support for dual-core processors
The governing rules for mixing processors is as follows:
- No mixing of frequencies on cell or intra-partition
- No mixing of cache sizes on cell or intra-partition
- No mixing of major steppings on cell or intra-partition (TBD)
- No support for IA and PA processor within the same complex
Maximum of 32 DIMMs per cell.
- 32 GB memory per cell with 256 Mb SDRAMs (1 GB DIMMs)
- 64 GB memory per cell with 512 Mb SDRAMs (2 GB DIMMs)
- DIMM mixing is allowed
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Overview
Server Errors
Ser ver E r r or s
To support high availability (HA), the new chipset has included functionality to do error correction, detection
and recovery. Errors in the new chipset are divided into the following categories:
- Protection domain access
- Hardware correctable
- Global shared memory
- Hardware uncorrectable
- Fatal
- Blocking timeout
- Deadlock recovery errors
These categories are listed in increasing severity, ranging from protection domain (PD) access errors, which
are caused by software or hardware running in another PD, to deadlock recovery errors, which indicate a
serious hardware failure that requires a reset of the cell to recover. The term "software" refers to privileged
code, such as PDC or the OS, but not to user code. The sx2000 chipset supports the PD concept, where user
and software errors in one PD cannot affect another PD.
P r otection Dom a in Access Er r or s
PD access errors are caused by transactions outside the PD that are not allowed. Packets from outside the
coherency set should not impact the interface, and some packets from within the coherency set but outside
the PD are handled as a PD access error. These errors typically occur due to a software error or to bad
hardware in another PD. These errors do not indicate a hardware failure in the reporting cell.
An example of a PD access error is an interrupt from a cell outside the PD that is not part of the interrupt
protection set. For these errors, the sx2000 chipset typically drops the transaction or converts it to a harmless
transaction, and logs the error. No error is signaled. PD access level errors themselves do not result in the
block entering No_shared mode or fatal error mode.
Ha r d w a r e Cor r ected E r r or s
Hardware correctable errors are errors that can be corrected by hardware. A typical example of a hardware
correctable error is a single bit ECC error. For these errors, the sx2000 chipset corrects and logs the error. No
direct notification is given to software that an error has occurred (no LPMC is generated). For firmware or
software to detect that an error has occurred, the error logs must be read.
Globa l Sh a r ed Mem or y Er r r or s
Global shared memory (GSM) is a high performance mechanism for communication between separate PDs
using GNI memory without exposing your PD to hardware or software failures of the other PD. Each PD
supports eight sharing ranges. Each of these ranges is readable and writable within the PD, and
programmable to be read_only or readable writable to other PDs. Ranges of memory, called sharing windows,
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Overview
Server Errors
are opened between PDs when it is established that the PDs are up and communication between them is
open. When there is a failure in GSM, the goal is to close the sharing windows between those two cells but not
to affect sharing windows to other cells.
There are two methods to detect GSM errors. The first method is a software-only-method, in which software
wraps data with a CRC code and sequence number. Software checks this for each buffer transferred. The
second method has some hardware assistance: the hardware sets some CSR bits whenever a GSM error
occurs. Software checks the CSR bits before using the data.
Ha r d w a r e Un cor r ect a b le E r r or s
Hardware uncorrectable errors are detected by the hardware and signaled to software, from which software is
able to recover. For some of these errors, the hardware must behave differently to enable software recovery.
Fa ta l Er r or s
Fatal errors are unrecoverable errors that usually indicate a loss of data. The system prevents committing
corrupt data to disk or network, and logs information about the error to aid diagnosis. No software recovery of
system fatal errors is possible when a system fatal error has been detected. The goal of the sx2000 chipset and
PDC is to bring all interfaces in this PD into fatal error (FE) mode, signal an HPMC, and guarantee a clear
path to fetch PDC. PDC then saves the error logs, cleans up the error logs, and calls the OS HPMC handler.
The OS then makse a memory dump and reboot.
Block in g Tim eou t Fa t a l Er r or s
Blocking timeout errors occur when an interface detects that a required resource is blocked. Timeout errors
that occur when a specific transaction does not complete (TID timeouts) are not considered blocking timeout
errors. When a blocking timeout error has occurred, the interface tries to prevent queues in other interfaces,
cells, and PDs from backing up by throwing away transactions destined for the blocked resource and
returning flow control credits.
Dea d lock Recover y R eset E r r or s
Deadlock errors are unrecoverable errors that indicate that the chipset is in a deadlock state and must be
reset to enable the CPU to fetch PDC code. Deadlock errors are caused by a defective chipset or CPU (or a
functional bug).
NOTE
After the sx2000 chipset is reset, all GSM sharing regions are disabled, thus providing error
containment and preventing any corruption from spreading to other PDs.
Er r or Loggin g
Hardware error handling can be broken into four phases: detection, transaction handling, logging, and state
behavior.
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Server Errors
1. Detection is the hardware checks that realize an error has occurred.
2. Transaction handling modifies how the hardware treats the tmansaction with the detected error.
3. Logging is storing the error indication in the primary error mode register, which sets the error state for the
block.
4. State behavior is any special actions taken in the various error states.
It is preferred that most errors not result in any special transaction handling by the hardware but rather
handled by state behavior. For instance, it is preferable to take a link down because a block is in fatal error
mode rather than because a packet arrived with a particular error. Using error state behavior is preferred
because it eliminates many corner case, and makes verification somewhat easier. It is also possible to test
error state behavior by inserting errors in the primary error mode register using software setting bits. Testing
transaction handling requires actually creating the error.
The error strategy provides a way to mask logging all errors (the error enable mask register) and so it
provides a mechanism to avoid error states and the subsequent state behavior.
For instance, if a link goes down when the block is in fatal error mode, and a multibit error puts a block in
fatal error mode, just clearing the enable bit for the error will avoid the need to take the link down.
Unfortunately, some errors require transactional error handling. The sx2000 chipset approach provides
separate CSR configuration bits to mask the transactional handling for these errors independent of the error
enable mask register when it seems appropriate.
Although the content of each interface's error logs and status registers are different, the programming model
for each is the same.
1. Firmware initializes the error enable mask register in each interface at boot time. The default
configuration in hardware is to mask all errors. Firmware may also choose to configure the error upgrade
registers.
2. Hardware detects an error and sets a symptom bit in the interface's primary error mode register. The
corresponding error log is updated with the new error. No other errors of that type will be logged until the
first is cleared. Subsequent errors of the same type will force bits to be set in the secondary error mode
register.
3. Firmware checks the primary error mode register and sees a bit set.
4. Firmware reads the appropriate error log and does some error handling code. More information may exist
in the secondary error mode register and the error order status register.
5. If fatal error mode is being cleared, set the error enable mask register to mask the errors, "Received packet
with FE bit set" and "FE wire set" in all interfaces.
6. Firmware clears the symptom bits in the primary and secondary error mode registers. Firmware should
read the secondary register and save its value, and then read the primary register. Firmware should handle
the errors indicated in the saved values, but can read the associated logging registers any time. To clear the
error modes, firmware writes the saved secondary register value to the “clear” address, and then writes the
saved primary register value to its “clear” address. This ensures only errors that have been seen by firmware
are cleared. Clearing the primary error mode register will stop the hardware from setting the FE bits in
outgoing packets. Firmware checks to make sure that both registers have all bits of the particular error type
“cleared”. If they are not cleared, then additional errors have occurred and the data in the associated log
registers may be invalid.
7. Plunge all transactions to clear any queues with FE bit set.
8. Unmask errors in the error enable mask register.
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2 System Sp ecifica tion s
The following specifications are based on ASHRAE Class 1. Class 1 is a controlled computer room
environment, in which products are subject to controlled temperature and humidity extremes. Throughout
this chapter each specification is defined as thoroughly as possible to ensure that all data is considered, to
ensure a successful site preparation and system installation. See also Site Preparation Guide: HP High-End
and Mid-Range Servers, First Edition, part number A7025-96015, at the http://docs.hp.com Web site.
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System Specifications
Dimensions and Weights
Dim en sion s a n d Weigh t s
This section contains server component dimensions and weights for the system.
Com p on en t Dim en sion s
Table 2-1 lists the dimensions for the cabinet and components. Table 2-2 list the dimensions for optional I/O
expansion (IOX) cabinets.
Ta b le 2-1
Se r ve r Com p on en t Dim e n sion s
Ma xim u m
Qu a n t ity p er
Ca b in et
Wid t h
(in / cm )
Dep t h
(in / cm )
H eigh t
(in / cm )
Com p on en t
Cabinet
30 / 76.2
48 / 121.9
77.2 / 195.6
3.0 / 7.6
1
a
Cell board
16.5 / 41.9
16.5 / 41.9
20.0 / 50.2
8
8
Cell power board
(CPB)
10.125 / 25.7
3.0 / 7.6
I/O backplane
11 / 27.9
3.25 / 8.3
17.6 / 44.7
1
1
Master I/O
backplane
23.75 / 60.3
1.5 / 3.8
I/O card cage
PDCA
12.0 / 30.5
7.5 / 19.0
17.5 / 44.4
11.0 / 27.9
8.38 / 21.3
9.75 / 24.3
4
2
a. SD16 is limited to a maximum of 4.
Ta b le 2-2 I/O E xp a n sion Ca bin et Com p on en t Dim e n sion s
Ca b in et Typ e
H eigh t
(in / cm )
Wid th
(in / cm )
Dep th
(in / cm )
E33
E41
63.5 / 161
77.5 / 197
23.5 / 59.7
23.5 / 59.7
77.3 / 196.0
36.5 / 92.7
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System Specifications
Dimensions and Weights
Com p on en t Weigh t s
Table 2-3 lists the server and component weights. Table 2-4 lists the weights for optional I/O expansion (IOX)
cabinets.
NOTE
Refer to the appropriate documents to determine the weight of the Support Management
Station (SMS) and any console that will be used with this server.
Ta b le 2-3
Syst em Com p on en t We igh t s
Weigh t Per
Com p on en t
Un it
Qu a n tity
Weigh t (lb / k g)
(lb / k g)
a
745.17 / 338.1
1
745.17 / 338.10
Chassis
Cell board without power board and DIMMs 30.96 / 14.04
8
247.68 / 112.32
68.00 / 30.88
51.20 / 23.04
23.00 / 10.44
52.00 / 23.59
146.00 / 66.24
21.60 / 9.80
Cell power board
8.50 / 3.86
0.20 / 0.09
3.83 / 1.74
26.00 / 11.80
36.50 / 16.56
0.45 / 0.20
8
DIMMs
256
6
Bulk power supply
PDCA
2
I/O card cage
4
I/O cards
48
1
b
Fully configured server (SD32 cabinet)
1354.65 / 614.41
b. The listed weight for a fully configured cabinet includes all components and quantities listed
Ta b le 2-4
I/O E xp a n sion Ca bin et Weigh t s
a
Com p on en t
Weigh t (lb / k g)
Fully configured cabinet
I/O card cage
1104.9 / 502.2
36.50 / 16.56
264 / 120
Chassis
a. The listed weight for a fully configured cabinet includes all
items installed in a 1.6 meter cabinet. Add approximately 11
lb when using a 1.9 meter cabinet.
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System Specifications
Dimensions and Weights
Sh ip p in g Dim en sion s a n d Weigh ts
Table 2-5 lists the dimensions and weights of the Support Management Station and a single cabinet with
shipping pallet.
Ta b le 2-5
Miscella n eou s Dim en sion s a n d Weigh t s
Wid t h
(in / cm )
Dep t h /Len gt h
(in / cm )
H eigh t
(in / cm )
Weigh t
(lb / k g)
E q u ip m en t
System on shipping
39.00 / 99.06
48.63 / 123.5
73.25 / 186.7
1471.24 / 669.79
a b c
pallet
Blowers/frame on
shipping pallet
40.00 / 101.6
38.00 / 96.52
48.00 / 121.9
48.00 / 121.9
62.00 / 157.5
88.25 / 224.1
99.2 / 45.01
1115 / 505.8
I/O expansion
cabinet on shipping
d
pallet
a. Shipping box, pallet, ramp, and container add approximately 116 lb (52.62 kg) to the total system
weight.
b. Blowers and frame are shipped on a separate pallet.
c. Size and number of miscellaneous pallets are determined by the equipment ordered by the
customer.
d. Assumes no I/O cards or cables installed. The shipping kit and pallet and all I/O cards add
approximately 209 lb (94.80 kg) to the total weight.
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System Specifications
Electrical Specifications
Elect r ica l Sp ecifica t ion s
The following specifications are based on ASHRAE Class 1. Class 1 is a controlled computer room
environment, in which products are subject to controlled temperature and humidity extremes. Throughout
this chapter each specification is defined as thoroughly as possible to ensure that all data is considered to
ensure a successful site preparation and system installation.
Gr ou n d in g
The site building must provide a safety ground/protective earth for each ac service entrance to all cabinets.
CAUTION
This equipment is Class 1 and requires full implementation of the grounding scheme to all
equipment connections. Failure to attach to protective earth results in loss of regulatory
compliance and creates a possible safety hazard.
Cir cu it Br ea k er
Each cabinet using a 3-phase, 4-wire input requires a dedicated circuit breaker to support the Marked
Electrical current of 44 A per phase. The facility electrician and local service codes will determine proper
circuit breaker selection.
Each cabinet using a 3-phase 5-wire input requires a dedicated circuit breaker to support the Marked
Electrical current of 24 A per phase. The facility electrician and local service codes will determine proper
circuit breaker selection.
NOTE
When using the minimum sized breaker, always choose circuit breakers with the maximum
allowed trip delay to avoid nuisance tripping.
Pow er Op tion s
Table 2-6 describes the available power options. Table 2-7 provides details about the available options. The
options listed are consistent with options for earlier Superdome systems.
Ta b le 2-6
Ava ila ble P ow er Op tion s
In p u t Cu r r en t
P er P h a se 200
Sou r ce
Typ e
Sou r ce Volt a ge
(Nom in a l)
P DCA
R eq u ir ed
P ow er R ecep t a cle
R eq u ir ed
Op t ion
a
to 240 V a c
6
3-phase Voltage range 200
to 240 V ac,
4-wire
44 A maximum
per phase
Connector and plug
provided with a 2.5 meter
(8.2 feet) power cable.
Electrician must hard wire
receptacle to 60 A site
power.
phase-to-phase,
50 Hz / 60 Hz
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System Specifications
Electrical Specifications
Ta b le 2-6
Ava ila ble P ow er Op tion s (Con t in u e d )
In p u t Cu r r en t
P er P h a se 200
Sou r ce
Op t ion
Sou r ce Volt a ge
(Nom in a l)
P DCA
R eq u ir ed
P ow er R ecep t a cle
R eq u ir ed
Typ e
a
to 240 V a c
7
3-phase Voltage range 200
to 240 V ac,
5-wire
24 A maximum
per phase
Connector and plug
provided with a 2.5 meter
(8.2 feet) power cable.
Electrician must hard wire
receptacle to 32 A site
power.
phase-to-neutral,
50 Hz / 60 Hz
a. A dedicated branch circuit is required for each PDCA installed.
Ta b le 2-7
Op t ion 6 a n d 7 Sp e cifics
P DCA
P a r t Nu m b er
R ecep t a cle
R eq u ir ed
At t a ch ed P ow er Cor d
At t a ch ed P lu g
A5201-69023
(Option 6)
OLFLEX 190 (PN 600804) is a 2.5 meter (8.2 feet) Mennekes
Mennekes
ME 460R9
multi conductor, 600 V, 90° C, UL and CSA
ME 460P9
approved, oil resistant flexible cable (8 AWG 60 A (60 A capacity)
capacity).
(60 A capacity)
A5201-69024
(Option 7)
H07RN-F (OLFLEX PN 1600130) is a 2.5 meter
(8.2 feet) heavy-duty neoprene-jacketed
Mennekes
ME 532P6-14
(32 A capacity)
Mennekes
ME 532R6-1500
(32 A capacity)
2
harmonized European flexible cable (4 mm 32 A
capacity).
NOTE
A qualified electrician must wire the PDCA receptacle to site power using copper wire and in
compliance with all local codes.
All branch circuits used within a complex must be connected together to form a common ground. All power
sources such as transformers, UPSs, and other sources, must be connected together to form a common ground.
When only one PDCA is installed in a system cabinet, it must be installed as PDCA 0. Refer to Figure 2-1 for
the location of PDCA 0.
NOTE
When wiring a PDCA, phase rotation is unimportant. When using two PDCAs, however, the
rotation must be consistent for both.
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System Specifications
Electrical Specifications
F igu r e 2-1
P DCA Loca tion s
PDCA 1
PDCA 0
System Pow er R equ ir em en t s
Table 2-8 and Table 2-9 list the ac power requirements for an HP Integrity Superdome/sx2000 system. These
tables provide information to help determine the amount of ac power needed for your computer room.
Ta b le 2-8
P ow er R eq u ir em en t s (With ou t Su p p or t Ma n a gem en t St a t ion )
R eq u ir em en t
Va lu e
Com m en ts
Nominal input voltage
200/208/220/230/
240 V ac rms
Input voltage range (minimum to maximum)
200 to 240 V ac
rms
Autoselecting (measured at
input terminals)
Frequency range (minimum to maximum)
Number of phases
50/60 Hz
3
Maximum in-rush current
90 A (peak)
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System Specifications
Electrical Specifications
Ta b le 2-8
P ow er R eq u ir em en t s (With ou t Su p p or t Ma n a gem en t St a t ion )
R eq u ir em en t
Va lu e
44 A rms
Com m en ts
Product label maximum current, 3-phase, 4-wire
Product label maximum current, 3-phase, 5-wire
Power factor correction
Per phase at 200 to 240 V ac
Per phase at 200 to 240 V ac
24 A rms
0.95 minimum
> 3.5 mA
Ground leakage current (mA)
See the following WARNING.
WARNING
Bew a r e of sh ock h a za r d . Wh en con n ect in g or r em ovin g in p u t p ow er w ir in g, a lw a ys
con n ect t h e gr ou n d w ir e fir st a n d d iscon n ect it la st .
Com p on en t Pow er R eq u ir em en t s
Table 2-8 and Table 2-9 list the ac power requirements for an HP Integrity Superdome/sx2000 system. These
tables provide information to help determine the amount of ac power needed for the computer room.
Ta b le 2-9
Com p on e n t P ow e r R eq u ir em e n ts (Wit h ou t Su p p or t Ma n a gem en t
St a tion )
Com p on en t P ow er R eq u ir ed
Com p on en t
a
50 H z to 60 H z
Maximum configuration for SD16
Maximum configuration for SD32
Cell board
8,200 VA
12,196 VA
900 VA
I/O card cage
500 VA
a. A number to use for planning, to allow for enough power to upgrade through
the life of the system.
I/O Exp a n sion Ca b in et Pow er R eq u ir em en ts
The I/O expansion cabinet (IOX) requires a single-phase 200-240V ac input. Table 2-10 lists the ac power
requirements for the I/O expansion cabinet.
NOTE
The IOX accommodates two ac inputs for redundancy.
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System Specifications
Electrical Specifications
Ta b le 2-10
I/O E xp a n sion Ca bin et P ow e r R eq u ir em en ts (Wit h ou t Su p p or t
Ma n a gem e n t St a tion )
R eq u ir em en t
Nominal input voltage
Va lu e
200/208/220/230/240 V ac rms
Input voltage range (minimum to maximum) 170-264 V ac rms
Frequency range (minimum to maximum)
Number of phases
50/60 Hz
1
Marked electrical input current
Maximum inrush current
16 A
60 A (Peak)
0.95 minimum
Power factor correction
Ta b le 2-11
I/O E xp a n sion Ca bin et Com p on en t P ow er R eq u ir em en ts
Com p on en t P ow er R eq u ir ed
Com p on en t
50 H z t o 60 H z
Fully configured cabinet
I/O card cage
ICE
3200 VA
500 VA
600 VA
I/O Exp a n sion Ca b in et Pow er Cor d s
Ta b le 2-12 I/O E xp a n sion Ca bin et a c P ow er Cor d s
P a r t Nu m b er
A5499AZ
Wh er e Used
Con n ect or Typ e
-001
-002
North America
International
L6-20
IEC 309
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System Specifications
Environmental Requirements
En vir on m en ta l R eq u ir em en t s
This section provides the environmental, power dissipation, noise emission, and air flow specifications.
Tem p er a t u r e a n d H u m id ity Sp ecifica tion s
a
Ta b le 2-13
Op e r a t ion a l P h ysica l E n vir on m en t R eq u ir em en ts
R ela t ive H u m id it y %;
R a t e of Ch g
(°C/h r, m a x)
ο
b
c
Tem p er a t u r e (d r y b u lb C)
Dew P oin t
Non con d en sin g
d,e
f
Allowable
15 to 32
Recommended
20 to 25
Allowable
20 to 80
Recommended
40 to 55
17
5
ο
ο
ο
ο
(59 to 90 F)
(68 to 77 F)
a. The maximum elevation for the operating environment is 3050 meters.
b. Dry bulb temperature is the regular ambient temperature. Derate maximum dry bulb temperature
1°C/300 m above 900 m.
c. Must be noncondensing environment.
d. With installed media, the minimum temperature is 10°C and maximum relative humidity is
limited to 80%. Specific media requirements may vary.
e. Allowable: equipment design extremes as measured at the equipment inlet.
f. Recommended: target facility design and operational range.
Ta b le 2-14
Non op er a tion a l P h ysica l E n vir on m e n t R eq u ir em e n t s
Stor a ge
P ow er ed Off (In st a lled )
Temp (°C, dry
bulb - regular
ambient temp.)
Rel Hum %;
Noncondensing
Dew point
(max)
Temp (°C, dry
bulb - regular
ambient temp.)
Rel Hum %;
Noncondensing
Dew point
(max)
-40 to 60
8 to 90
32
5 to 45
8 to 90
29
NOTE
Pow er Dissip a t ion
Table 2-15 lists the power requirements by configuration (number of cell boards, amount of memory per cell,
and number of I/O chassis) for the HP Integrity Superdome/sx2000.
The table contains two columns of power numbers expressed in watts. The Breaker Power column lists the
power used to size the wall breaker at the installation site. The Typical Power column lists typical power.
Typical power numbers can be used to assess the average utility cost of cooling and electrical power.
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System Specifications
Environmental Requirements
WARNING
Do n ot con n ect a 380 t o 415 V a c su p p ly t o a 4-w ir e P DCA. Th is is a sa fety h a za r d a n d
w ill r esu lt in d a m a ge to t h e p r od u ct . Lin e-t o-lin e or p h a se-t o-p h a se volt a ge
m ea su r ed a t 380 to 415 V a c m u st a lw a ys b e con n ect ed u sin g a 5-w ir e P DCA.
Ta b le 2-15
Typ ica l H P In t egr ity Su p er d om e /sx2000 for Du a l-cor e CP U
a
Con figu r a tion s
Br ea k er
P ow er
Typ ica l
P ow er
(Wa t ts)
Coolin g
(Bt u /H r )
Cell
Mem or y
IO
b
(Wa t t s)
8
32
16
8
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
2
2
2
9490
7620
8140
7180
7620
6660
7320
6360
7000
6040
6680
5720
6170
5210
5960
5000
5760
4800
4010
3890
3780
32382
11957
9601
10256
9047
9601
8391
9223
8013
8820
7610
8417
7207
7774
6564
7509
6300
7257
6048
5052
4901
4763
8
8
8
8
8
6
6
6
6
6
6
4
4
4
4
4
4
2
2
2
26001
27776
24500
26001
22726
24978
21702
23886
20610
22794
19518
21054
17778
20337
17061
19655
16379
13683
13274
12898
8
4
4
16
16
8
8
4
4
16
16
8
8
4
4
16
8
4
GB DIMMs and four Intel Itanium 2 dual-core
processors with 18 MB or 24 MB cache per cell board.
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System Specifications
Environmental Requirements
b. These numbers are valid only for the specific
configurations shown. Any upgrades may require a
change to the breaker size. A 5-wire source utilizes a
4-pole breaker, and a 4-wire source utilizes a 3-pole
breaker. The protective earth (PE) ground wire is not
switched.
Ta b le 2-16
Typ ica l H P In t egr ity Su p er d om e /sx2000 for Sin gle-cor e CP U
a
Con figu r a tion s
Br ea k er
P ow er
Typ ica l
P ow er
(Wa t ts)
Coolin g
(Bt u /H r )
Cell
Mem or y
IO
b
(Wa t t s)
8
32
16
8
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
2
2
2
9130
7260
7783
6823
7260
6300
6968
6008
6640
5680
6325
5365
5813
4853
4647
3687
5382
4422
3656
3534
3423
31181
11503
9147
9806
8596
9147
7938
8779
7570
8366
7156
7969
6759
7324
6114
5855
4645
6781
5571
4606
4453
4313
8
8
8
8
8
6
6
6
6
6
6
4
4
4
4
4
4
2
2
2
24794
26580
23302
24794
21516
23797
20518
22677
19398
21601
18322
19852
16574
15870
12592
18380
15102
12486
12069
11690
8
4
4
16
16
8
8
4
4
16
16
8
8
4
4
16
8
4
GB DIMMs and four Intel Itanium 2 single-core
processors with 9 MB cache per cell board.
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System Specifications
Environmental Requirements
b. These numbers are valid only for the specific
configurations shown. Any upgrades may require a
change to the breaker size. A 5-wire source utilizes a
4-pole breaker, and a 4-wire source utilizes a 3-pole
breaker. The protective earth (PE) ground wire is not
switched.
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System Specifications
Environmental Requirements
Acou st ic Noise Sp ecifica tion
The acoustic noise specifications are as follows:
•
•
8.2 bel (sound power level)
65.1 dBA (sound pressure level at operator position)
These levels are appropriate for dedicated computer room environments, not office environments.
You must understand the acoustic noise specifications relative to operator positions within the computer room
when adding HP Integrity Superdome/sx2000 systems to computer rooms with existing noise sources.
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System Specifications
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Air flow
ο
HP Integrity Superdome/sx2000 systems require the cabinet air intake temperature to be between 15 C and
ο
ο
ο
32 C (59 F and 89.6 F) at 2900 CFM.
NOTE
Approximately 5 percent of the system airflow is drawn from the rear of the system and exits
the top of the system.
F igu r e 2-2
Air flow Dia gr a m
Airflow exit (2600 CFM)
Airflow exit (300 CFM)
Air flows front to rear (2750 CFM)
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System Specifications
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Ta b le 2-17
P h ysica l E n vir on m en t a l Sp ecifica tion s
Con d it ion
Volt a ge
200–240 Va c
Air flow,
Ma xim u m
Over a ll Syst em
Dim en sion s
(W X D X H )
Air flow,
Typ ica l
H ea t
o
a ,b
a t 32 C
Weigh t
Nom in a l
R elea se
3
3
Description
Minimum
Watts
CFM
CFM
2900
lb
kg
in
mm
m /hr
m /hr
Configuration 3423
2900
2900
2900
5.0
5.0
926.3
420.3 30x48 76.2x121.9
x77.2 x195.6
Maximum
Configuration 9130
5.0
5.0
2900
2900
5.0
5.0
1241.2 563.2 30x48 76.2x121.9
x77.2 x195.6
Typical
Configuration 6968
1135.2 515.1 30x48 76.2x121.9
x77.2 x195.6
Minimum
c
ASH R AE
Cla ss
2 Cell, 4 DIMM, 2 I/O
Configuration
Maximum
1
8 Cell, 32 DIMM, 4 I/O
6 Cell, 16 DIMM, 4 I/O
Configuration
Typical
Configuration
a. Derate maximum dry bulb temperature 1oC/300 m above 900 m.
b. The system deviates slightly from front to top and rear airflow protocol. Approximately 5 percent of
details.
maximum, and typical configurations.
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3 In st a llin g t h e Syst em
This chapter describes installation of an HP Integrity Superdome/sx2000 system. Installers must have
received adequate training, be knowledgeable about the product, and have a good overall background in
electronics and customer hardware installation.
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Installing the System
Introduction
In tr od u ction
The instructions in this chapter are written for Customer Support Consultants (CSC) who are experienced at
installing complex systems. It provides details about each step in the installation process. Some steps must be
performed before others can be completed successfully. To avoid having to undo and redo an installation step,
follow the installation sequence outlined in this chapter.
Com m u n ica tion s In ter fer en ce
HP system compliance tests are conducted with HP supported peripheral devices and shielded cables, such as
those received with the system. The system meets interference requirements of all countries in which it is
sold. These requirements provide reasonable protection against interference with radio and television
communications.
Installing and using the system in strict accordance with instructions provided by HP minimizes the chances
that the system will cause radio or television interference. However, HP does not guarantee that the system
will not interfere with radio and television reception.
Take these precautions:
•
•
•
•
•
Use only shielded cables.
Install and route the cables per the instructions provided.
Ensure that all cable connector screws are firmly tightened.
Use only HP supported peripheral devices.
Ensure that all panels and cover plates are in place and secure before system operation.
Electr ost a t ic Disch a r ge
HP systems and peripherals contain assemblies and components that are sensitive to electrostatic discharge
(ESD). Carefully observe the precautions and recommended procedures in this document to prevent
component damage from static electricity.
Take these precautions:
•
•
•
Always wear a grounded wrist strap when working on or around system components.
Treat all assemblies, components, and interface connections as static-sensitive.
When unpacking cards, interfaces, and other accessories that are packaged separately from the system,
keep the accessories in their conductive plastic bags until you are ready to install them.
•
•
Before removing or replacing any components or installing any accessories in the system, select a work
area in which potential static sources are minimized, preferably an anti-static work station.
Avoid working in carpeted areas, and keep body movement to a minimum while installing accessories.
P u blic Telecom m u n ica tion s Netw or k Con n ection
Instructions issued to the installation site that modems cannot be connected to public telecommunications
networks until full datacomm licenses are received for the country of installation. Some countries do not
require datacomm licenses. The product regulations engineer should review beta site locations, and if
datacomm licenses are not complete, ensure that the installation site is notified, officially and in writing, that
the product cannot be connected to public telecommunications networks until the license is received.
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Unpacking and Inspecting the System
Un p a ck in g a n d In sp ect in g th e Syst em
This section describes what to do before unpacking the server and how to unpack the system itself.
WARNING
Do n ot a t tem p t t o m ove t h e ca b in et , eit h er p a ck ed or u n p a ck ed , u p or d ow n a n
o
in clin e of m or e t h a n 15 .
Ver ifyin g Site P r ep a r a tion
Verifying site preparation includes gathering LAN information and verifying electrical requirements.
Ga t h er in g LAN In for m a t ion
The Support Management Station (SMS) connects to the customer’s LAN. Determine the IP of the
appropriate address.
Ver ifyin g E lectr ica l R eq u ir em en t s
The site should have been verified for proper grounding and electrical requirements prior to the system being
shipped to the customer as part of the site preparation. Before unpacking and installing the system, verify
with the customer that grounding specifications and power requirements have been met.
Ch eck in g t h e In ven tor y
The sales order packing slip lists all equipment shipped from HP. Use this packing slip to verify that all
equipment has arrived at the customer site.
NOTE
To identify each item by part number, refer to the sales order packing slip.
One of the large overpack containers is labeled “Open Me First.” This box contains the Solution Information
Manual and DDCAs. The unpacking instructions are in the plastic bag taped to the cabinet.
The following items are in other containers. Check them against the packing list:
•
•
•
•
•
•
•
•
•
Power distribution control assembly (PDCA) and power cord
Two blower housings per cabinet
Four blowers per cabinet
Four side skins with related attachment hardware
Cabinet blower bezels and front door assemblies
Support Management Station
Cables
Optional equipment
Boot device with the operating system installed
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Unpacking and Inspecting the System
In sp ectin g th e Sh ip p in g Con t a in er s for Da m a ge
HP shipping containers are designed to protect their contents under normal shipping conditions. After the
equipment arrives at the customer site, carefully inspect each carton for signs of shipping damage.
WARNING
Do n ot a t tem p t t o m ove t h e ca b in et , eit h er p a ck ed or u n p a ck ed , u p or d ow n a n
o
in clin e of m or e t h a n 15 .
A tilt indicator is installed on the back and side of the cabinet shipping container (Figure 3-1 on page 79). If
the container has been tilted to an angle that could cause equipment damage, the beads in the indicator shift
positions (Figure 3-2 on page 79). If a carton has received a physical shock and the tilt indicator is in an
abnormal condition, visually inspect the unit for any signs of damage. If damage is found, document the
damage with photographs, and contact the transport carrier immediately.
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Installing the System
Unpacking and Inspecting the System
F igu r e 3-1
Nor m a l Tilt In d ica tor
Tilt indicator
Retaining
bands
Retaining
bands
F igu r e 3-2
Abn or m a l Tilt In d ica t or
NOTE
If the tilt indicator shows that an abnormal shipping condition has occurred, write “possible
hidden damage” on the bill of lading and keep the packaging.
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Unpacking and Inspecting the System
In sp ect ion P r eca u t ion s
•
When the shipment arrives, check each container against the carrier's bill of lading. Inspect the exterior
of each container immediately for mishandling or damage during transit. If any of the containers are
damaged, request the carrier's agent be present when the container is opened.
•
When unpacking the containers, inspect each item for external damage. Look for broken controls and
connectors, dented corners, scratches, bent panels, and loose components.
NOTE
HP recommends keeping the shipping container or the packaging material. If it becomes
necessary to repackage the cabinet, the original packing material will be needed.
If discarding the shipping container or packaging material, dispose of them in an
environmentally responsible manner (recycle, if possible).
Cla im s P r oced u r es
If the shipment is incomplete, if the equipment is damaged, or it fails to meet specifications, notify the nearest
HP Sales and Service Office. If damage occurred in transit, notify the carrier as well.
HP will arrange for replacement or repair without waiting for settlement of claims against the carrier. In the
event of damage in transit, retain the packing container and packaging materials for inspection.
Un p a ck in g a n d In sp ectin g Ha r d w a r e Com p on en ts
This section describes the procedures for opening the shipping container and unpacking and inspecting the
cabinet.
Tools R eq u ir ed
The following tools are required to unpack and install the system:
•
•
•
•
•
•
•
•
•
•
•
•
Standard hand tools, such as a adjustable-end wrench
ESD grounding strap
Digital voltmeter capable of reading ac/dc voltages
1/2-inch wrench/socket
9/16-inch wrench
#2 Phillips screwdriver
Flathead screwdriver
Wire cutters or utility knife
Safety goggles or glasses
T-10, T-15, T-20, T-25, and T-30 Torx drivers
9-pin to 25-pin serial cable (HP part number 24542G)
9-pin to 9-pin null modem cable
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Unpacking and Inspecting the System
Un p a ck in g t h e Ca b in et
WARNING
Use t h r ee p eop le t o u n p a ck th e ca b in et sa fely.
HP recommends removing the cardboard shipping container before moving the cabinet into the computer
room.
NOTE
If unpacking the cabinet in the computer room, be sure to position it so that it can be moved
into its final position easily. Notice that the front of the cabinet (Figure 3-3) is the side with the
label showing how to align the ramps.
To unpack the cabinet, perform the following steps:
Step 1. Position the packaged cabinet so that a clear area about three times the length of the package
(a b ou t 12 feet or 3.66 m) is available in front of the unit, and at least 2 feet (0.61 m) are available
on the sides.
F igu r e 3-3 F r on t of Ca bin et Con t a in e r
Label
WARNING
Do n ot st a n d d ir ect ly in fr on t of t h e st r a p p in g w h ile cu t t in g it . H old th e
b a n d a b ove t h e in ten d ed cu t a n d w ea r p r ot ect ive gla sses. Th ese b a n d s a r e
u n d er t en sion . Wh en cu t , th ey sp r in g b a ck a n d cou ld ca u se ser iou s eye
in ju r y.
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Installing the System
Unpacking and Inspecting the System
F igu r e 3-4 Cu t tin g P olystr a p Ba n d s
Hold here
Cut here
Polystrap bands
Step 3. Lift the cardboard corrugated top cap off of the shipping box.
Step 4. Remove the corrugated sleeves surrounding the cabinet.
CAUTION
Cut the plastic wrapping material off rather than pull it off. Pulling the plastic
covering off represents an electrostatic discharge (ESD) hazard to the hardware.
Step 5. Remove the stretch wrap, the front and rear top foam inserts, and the four corner inserts from the
cabinet.
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Installing the System
Unpacking and Inspecting the System
Step 7. Remove the plastic anti-static bag by lifting it straight up off the cabinet. If the cabinet or any
components are damaged, follow the claims procedure. Some damage can be repaired by replacing
the damaged part. If extensive damage is found, it may be necessary to repack and return the
entire cabinet to HP.
Inspecting the Cabinet
Inspect the cabinet exterior for signs of shipping damage.
Step 1. Look at the top and sides for dents, warpage, or scratches.
F igu r e 3-6 Loca tion of P ow e r Su p p ly Mou n t in g Scr ew s
Power supply
mounting screws
Power supplies
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Unpacking and Inspecting the System
Inspect all components for signs of shifting during shipment or any signs of damage.
F igu r e 3-7 I/O Ch a ssis Mou n tin g Scr e w s
Mounting screws
I/O chassis
Moving the Cabinet Off the Pallet
Step 1. Remove the shipping strap that holds the BPSs in place during shipping (Figure 3-8 on page 86).
Failure to remove the shipping strap will obstruct air flow into the BPS and FEPS.
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Installing the System
Unpacking and Inspecting the System
F igu r e 3-8 Sh ip p in g St r a p Loca t ion
Shipping strap
Step 2. Remove the pallet mounting brackets and pads on the side of the pallet where the ramp slots are
F igu r e 3-9 R em ovin g t h e Mou n t in g Br a ck e ts
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Unpacking and Inspecting the System
WARNING
Do n ot r em ove t h e b olt s on th e m ou n t in g b r a ck ets t h a t a t t a ch to th e p a llet .
Th ese b olt s p r even t t h e ca b in et fr om r ollin g off t h e b a ck of t h e p a llet .
Step 3. On the other side of the pallet, remove only the bolt on each mounting bracket that is attached to
the cabinet.
Step 4. Insert the ramps into the slots on the pallet.
CAUTION
The casters on the cabinet should roll unobstructed onto the ramp.
F igu r e 3-10 P osition in g th e R a m p s
WARNING
WARNING
Do n ot a t tem p t t o r oll a ca b in et w it h ou t h elp . Th e ca b in et ca n w eigh a s
m u ch a s 1400 lb (635 k g). Th r ee p eop le a r e r eq u ir ed t o r oll th e ca b in et off
th e p a llet . P osit ion on e p er son a t t h e r ea r of t h e ca b in et a n d on e p er son on
ea ch sid e.
Do n ot a tt em p t t o m ove t h e ca b in et , eit h er p a ck ed or u n p a ck ed , u p or d ow n
o
a n in clin e of m or e th a n 15 .
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Installing the System
Unpacking and Inspecting the System
F igu r e 3-11 R ollin g t h e Ca b in et Dow n t h e R a m p
Step 6. Unpack any other cabinets that were shipped.
Un p a ck in g th e P DCA
At least one power distribution control assembly (PDCA) is shipped with the system. In some cases, the
customer may have ordered two PDCAs, the second to be used as a backup power source. Unpack the PDCA
now and ensure it has the power cord option for this installation.
Several power cord options are available for the PDCAs. Only options 6 and 7 are currently available in new
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Unpacking and Inspecting the System
Ta b le 3-1
Ava ila ble P ow er Op tion s
In p u t Cu r r en t
P er P h a se 200
Sou r ce
Typ e
Sou r ce Volt a ge
(Nom in a l)
P DCA
R eq u ir ed
P ow er R ecep t a cle
R eq u ir ed
Op t ion
a
to 240 V a c
6
3-phase Voltage range 200
to 240 V ac,
4-wire
44 A maximum
per phase
Connector and plug
provided with a 2.5 m (8.2
feet) power cable.
phase-to-phase,
50 Hz / 60 Hz
Electrician must hard wire
receptacle to 60 A site
power.
7
3-phase Voltage range 200
to 240 V ac,
5-wire
24 A maximum
per phase
Connector and plug
provided with a 2.5 m (8.2
feet) power cable.
Electrician must hard wire
receptacle to 32 A site
power.
phase-to-neutral,
50 Hz / 60 Hz
a. A dedicated branch circuit is required for each PDCA installed.
Ta b le 3-2 P ow er Cor d Op tion 6 a n d 7 Sp e cifics
P DCA
P a r t Nu m b er
R ecep t a cle
R eq u ir ed
At ta ch ed P ow er Cor d
At t a ch ed P lu g
A5201-69023
(Option 6)
OLFLEX 190 (PN 600804) is a
2.5 meter multi conductor,
600 V, 90°C, UL and CSA
Mennekes
ME 460P9
(60 A capacity)
Mennekes
ME 460R9
(60 A capacity)
approved, oil resistant flexible
cable. (8 AWG 60 A capacity)
A5201-69024
(Option 7)
H07RN-F (OLFLEX PN
1600130) is a 2.5 meter
heavy-duty neoprene-jacketed (32 A capacity)
Mennekes
ME 532P6-14
Mennekes
ME 532R6-1500
(32 A capacity)
harmonized European flexible
2
cable. (4 mm 32 A capacity)
Retu r n in g E q u ip m en t
If the equipment is found to be damaged, use the original packing material to repackage the cabinet for
shipment. If the packing material is not available, contact the local HP Sales and Support Office regarding
shipment.
Before shipping, place a tag on the container or equipment to identify the owner and the service to be
performed. Include the equipment model number and the full serial number, if applicable. The model number
and the full serial number are printed on the system information labels located at the bottom front of the
cabinet.
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Unpacking and Inspecting the System
WARNING
Do n ot a t tem p t t o p u sh th e loa d ed ca b in et u p th e r a m p on t o t h e p a llet . Th r ee p eop le
a r e r eq u ir ed t o p u sh t h e ca b in et u p th e r a m p a n d p osit ion it on t h e p a llet . In sp ect
t h e con d it ion of t h e loa d in g a n d u n loa d in g r a m p b efor e u se.
R ep a ck a gin g
To repackage the cabinet, perform the following steps:
Step 1. Assemble the HP packing materials that came with the cabinet.
Step 2. Carefully roll the cabinet up the ramp.
Step 3. Attach the pallet mounting brackets to the pallet and the cabinet.
Step 4. Reattach the ramps to the pallet.
Step 5. Replace the plastic anti-static bag and foam inserts.
Step 6. Replace the cardboard surrounding the cabinet.
Step 7. Replace the cardboard caps.
Step 8. Secure the assembly to the pallet with straps.
The cabinet is now ready for shipment.
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Installing the System
Setting Up the System
Set t in g Up t h e Syst em
After a site has been prepared, the system has been unpacked, and all components have been inspected, the
system can be prepared for booting.
Movin g t h e System a n d Rela t ed Equ ip m en t to th e In sta lla tion Sit e
Carefully move the cabinets and related equipment to the installation site but not into the final location. If
the system is to be placed at the end of a row, you must add side bezels before positioning the cabinet in its
final location. Check the path from where the system was unpacked to its final destination to make sure the
way is clear and free of obstructions.
WARNING
If t h e ca b in et m u st b e m oved u p r a m p s, b e su r e t o m a n eu ver it u sin g t h r ee p eop le.
Un p a ck in g a n d In sta llin g th e Blow er Hou sin gs a n d Blow er s
Each cabinet contains two blower housings and four blowers. Although similar in size, the blower housings for
each cabinet are not the same; one has a connector to which the other attaches. Use the following procedure to
unpack and install the housings and blowers:
Step 1. Unpack the housings from the cardboard box and set them aside.
The rear housing is labeled Blow er 3 Blow er 2. The front housing is labeled Blow er 0 Blow er 1.
CAUTION
F igu r e 3-12 Blow er H ou sin g F r a m e
Blower housing
frame
Handles
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Installing the System
Setting Up the System
This cardboard protects the housing baffle during shipping. If it is not removed, the fans will not
work properly.
F igu r e 3-13 R em ovin g P r ote ct ive Ca r d b oa r d fr om th e H ou sin g
Cardboard
NOTE
Double-check that the protective cardboard has been removed.
Step 3. Using the handles on the housing labeled Blow er 3 Blow er 2, part number A5201-62029, align
the edge of the housing over the edge at the top rear of the cabinet, and slide it into place until the
thumbscrews at the front of the housing.
F igu r e 3-14 In st a llin g t h e R ea r Blow e r H ou sin g
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Installing the System
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Step 4. Using the handles on the housing labeled Blow er 0 Blow er 1, part number A5201-62030, align
the edge of the housing over the edge at the top front of the cabinet, and slide it into place until the
thumbscrews at the front of the housing.
F igu r e 3-15 In st a llin g t h e F r on t Blow er H ou sin g
Step 5. Unpack each of the four blowers.
Step 6. Insert each of the four blowers into place in the blower housings with the thumbscrews at the
F igu r e 3-16 In st a llin g t h e Blow er s
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Installing the System
Setting Up the System
Step 7. Tighten the thumbscrews at the front of each blower.
Step 8. If required, install housings on any other cabinets that were shipped with the system.
Atta ch in g t h e Sid e Sk in s a n d Blow er Sid e Bezels
Two cosmetic side panels affix to the left and right sides of the system. In addition, each system has bezels
that cover the sides of the blowers.
IMPORTANT Be sure to attach the side skins at this point in the installation sequence, especially if the
cabinet is to be positioned at the end of a row of cabinets or between cabinets.
At t a ch in g t h e Sid e Sk in s
Each system has four side skins: two front-side skins and two rear-side skins.
NOTE
Attach side skins to the left side of cabinet 0 and the right side of cabinet 1 (if applicable).
To attach the side skins:
Step 1. If not already done, remove the side skins from their boxes and protective coverings.
Step 2. From the end of the brackets at the back of the cabinet, position the side skin with the lap joint
(Rear) over the top bracket and under the bottom bracket, and gently slide it into position
Two skins are installed on each side of the cabinet: one has a lap joint (Rear) and one does not
(Front). The side skins with the lap joint are marked Rear and the side skins without the lap joint
are marked Front.
F igu r e 3-17 At ta ch in g t h e R ea r Sid e Sk in
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Step 3. Attach the skin without the lap joint (Front) over the top bracket and under the bottom bracket and
gently slide the skin into position.
F igu r e 3-18 At ta ch in g t h e F r on t Sid e Sk in s
Step 4. Push the side skins together, making sure the skins overlap at the lap joint.
At t a ch in g t h e Blow er Sid e Bezels
The bezels are held on at the top by the bezel lip, which fits over the top of the blower housing frame, and are
Use the same procedure to attach the right and left blower side bezels.
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Step 1. Place the side bezel slightly above the blower housing frame.
F igu r e 3-19 At ta ch in g t h e Sid e Bezels
Lip
Tab (2)
Brackets
Blower side bessel
(See detail)
Notches
Brackets
Step 2. Align the lower bezel tabs to the slots in the side panels.
Step 3. Lower the bezel so the bezel top lip fits securely on the blower housing frame and the two lower
tabs are fully inserted into the side panel slots.
IMPORTANT Use four screws to attach the side skins to the top and bottom brackets, except for the
top bracket on the right side (facing the front of the cabinet). Do not attach the rear
screw on that bracket. Insert all screws but do not tighten until all side skins are
aligned.
Step 4. Using a T-10 driver, attach the screws to secure the skins to the brackets.
Step 5. Repeat step 1 through step 4 for the skins on the other side of the cabinet.
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Step 6. To secure the side bezels to the side skins, attach the blower bracket locks (HP part number
A5201-00268) to the front and back blowers using a T-20 driver.
There are two blower bracket locks on the front blowers and two on the rear.
Atta ch in g t h e Levelin g Feet a n d Levelin g th e Ca bin et
After positioning the cabinet to its final position, attach and adjust the leveling feet using the following
procedure:
Step 1. Remove the leveling feet from their packages.
Step 2. Attach the leveling feet to the cabinet using four T-25 screws.
F igu r e 3-20 At ta ch in g t h e Levelin g Fe et
Step 3. Screw down each leveling foot clockwise, until it is in firm contact with the floor. Adjust each foot
until the cabinet is level.
In sta llin g th e F r on t Door Bezels a n d t h e Fr on t a n d R ea r Blow er Bezels
Each cabinet has two doors: one at the front and one at the back. The back door is shipped on the chassis and
requires no assembly. The front door, which is also shipped on the chassis, requires the assembly of two
plastic bezels to its front surface and a cable from the door to the upper front bezel. In addition, you need to
install bezels that fit over the blowers at the front and back of the cabinet.
In sta llin g t h e F r on t Door Bezels
The front door assembly includes two cosmetic covers, a control panel, and a key lock. Installing the front door
involves connecting the control panel ribbon cable from the chassis to the control panel and mounting the two
plastic bezels onto the metal chassis door.
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NOTE
The procedure in this section requires two people and must be performed with the front metal
chassis door open.
To install the front door assembly:
Step 1. Open the door, unsnap the screen, and remove all the filters held in place with Velcro.
Step 2. Remove the cabinet keys that are taped inside the top front door bezel.
Step 3. Insert the shoulder studs on the lower door bezel into the holes on the front door metal chassis
F igu r e 3-21 In st a llin g t h e Low er F r on t Door Assem b ly
Step 4. Using a T-10 driver, secure the lower door bezel to the front door chassis with 10 of the screws
provided. Insert all screws loosely, then torque them after the bezel is aligned.
Step 5. While one person holds the upper door bezel near the door chassis, attach the ribbon cable to the
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F igu r e 3-22 In st a llin g t h e Up p er F r on t Door Asse m bly
Front panel
display cable
Step 6. Feed the grounding strap through the door and attach it to the cabinet.
Step 7. Insert the shoulder studs on the upper door bezel into the holes on the front door metal chassis.
Step 8. Using a T-10 driver, secure the upper door bezel to the metal door with eight of the screws provided.
Be sure to press down on the hinge side of the bezel while tightening the screws to prevent
misalignment of the bezel.
Step 9. Reattach all filters removed in step 1.
In sta llin g t h e R ea r Blow er Bezel
The rear blower bezel is a cosmetic cover for the blowers and is located above the rear door.
To install the rear blower bezel:
Step 1. Open the rear cabinet door.
The latch is located on the right side of the door.
Step 2. Slide the bezel over the blower housing frame, hooking the lip of the bezel onto the cross support of
the blower housing while holding the bottom of the bezel. Rotate the bezel downward from the top
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F igu r e 3-23 In st a llin g t h e R ea r Blow e r Bezel
Step 3. Align the bezel over the nuts that are attached to the bracket at the rear of the cabinet.
Step 4. Using a T-20 driver, tighten the two captive screws on the lower flange of the bezel.
NOTE
Tighten the screws securely to prevent them from interfering with the door.
Step 5. Close the cabinet rear door.
In sta llin g t h e F r on t Blow er Bezel
The front blower bezel is a cosmetic cover for the blowers and is located above the front door. To install it, use
the following procedure:
Step 1. Open the front door.
The latch is located on the right side of the front door.
Step 2. Position the bezel over the blower housing frame, hooking the lip of the bezel onto the cross support
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F igu r e 3-24 In st a llin g t h e F r on t Blow er Beze l
Step 3. Align the bezel over the nuts that are attached to the bracket at the front of the cabinet.
Step 4. Using a T-20 driver, tighten the two captive screws on the lower flange of the bezel.
NOTE
Tighten the screws securely to prevent them from interfering with the door.
Step 5. Close the front door.
Wir in g Ch eck
WARNING
LETH AL VOLTAGE H AZAR D—H a za r d ou s volt a ges m a y b e p r esen t in t h e ca b in et if
in cor r ectly w ir ed in t o t h e site AC p ow er su p p ly. Alw a ys ver ify cor r ect w ir in g a n d
p r od u ct gr ou n d in g b efor e a p p lyin g AC p ow er to th e ca b in et . Fa ilu r e t o d o so m a y
r esu lt in in ju r y t o p er son n el a n d d a m a ge t o eq u ip m en t .
Always verify that the AC power cable is correctly wired into the AC power supply before applying AC power
to the cabinet.
Verify the following items before applying AC power to the cabinet:
•
Cabinet safety ground connects to the site electrical system ground and is not left floating or connected to
a phase.
NOTE
The following identifies the minimum acceptable and the preferred methods of grounding. Use
the required method whenever possible.
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•
•
Required method of grounding is to connect the green power cord safety ground to the site ground point.
This is accomplished through the power cord receptacle wiring. HP does not recommend cabinet
grounding. Cabinet grounding should be treated as auxiliary or additional grounding over and above the
ground wire included within the supplied power cord.
As a minimum, the green power cord safety ground must be connected to the site ground point.
If the product ground is left floating, anyone coming into contact with the cabinet could receive a lethal shock
if a component should fail causing leakage or direct connection of phase energy to the cabinet.
If the product ground connects to a phase, the product will be over 200 volts above ground, presenting a lethal
shock hazard to anyone coming into contact with the product when site AC power is applied to the product.
Verify the connection of the product ground to site AC power ground through a continuity check between the
cabinet and site AC power supply ground. The continuity check should be performed while the site AC power
supply circuit breakers serving the cabinet and the cabinet circuit breaker are all set to OFF.
Use the following procedure to verify that the product ground connects to the site AC power supply ground:
Step 1. Ensure that the site AC power supply circuit breakers serving the cabinet are set to OFF.
Step 2. Ensure that the cabinet main circuit breaker is set to OFF.
Step 3. Touch one test probe to the site AC power supply ground source.
Step 4. Touch the other test probe to an unpainted metal surface of the cabinet.
NOTE
If the digital multimeter (DMM) leads will not reach from the junction box to the
cabinet, use a piece of wire connected to the ground terminal of the junction box.
Step 5. Check for continuity indication of less than 0.1 ohm.
•
•
•
If continuity is not found, check to ensure that the DMM test leads are making good contact to
unpainted metal and try again.
If continuity is still not found, disconnect the cabinet site AC power immediately and notify the
customer of the probability of incorrectly wired AC power to the cabinet.
If continuity is good, and connection of the cabinet to site AC power supply ground (and not
floating or connected to a phase) is verified, then voltage checks may be performed.
NOTE
attention to PDCA 0 ground pin to PDCA 1 ground pin voltage. Anything greater than 3 V is
cause for further investigation.
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In sta llin g a n d Ver ifyin g th e P DCA
All systems are delivered with the appropriate cable plug for options 6 and 7 (Figure 3-25 on page 104).
Check the voltages at the receptacle prior to plugging in the PDCA plug.
•
To verify the proper wiring for a 4-wire PDCA, use a DVM to measure the voltage at the receptacle.
Voltage should read 200 to 240V ac phase-to-phase as measured between the receptacle pins as follows:
•
To verify the proper wiring for a 5-wire PDCA, use a DVM to measure the voltage at the receptacle.
Voltage should read 200 to 240 V ac phase-to-neutral as measured between the receptacle pins as follows:
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F igu r e 3-27
A 5-Wir e Con n ect or
L3
N
L2
L1
PE
Use the following procedure to install the PDCA:
WARNING
Ma k e su r e th e cir cu it b r ea k er on th e P DCA is OF F.
Step 1. Remove the rear PDCA bezel by removing the four retaining screws.
Step 2. Run the power cord down through the appropriate opening in the floor tile.
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F igu r e 3-28 In st a llin g t h e P DCA
Step 4. Using a T-20 driver, attach the four screws that hold the PDCA in place.
Step 5. If required, repeat step 2 through step 4 for the second PDCA.
Step 6. Re-install the rear PDCA bezel.
CAUTION
Do not measure voltages with the PDCA breaker set to ON. Make sure the electrical
panel breaker is ON and the PDCA breaker is OFF.
Step 7. Plug in the PDCA connector.
Step 8. Check the voltage at the PDCA:
a . Using a T-20 driver, remove the screw on the hinged panel at the top of the PDCA ( Figure 3-29).
b . Using a voltmeter, measure the test points and compare the values to the ranges given in
local electrical specifications.
If the voltage values do not match the specifications, have the customer contact an electrician to
troubleshoot the problem.
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F igu r e 3-29
Ch eck in g P DCA Te st P oin ts (5-Wir e )
(See detail)
Detail B
Detail A
Test points
Retaining screw
Ta b le 3-3
4- a n d 5-Wir e Volta ge R a n ges
5-Wir e
4-Wir e
L2 to L3: 200-240 V
L2 to L1: 200-240 V
L1 to L3: 200-240 V
L1 to N: 200-240 V
L2 to N: 200-240 V
L3 to N: 200-240 V
a
N to Ground:
a. Neutral to ground voltage can vary from millivolts to
several volts depending on the distance to the
ground/neutral bond at the transformer. Any voltage
over 3 V should be investigated by a site preparation
or power specialist.
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Volta ge Ch eck
The voltage check ensures that all phases (and neutral, for international systems) are wired correctly for the
cabinet and that the AC input voltage is within limits.
NOTE
If a UPS is used, refer to applicable UPS documentation for information to connect the server
and to check the UPS output voltage. UPS User Manual documentation is shipped with the
UPS. Documentation may also be found at http://docs.hp.com
Step 1. Verify that site power is OFF.
Step 2. Open the site circuit breaker(s).
Step 3. Verify that the receptacle ground connector is connected to ground. See Figure 3-30 for connector
details.
Step 4. Set the site power circuit breaker to ON.
F igu r e 3-30 Wa ll R ece p t a cle P in ou t s
X
X
Y
X
Y
X
Y
G
Y
GND
GND
IEC 309/16A
GND
GND
CEE 7/7
L6 - 20
GB - 1002
KIN006
7/11/01
Step 5. Verify that the voltage between receptacle pins x and y is between 200 - 240 volts AC.
Step 6. Set the site power circuit breaker to OFF.
Step 7. Ensure that power is removed from the server.
Step 8. Route and connect the server power connector to the site power receptacle.
•
•
For locking type receptacles, line up the key on the plug with the groove in the receptacle.
Push the plug into the receptacle and rotate to lock the connector in place.
WARNING
Do n ot set sit e AC cir cu it b r ea k er s ser vin g th e p r ocessor ca b in et s t o ON
b efor e ver ifyin g t h a t t h e ca b in et h a s b een w ir ed in t o t h e site AC p ow er
su p p ly cor r ect ly. Fa ilu r e t o d o so m a y r esu lt in in ju r y t o p er son n el or
d a m a ge to eq u ip m en t w h en AC p ow er is a p p lied t o t h e ca b in et .
Step 9. Set the site power circuit breaker to ON.
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WARNING
SH OCK H AZAR D
R isk of sh ock h a za r d w h ile t est in g p r im a r y p ow er.
Use p r op er ly in su la ted p r ob es.
Be su r e to r ep la ce a ccess cover w h en fin ish ed t est in g p r im a r y p ow er.
Step 10. Set the server power to ON.
F igu r e 3-31 P ow e r Su p p ly In d ica t or LED Det a il
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Rem ovin g th e EMI Pa n els
Remove the front and back electromagnetic interference (EMI) panels to access ports and to visually check
whether components are in place and the LEDs are properly illuminated when power is applied to the system.
To remove the front and back EMI panels:
Step 1. Using a T-20 driver, loosen the captive screw at the top center of the front EMI panel (Figure 3-32).
F igu r e 3-32 R em ovin g F r on t E MI P a n el Scr e w
Front EMI panel screw
Step 2. Use the handle provided to remove the EMI panel and set it aside.
When in position, the EMI panels (front and back) are tightly in place. Removing them takes
controlled but firm exertion.
Step 3. Loosen the captive screw at the lower center of the back EMI panel (Figure 3-33 on page 111).
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F igu r e 3-33 R em ovin g t h e Ba ck E MI P a n el
Back EMI
panel screw
Step 4. Use the handle provided to gently remove the EMI panel and set it aside.
Con n ectin g th e Ca bles
The I/O cables are attached and tied inside the cabinet. When the system is installed, these cables must be
untied, routed, and connected to the cabinets where the other end of the cables terminate. Use the following
guidelines and Figure 3-34 to route and connect cables. For more information on cable routing, refer to
•
•
Each cabinet is identified with a unique color. The cabinet color label is located at the top of the cabinet.
The colored label closest to the cable connector corresponds to the color of the cabinet to which it is
attached.
•
•
The colored label farther away from the cable connector corresponds to the color of the cabinet where the
other end of the cable is attached. In Figure 3-34, the dotted lines show where the label is located and
where the cable terminates.
Each cable is also labeled with a unique number. This number label is applied on both ends of the cable
indicated by circled numbers, and the cabinet port numbers are indicated with boxed numbers.
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F igu r e 3-34
Ca b le La be lin g
Rou t in g th e I/O Ca b les
Routing the cables is a significant task in the installation process. Efficient cable routing is important not
only for the initial installation, but also to aid in future service calls.
Neatness counts. The most efficient use of space is to route cables so that they are not crossed or tangled.
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F igu r e 3-35
R ou t in g I/O Ca b les
Use the following procedure and guidelines to route cables through the cable groomer at the bottom rear of
the cabinet.
Step 1. Remove the cable access plate at the bottom of the groomer.
Step 2. Beginning at the front of the cabinet, route the cables using the following pattern:
a . Route the first cable on the left side of the leftmost card cage first. Route it under the PCI-X
card cage toward the back of the cabinet and down through the first slot at the right of the cable
groomer.
b . Route the second cable on the left side of the leftmost card cage to the right of the first cable,
and so on, until routing all of the cables in the card cage is complete.
The number and width of cables vary from system to system. Use judgment and the customer’s
present and estimated future needs to determine how many cables to route through each cable
groomer slot.
c. After routing the leftmost card cage at the front of the cabinet, route the cables in the rightmost
card cage at the back of the cabinet. Begin with the right cable in the card cage and work toward
the left.
d . After routing the cables in the rightmost card cage at the rear of the cabinet, return to the front
of the system and route the cables in the next card cage to the right.
e. Repeat steps a through d until all the cables are routed.
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Step 3. Connect the management processor cables last.
Step 4. Reattach the cable access plate at the bottom of the cable groomer.
Step 5. Reattach the cable groomer kick plate at the back of the cabinet.
Step 6. Slip the L brackets under the power cord on the rear of the PDCA.
Step 7. While holding the L bracket in place, insert the PDCA completely into the cabinet and secure the L
bracket with one screw.
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Installing the Support Management Station
In st a llin g t h e Su p p or t Ma n a gem en t Sta t ion
The Support Management Station (SMS) ships in one of two ways: rack-mounted in the cabinet or separately
in boxes for installation in the field. For field installation, see the Installation Guide that shipped in the box
with the SMS. The SMS software is pre-loaded at the factory.
If you have an existing SMS, install the latest scan firmware using the appropriate bundle for a
Windows-based SMS or HP-UX SMS. See WTEC Current Issue 1911 for where to find scan, firmware, and
EIT tools.
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Configuring the Event Information Tools
Con figu r in g th e Even t In for m a tion Tools
There are three tools included in the Event Information Tools (EIT) bundle for the Support Management
Station (SMS). They are the Console Logger, the IPMI Log Acquirer and the IPMI Event Viewer. These tools
work together to collect, interpret, and display system event messages on the SMS.
EIT Tools Functionality
The Console Logger captures the commands typed at the console, the response displayed, and alert messages
generated by the system; then stores them on the SMS disk drive in a continuous log format.
The IPMI Log Acquirer acquires FPL and FRUID logs from the remote system and stores them on the SMS
disk drive.
The IPMI Event Viewer analyzes the FPL logs captured by IPMI Log Acquirer and displays the system event
information through either a command line or Web-based interface.
Where to Find the EIT Documentation
The latest documentation for setting up and configuring these tools is available at:
http://docs.hp.com/en/diag.html
Once you are at the Web site, select the category, “Event Information Tools (EIT) - formerly SMS”. You will
find documentation for each of the following areas:
•
•
•
•
Console Logger
IPMI Event Viewer
IPMI Log Acquirer
Release Notes
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Turning On Housekeeping Power
Tu r n in g On H ou sek eep in g P ow er
Use the following procedure to turn on housekeeping power to the system:
Step 1. Verify that the ac voltage at the input source is within specifications for each cabinet being
installed.
Step 2. Ensure that:
•
•
•
The ac breakers are in the OFF position.
The cabinet power switch at the front of the cabinet is in the OFF position.
The ac breakers and cabinet switches on the I/O expansion cabinet (if present) are in the OFF
position.
Step 3. If the complex has an IOX cabinet, power on this cabinet first.
IMPORTANT The 48 V switch on the front panel must be OFF at this time.
Step 4. Turn on the ac breakers on the PDCAs at the back of the each cabinet.
•
In a large complex, power on the cabinets in one of the two following orders:
— 9, 8, 1, 0
— 8, 9, 0, 1
•
•
On cabinet 0, the HKP and the Present LEDs illuminate, but only the HKP LED illuminates on
cabinet 1 (the right cabinet).
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Turning On Housekeeping Power
F igu r e 3-36 F r on t P a n el w it h H ou sek ee p in g (H KP ) P ow er On a n d P r e sen t LE Ds
Front panel
When on, the breakers on the PDCA distribute ac power to the BPSs. Power is present at the BPSs
when:
•
The amber light next to the label AC0 Present is on (if the breakers on the PDCA are on the left
side at the back of the cabinet).
•
The amber light next to the label AC1 Present is on (if the breakers on the PDCA are on the
right side at the back of the cabinet).
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Connecting the MP to the Customer LAN
Con n ectin g t h e MP t o th e Cu st om er LAN
This section discusses how to connect, set up, and verify the management processor (MP) to the customer
LAN. LAN information includes the MP network name (host name), the MP IP address, the subnet mask, and
gateway address. The customer provides this information.
Con n ectin g th e MP to th e Netw or k
NOTE
Based upon the customer’s existing SMS configuration, make the appropriate modifications to
add in the Superdome/sx2000 SMS LAN configuration.
Unlike earlier systems, which required the MP to be connected to the private LAN, the new
system MP now connects to the customer’s LAN through the appropriate hub, switch, router, or
other customer-provided LAN device.
In some cases, the customer might want to connect the SMS to the MP on the private
management LAN. This can be done, but the customer must be informed that administrators
will not be able to access the SMS remotely and will have to use the SMS as a local device.
Connect the MP to the customer’s LAN:
F igu r e 3-38 MP LAN Con n ect ion Loca tion
MP to customer
LAN connection
Step 2. Connect the other end of the LAN cable to the customer-designated LAN port. Obtain the IP
address for the MP from the customer.
Connect dial-up modem cable between the MP modem and the customer’s phone line connection.
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Connecting the MP to the Customer LAN
Settin g th e Cu stom er IP Ad d r ess
NOTE
The default IP address for the customer LAN port on the MP is 192.168.1.1.
To set the customer LAN IP address:
Step 1. From the MP Command Menu prompt (MP:CM>), enter lc(for LAN configuration).
The screen displays the default values and asks if you want to modify them. It is a good idea to
write down the information, as it may be required for future troubleshooting.
If you are not already in the Command Menu, enter mato return to the Main Menu, then enter cm.
F igu r e 3-39 LAN Con figu r a t ion Scr ee n
If the LAN software on the MP is working properly, you should see the message “LAN status: UP
and RUNNING”. The value in the IP addressfield has been set at the factory. Obtain the customer
LAN IP addresses from the customer.
NOTE
The customer LAN IP address is designated LAN port 0.
Step 2. The prompt asks if you want to modify the LAN port 0. Enter Y.
The current customer IP address is shown; then the following prompt appears: Do you want to
modify it? (Y/ [N])
Step 3. Enter Y.
Step 4. Enter the new IP address.
The customer provides this address for LAN port 0.
Step 5. Confirm the new address.
Step 6. Enter the MP network name.
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Connecting the MP to the Customer LAN
This is the host name for the customer LAN. You can use any name you like. The name can be up to
64 characters long, and can include alphanumerics, dash (-), under score (_), period (.), or space. HP
recommends that the name be a derivative of the complex name. For example, Maggie.com_MP.
Step 7. Enter the LAN parameters for Subnet mask and Gateway address.
This information comes from the customer.
Step 8. To display the LAN parameters and status, enter the lscommand at the MP Command Menu
prompt (MP:CM>).
F igu r e 3-40 Th e ls Com m a n d Scr ee n
To return to the MP Main Menu, enter ma.
To exit the MP, enter xat the MP Main Menu.
Step 9. Check the settings for the model string, UUID, and Creator Product Name using the MP:CM> ID
command. See the following example for details:
MP modifiable stable complex configuration data fields.
Model String
Complex System Name
: 9000/800/SD32B
: maggie
Original Product Number: A5201A
Current Product Number : A9834A
UUID
: ffffffff-ffff-ffff-ffff-ffffffffffff
Creator Manufacturer
Creator Product Name
: hp
: superdome server SD32B
Creator Serial Number : USRxxxxxxxx
OEM Manufacturer
OEM Product Name
OEM Serial Number
:
:
:USRxxxxxxxx
Step 10. Set the date and time using the MP command.
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Installing the System
Booting and Verifying the System
Boot in g a n d Ver ifyin g th e Syst em
After installing the system, verify that the proper hardware is installed and booted.
This section describes how to power on the cabinet and boot and test each partition. A console window must
be open for each partition. Two additional windows must also be open: one window for initiating reset on
partitions and the other for monitoring system partition status. Initiate the management processor (MP) in
each window.
NOTE
The HKP should be ON and the 48 V switch on the front panel should be OFF at this time.
Con n ectin g to th e Ma n a gem en t P r ocessor
Before powering on the cabinet, you need to open several windows connected to the MP. Then switch the 48 V
on and boot each partition to the EFI prompt.
Step 1. On the SMS, open the required number of command-prompt windows:
•
•
•
One console window for each partition (MP COoption)
One for initializing RScommand from the MP
One for monitoring partition status (MP VFPoption)
In each window, connect to the MP by entering:
telnet <MP hostname>
or
telnet <IP address>
F igu r e 3-41 Con n ectin g t o H ost
Admin
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Booting and Verifying the System
F igu r e 3-42 Ma in MP Me n u
Step 3. Repeat the first two steps for each partition required.
Step 4. In one window bring up the command prompt by entering cmat the MP> prompt as shown in
F igu r e 3-43 MP Com m a n d Op tion
Step 5. In the another window bring up the Virtual Front Panel (VFP) by entering vfpas shown in
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F igu r e 3-44 MP Vir tu a l F r on t P a n e l
Step 6. From the VFP menu, enter sto select the whole system, or enter the partition number to select a
status is listed because the system 48 V has not been switched on.
F igu r e 3-45 E xa m p le of P a r t ition St a te—Ca bin et Not P ow er e d Up
Step 7. For each of the remaining windows, bring up the partition console for each partition by enter coat
in them means nothing at this point because the cabinet is powered off.
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Booting and Verifying the System
F igu r e 3-46 MP Con sole Op t ion
Pow er in g On t h e System 48 V Su p p ly
Step 1. Switch on the 48V supply from each cabinet front panel.
If the complex has an IOX cabinet, power on this cabinet first.
In a large complex, power on cabinets in one of the two following orders: 9, 8, 1, 0 or 8, 9, 0, 1.
IMPORTANT The MP should be running in each window.
As the cabinet boots, observe the partition activity in the window displaying the VFP.
Step 2. For HP Integrity Superdome/sx2000 systems, follow the procedure in “Booting the HP Integrity
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Installing the System
Booting and Verifying the System
Bootin g th e H P In t egr it y Su p er d om e/sx2000 to a E F I Sh ell
After powering on or using the CM bocommand, all partition console windows will show activity while the
F igu r e 3-47
H P In t egr ity Su p er d om e /sx2000 E F I Boot Ma n a ger
Use the up and down arrow keys on the keyboard to highlight EFI Shell (Built-in)and press Enter. Do
this for all partitions.
After you invoke the EFI Shell, the console window displays the EFI shell prompt shown in Figure 3-48.
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Booting and Verifying the System
F igu r e 3-48
E F I Sh ell P r om p t
NOTE
If autoboot is enabled for an nPartition, you must interrupt it to stop the boot process at the
EFI firmware console.
At this point, the Virtual Front Panel indicates that each partition is at system firmware console as indicated
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Booting and Verifying the System
F igu r e 3-49
H P In te gr it y Su p er d om e/sx2000 P a r tit ion s a t Syst em F ir m w a r e Con sole
Ver ifyin g th e System
Use the following procedure to verify the system:
Step 1. From the CM> prompt, enter psto observe the power status. A status screen similar to the one in
F igu r e 3-50 P ow e r St a tu s F ir st Win d ow
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Booting and Verifying the System
Step 2. At the Select Device: prompt, enter bthen the cabinet number to check the power status of the
F igu r e 3-51 P ow e r St a tu s Win d ow
Figure 3-51 shows that cells are installed in slots 0 and 4. In the cabinet, verify that cells are
physically located in slots 0 and 4.
F igu r e 3-52 P ow e r St a tu s Sh ow in g Sta t e of UGUY LE Ds (a n d Oth er St a tu s)
Step 4. Verify that there is an asterisk (*) in the columns marked MP, CLU, and PM.
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Booting and Verifying the System
IMPORTANT An asterisk (*) appears in the MP column only for cabinet 0; that is, the cabinet
containing the MP. Only cabinet 0 contains the MP.
Verify that there is an asterisk (*) for each of the cells installed in the cabinet by comparing what is
in the Cells column with the cells located inside the cabinet.
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Installing the System
Running JET Software
Ru n n in g J ET Soft w a r e
Ensure that the network diagnostic is enabled at the MP prompt; MP:CM>nd. This needs to be performed in
order to run scan and to do firmware updates to the system.
The J TAG Utility for Scan Tests (J UST) Exploration Tool, or J ET, collects system information for each system
on a network and places it in files for use by other scan tools. J ET gathers configuration data by executing a
series of queries targeted at the MP and the CLU portion of the UGUY board.
IMPORTANT You must resolve any problems you find as a result of running J ET before booting the operating
system.
Ru n n in g J UST
Run the J TAG Utility for Scan Tests (J UST) to ensure the hardware is working properly:
Step 1. Enter jet_setupat the Windows SMS command window or enter scan_setupat the HP-UX
SMS command window.
Step 2. Enter the complex_name, IP address, and system type.
Step 3. Enter jet -s <complex_name>.
Step 4. Enter just -s <complex_name>.
Refer to the Jet User Guide, Just Users Guide, and other related documentation for testing located:
•
•
in the \opt\scansw\docs\sttdirectory on the Windows Support Management Station.
in the /opt/scansw/docs/sttdirectory on the HP-UX Support Management Station.
IMPORTANT Once scan testing has successfully completed, reset the complex by cycling the AC power.
Pow er Cyclin g After Usin g J ET
After using J ET, you must recycle the system power because the offline diagnostic can deallocate the CPUs.
Remove 48 V by issuing the MP pecommand. Then cycle the ac breakers on the rear of the cabinets. See
Appendix C, “Powering the System On and Off,” on page 213 for details on power cycling the system. Leave
power off for about 30 seconds to allow backplane CSRs to reset.
IMPORTANT If the complex has any IOX cabinets, IDs 8 or 9, you must power cycle these cabinets in the
proper sequence.
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Installing the System
Offline Diagnostic Environment (ODE)
Offlin e Dia gn ost ic En vir on m en t (ODE)
Now that scan has been run, you can run all the appropriate diagnostics for this system. See the appropriate
diagnostic documentation for instructions.
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Installing the System
Attaching the Rear Kick Plates
At t a ch in g th e Rea r Kick P la tes
Kick plates protect cables from accidentally being disconnected or damaged and add an attractive cosmetic
touch to the cabinet. You need to attach three metal kick plates to the bottom rear of the cabinet.
To install the kick plates:
Step 1. Hold the left kick plate in position and attach a clip nut (0590-2318) on the cabinet column next to
Step 2. Using a screw (0515-0671) and a T-25 driver, attach the flange on the kick plate to the nut clip.
Step 3. Using a T-10 driver and a screw, attach the bottom of the kick plate to the center hole in the
leveling foot.
F igu r e 3-53 At ta ch in g R ea r Kick P la t es
Step 4. Perform steps 1–3 on the right kick plate.
Step 5. Position the upper flange of the center kick plate under the I/O trays complementary mounting
bracket so as to retain the center kick plate top flanges. No top screws are needed on the center kick
plate due to this bracket. Orient this asymmetrical bracket with the hole located nearest the edge
in the up position.
Step 6. Using a T-20 driver, tighten the thumbscrews at the bottom of the center kick plate.
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Installing the System
Performing a Visual Inspection and Completing the Installation
P er for m in g a Visu a l In sp ect ion a n d Com p let in g th e In sta lla tion
After booting the system, carefully inspect it and reinstall the EMI panels. Here are the steps required to
perform a final inspection and complete the installation:
Step 1. Visually inspect the system to verify that all components are in place and secure.
Step 2. Check that the cables are secured and routed properly.
If the ejectors are broken or open, the cell board is disconnected.
F igu r e 3-54 Cell Boa r d Eject or s
Cell board ejector
Cell board ejectors
(See detail)
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F igu r e 3-55 F r on t E MI P a n el F la n ge a n d Ca b in et H oles
Hole
Flange
See detail
a . Hook the flange at the lower corners of the EMI panel into the holes on the cabinet.
b . Position the panel at the top lip, and lift the panel up while pushing the bottom into position.
You might need to compress the EMI gasket to seat the panel properly.
c. Reattach the screw at the top of the EMI panel.
Step 5. Check that the cables inside the rear enclosure are secure.
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Performing a Visual Inspection and Completing the Installation
a . Align the lip inside the cabinet with the lip on the EMI panel.
F igu r e 3-56 R e in sta llin g t h e Ba ck E MI P a n el
Cabinet EMI
panel lip
EMI
panel lip
b . Push the EMI panel up and in. The EMI gasket may have to be compressed at the top of the
enclosure to get the panel to seat properly.
c. Reattach the screw at the bottom of the EMI panel.
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Installing the System
Conducting a Post Installation Check
Con d u ct in g a P ost In st a lla t ion Ch eck
After the system has been installed in a computer room and verified, conduct the post installation check.
Before turning the system over to the customer, inspect the system visually and clean up the installation
area. Do the following:
•
In sp ect cir cu it b oa r d s. Verify that all circuit boards are installed and properly seated and that the
circuit board retainers are reinstalled.
•
•
In sp ect ca b lin g. Ensure that all cables are installed, secured, and properly routed.
In sp ect t est p oin t s. Verify that test leads are removed from the test points and that the test points are
properly covered.
•
•
Clea n u p a n d d isp ose of d eb r is. Remove all debris from the area and dispose of it properly.
P er for m fin a l ch eck . Inspect the area to ensure that all parts, tools, and other items used to install the
system are disposed of properly. Then close and lock the doors.
•
•
En t er in for m a t ion in t h e Gold Book . When the installation and cleanup are complete, make the
appropriate notations in the Gold Book shipped with the system.
Ob t a in cu st om er a ccep t a n ce (if r eq u ir ed ). This includes thanking the customer for choosing HP.
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Booting and Shutting Down the Operating System
Operating Systems Supported on Cell-based HP Servers
Op er a tin g Syst em s Su p p or t ed on Cell-b a sed H P Ser ver s
HP supports nPartitions on cell-based HP 9000 servers and cell-based HP Integrity servers. The following list
describes the OSes supported on cell-based servers based on the HP sx2000 chipset. HP Integrity servers
have Intel® Itanium® 2 processors and include the following cell-based models based on the HP sx2000
chipset:
•
•
•
HP Integrity Superdome (SD16B, SD32B, and SD64B models)
HP rx8640
HP rx7640
All HP Integrity servers based on the HP sx2000 chipset run the following OSes:
•
•
page 158 for details.
HP Integrity servers based on the HP sx2000 chipset run the following OSes only in nPartitions that have
dual-core Intel® Itanium® 2 processors:
•
HP OpenVMS I64 8.3 — Supported only in nPartitions that have dual-core Intel® Itanium® 2 processors.
Prior releases of OpenVMS I64 are not supported on servers based on the HP sx2000 chipset.
•
Red Hat Enterprise Linux 4 Update 4— On servers based on the HP sx2000 chipset, is supported only in
nPartitions that have dual-core Intel® Itanium® 2 processors. Prior releases of Red Hat Enterprise Linux
are not supported on servers based on the HP sx2000 chipset.
NOTE
Red Hat Enterprise Linux 4 will be supported soon after the release of cell-based HP
Integrity servers with the Intel Itanium 2 dual-core processor. It is not supported on
these servers when they first release.
•
SuSE Linux Enterprise Server 10 — On servers based on the HP sx2000 chipset, is supported only in
nPartitions that have dual-core Intel® Itanium® 2 processors. Prior releases of SuSE Linux Enterprise
Server are not supported on servers based on the HP sx2000 chipset.
NOTE
SuSE Linux Enterprise Server 10 is supported on HP rx8640 servers, and will be supported
on other cell-based HP Integrity servers with the Intel Itanium 2 dual-core processor
(rx7640 and Superdome) soon after the release of those servers.
NOTE
On servers based on the HP sx2000 chipset, each cell has a cell local memory (CLM) parameter,
which determines how firmware may interleave memory residing on the cell. The supported
and recommended CLM setting for the cells in an nPartition depends on the OS running in the
nPartition. Some OSes support using CLM, and some do not. For details on CLM support for
the OS you will boot in an nPartition, refer to the booting section for that OS.
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System Boot Configuration Options
Syst em Boot Con figu r a t ion Op tion s
This section briefly discusses the system boot options you can configure on cell-based servers. You can
configure boot options that are specific to each nPartition in the server complex.
HP In tegr ity Boot Con figu r a t ion Op t ion s
On cell-based HP Integrity servers, you must properly specify the ACPI configuration value, which affects the
OS startup process and on some servers can affect the shutdown behavior. You also can configure boot device
paths and the autoboot setting for the nPartition. The following list describes each configuration option:
•
Boot Options List
The boot options list is a list of loadable items available for you to select from the EFI Boot Manager
menu. Ordinarily, the boot options list includes the EFI Shell and one or more OS loaders.
The following example includes boot options for HP OpenVMS, Microsoft Windows, HP-UX, and the EFI
Shell. The final item in the EFI Boot Manager menu, the Boot Configuration menu, is not a boot option.
The Boot Configuration menu enables system configuration through a maintenance menu.
EFI Boot Manager ver 1.10 [14.61] Please select a boot option
HP OpenVMS 8.3
EFI Shell [Built-in]
Windows Server 2003, Enterprise
HP-UX Primary Boot: 4/0/1/1/0.2.0
Boot Option Maintenance Menu
Use ^ and v to change option(s). Use Enter to select an option
NOTE
In some versions of EFI, the Boot Configuration menu is listed as the Boot Option
Maintenance Menu.
To manage the boot options list for each system use the EFI Shell, the EFI Boot Configuration menu, or
OS utilities.
At the EFI Shell, the bcfgcommand supports listing and managing the boot options list for all OSs
except Microsoft Windows. On HP Integrity systems with Windows installed the \MSUtil\nvrboot.efi
utility is provided for managing Windows boot options from the EFI Shell. On HP Integrity systems with
OpenVMS installed, the \efi\vms\vms_bcfg.efiand \efi\vms\vms_showutilities are provided for
managing OpenVMS boot options.
The EFI Boot Configuration menu provides the Add a Boot Option, Delete Boot Option(s), and Change
Boot Order menu items. (If you must add an EFI Shell entry to the boot options list, use this method.)
To save and restore boot options, use the EFI Shell variablecommand. The variable -save file
command saves the contents of the boot options list to the specified fileon an EFI disk partition. The
variable -restore filecommand restores the boot options list from the specified filethat was
previously saved. Details also are available by entering help variableat the EFI Shell.
OS utilities for managing the boot options list include the HP-UX setbootcommand and the HP
OpenVMS @SYS$MANAGER:BOOT_OPTIONS.COMcommand.
The OpenVMS I64 installation and upgrade procedures assist you in setting up and validating a boot
option for your system disk. HP recommends that you allow the procedure to do this. Alternatively, you
can use the @SYS$MANAGER:BOOT_OPTIONS.COMcommand (also referred to as the OpenVMS I64 Boot
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System Boot Configuration Options
Manager utility) to manage boot options for your system disk. The OpenVMS I64 Boot Manager
(BOOT_OPTIONS.COM) utility is a menu-based utility and is easier to use than EFI. To configure OpenVMS
I64 booting on Fibre Channel devices, you must use the OpenVMS I64 Boot Manager utility
(BOOT_OPTIONS.COM). For more information on this utility and other restrictions, refer to the HP
OpenVMS for Integrity Servers Upgrade and Installation Manual.
For details, refer to the following sections.
•
Hyper-Threading
nPartitions that have dual-core Intel® Itanium® 2 processors can support Hyper-Threading.
Hyper-Threading provides the ability for processors to create a second virtual core that allows additional
efficiencies of processing. For example, a dual-core processor with Hyper-Threading active can
simultaneously run four threads.
The EFI Shell cpuconfigcommand can enable and disable Hyper-Threading for an nPartition whose
processors support it. Recent releases of the nPartition Commands and Partition Manager also support
Hyper-Threading.
Details of the cpuconfigcommand are given below and are available by entering help cpuconfigat the
EFI Shell.
— cpuconfig threads— Reports Hyper-Threading status for the nPartition
— cpuconfig threads on— Enables Hyper-Threading for the nPartition. After enabling
Hyper-Threading the nPartition must be reset for Hyper-Threading to be active.
— cpuconfig threads off— Disables Hyper-Threading for the nPartition. After disabling
Hyper-Threading the nPartition must be reset for Hyper-Threading to be inactive
After enabling or disabling Hyper-Threading, the nPartition must be reset for the Hyper-Threading
change to take effect. Use the EFI Shell resetcommand.
Enabled means that Hyper-Threading will be active on the next reboot of the nPartition. Active means
that each processor core in the nPartition has a second virtual core that enables simultaneously running
multiple threads.
•
•
Autoboot Setting
You can configure the autoboot setting for each nPartition either by using the autobootcommand at the
EFI Shell, or by using the Set Auto Boot TimeOut menu item at the EFI Boot Option Maintenance menu.
To set autoboot from HP-UX, use the setbootcommand.
ACPI Configuration Value—HP Integrity Server OS Boot
On cell-based HP Integrity servers you must set the proper ACPI configuration for the OS that will be
booted on the nPartition.
To check the ACPI configuration value, issue the acpiconfigcommand with no arguments at the EFI
Shell.
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System Boot Configuration Options
To set the ACPI configuration value, issue the acpiconfig valuecommand at the EFI Shell, where
valueis either defaultor windows. Then reset the nPartition by issuing the resetEFI Shell command
for the setting to take effect.
The ACPI configuration settings for the supported OSes are in the following list.
— HP-UX ACPI Configuration: default
On cell-based HP Integrity servers, to boot or install the HP-UX OS, you must set the ACPI
configuration value for the nPartition to default.
— HP OpenVMS I64 ACPI Configuration: default
On cell-based HP Integrity servers, to boot or install the HP OpenVMS I64 OS, you must set the ACPI
configuration value for the nPartition to default.
— Windows ACPI Configuration: windows
On cell-based HP Integrity servers, to boot or install the Windows OS, you must set the ACPI
configuration value for the nPartition to windows.
— Red Hat Enterprise Linux ACPI Configuration: default
On cell-based HP Integrity servers, to boot or install the Red Hat Enterprise Linux OS, you must set
the ACPI configuration value for the nPartition to default.
For details, refer to “ACPI Configuration for Red Hat Enterprise Linux Must Be default” on page 165.
— SuSE Linux Enterprise Server ACPI Configuration: default
On cell-based HP Integrity servers, to boot or install the SuSE Linux Enterprise Server OS, you must
set the ACPI configuration value for the nPartition to default.
•
Boot Modes on HP Integrity nPartitions: nPars and vPars Modes
On cell-based HP Integrity servers, each nPartition can be configured in either of two boot modes:
— nParsBoot Mode
In nParsboot mode, an nPartition is configured to boot any single operating system in the standard
environment. When an nPartition is in nParsboot mode, it cannot boot the vPars monitor and
therefore does not support HP-UX virtual partitions.
— vParsBoot Mode
In vParsboot mode, an nPartition is configured to boot into the vPars environment. When an
nPartition is in vParsboot mode, it can only boot the vPars monitor and therefore it only supports
HP-UX virtual partitions and it does not support booting HP OpenVMS I64, Microsoft Windows, or
other operating systems. On an nPartition in vParsboot mode, HP-UX can boot only within a virtual
partition (from the vPars monitor) and cannot boot as a standalone, single operating system in the
nPartition.
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System Boot Configuration Options
CAUTION
An nPartition on an HP Integrity server cannot boot HP-UX virtual partitions when in
nParsboot mode. Likewise, an nPartition on an HP Integrity server cannot boot an
operating system outside of a virtual partition when in vParsboot mode.
To display or set the boot mode for an nPartition on a cell-based HP Integrity server, use any of the
following tools as appropriate. Refer to Installing and Managing HP-UX Virtual Partitions (vPars), Sixth
Edition, for details, examples, and restrictions.
— parconfigEFI shell command
The parconfigcommand is a built-in EFI shell command. Refer to the help parconfigcommand for
details.
— \EFI\HPUX\vparconfigEFI shell command
The vparconfigcommand is delivered in the \EFI\HPUXdirectory on the EFI system partition of the
disk where HP-UX virtual partitions has been installed on a cell-based HP Integrity server. For usage
details, enter the vparconfigcommand with no options.
— vparenvHP-UX command
On cell-based HP Integrity servers only, the vparenvHP-UX command is installed on HP-UX 11iv2
(B.11.23) systems that have the HP-UX virtual partitions software. Refer to vparenv (1m) for details.
NOTE
On HP Integrity servers, nPartitions that do not have the parconfigEFI shell command
do not support virtual partitions and are effectively in nPars boot mode.
HP recommends that you do not use the parconfigEFI shell command and instead use
the \EFI\HPUX\vparconfigEFI shell command to manage the boot mode for nPartitions
on cell-based HP Integrity servers.
Refer to Installing and Managing HP-UX Virtual Partitions (vPars), Sixth Edition, for
details.
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Booting and Shutting Down HP-UX
Boot in g a n d Sh u t t in g Dow n H P -UX
This section presents procedures for booting and shutting down HP-UX on cell-based HP servers and a
procedure for adding HP-UX to the boot options list on HP Integrity servers.
•
To determine whether the cell local memory (CLM) configuration is appropriate for HP-UX, refer to
•
To add an HP-UX entry to the nPartition boot options list on an HP Integrity server, refer to “Adding
•
•
HP -UX Su p p or t for Cell Loca l Mem or y
On servers based on the HP sx2000 chipset, each cell has a cell local memory (CLM) parameter, which
determines how firmware interleaves memory residing on the cell.
IMPORTANT HP-UX 11i Version 2 (B.11.23) supports using CLM. The optimal CLM settings for HP-UX
B.11.23 depend on the applications and workload the OS is running.
To check CLM configuration details from an OS, use Partition Manager or the parstatuscommand. For
example, the parstatus -V -c#command and parstatus -V -p#command report the CLM amount
requested and CLM amount allocated for the specified cell (-c#, where #is the cell number) or the specified
nPartition (-p#, where #is the nPartition number). For details, refer to the HP System Partitions Guide or the
Partition Manager Web site (http://docs.hp.com/en/PARMGR2/).
To display CLM configuration details from the EFI Shell on a cell-based HP Integrity server, use the info
memcommand. If the amount of noninterleaved memory reported is less than 512 MB, then no CLM is
configured for any cells in the nPartition (and the indicated amount of noninterleaved memory is used by
system firmware). If the info memcommand reports more than 512 MB of noninterleaved memory, then use
Partition Manager or the parstatuscommand to confirm the CLM configuration details.
To set the CLM configuration, use Partition Manager or the parmodifycommand. For details, refer to the HP
System Partitions Guide or the Partition Manager Web site (http://docs.hp.com/en/PARMGR2/).
Ad d in g HP -UX to t h e Boot Op t ion s List
This section describes how to add an HP-UX entry to the system boot options list.
You can add the \EFI\HPUX\HPUX.EFIloader to the boot options list from the EFI Shell or EFI Boot
Configuration menu (or in some versions of EFI, the Boot Option Maintenance Menu).
See “Boot Options List” on page 141 for additional information about saving, restoring, and creating boot
options.
NOTE
On HP Integrity servers, the OS installer automatically adds an entry to the boot options list.
Adding an HP-UX Boot Option
This procedure adds an HP-UX item to the boot options list from the EFI Shell.
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Booting and Shutting Down HP-UX
To add an HP-UX boot option when logged in to HP-UX, use the setbootcommand. For details,
refer to the setboot (1M) manpage.
Step 1. Access the EFI Shell environment.
Log in to the management processor, and enter COto access the system console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
From the EFI Boot Manager menu, select the EFI Shell menu option to access the EFI Shell
environment.
Step 2. Access the EFI System Partition for the device from which you want to boot HP-UX (fsX:where X
is the file system number) .
For example, enter fs2:to access the EFI System Partition for the bootable file system number 2.
The EFI Shell prompt changes to reflect the file system currently accessed.
The full path for the HP-UX loader is \EFI\HPUX\HPUX.EFI, and it should be on the device you are
accessing.
Step 3. At the EFI Shell environment, use the bcfgcommand to manage the boot options list.
The bcfgcommand includes the following options for managing the boot options list:
• bcfg boot dump— Display all items in the boot options list for the system.
bcfg boot rm #— Remove the item number specified by #from the boot options list.
bcfg boot mv #a #b— Move the item number specified by #ato the position specified by #bin the boot
options list.
bcfg boot add # file.efi "Description"— Add a new boot option to the position in the boot options list
specified by #. The new boot option references file.efiand is listed with the title specified by Description.
For example, bcfg boot add 1 \EFI\HPUX\HPUX.EFI "HP-UX 11i" adds an HP-UX 11i item
as the first entry in the boot options list.
Refer to the help bcfgcommand for details.
Step 4. Exit the console and management processor interfaces if you are finished using them.
To exit the EFI environment press ^B (Control+B); this exits the system console and returns to the
management processor Main Menu. To exit the management processor, enter Xat the Main Menu.
Bootin g HP -UX
This section describes the following methods of booting HP-UX:
•
booting HP-UX in multiuser mode.
•
•
mode.
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CAUTION
ACPI Configuration for HP-UX Must Be default
On cell-based HP Integrity servers, to boot the HP-UX OS, an nPartition ACPI configuration
value must be set to default.
At the EFI Shell interface, enter the acpiconfigcommand with no arguments to list the
current ACPI configuration. If the acpiconfigvalue is not set to default, then HP-UX cannot
boot. In this situation you must reconfigure acpiconfig; otherwise, booting will be interrupted
with a panic when the HP-UX kernel is launched.
To set the ACPI configuration for HP-UX:
1. At the EFI Shell interface, enter the acpiconfig defaultcommand.
2. Enter the resetcommand for the nPartition to reboot with the proper (default)
configuration for HP-UX.
Sta n d a r d H P -UX Bootin g
This section describes how to boot HP-UX on cell-based HP Integrity servers.
On HP Integrity servers, to boot HP-UX use either of the following procedures:
•
•
HP-UX Booting (EFI Boot Manager)
From the EFI Boot Manager menu, select an item from the boot options list to boot HP-UX using
that boot option. The EFI Boot Manager is available only on HP Integrity servers.
details.
Step 1. Access the EFI Boot Manager menu for the nPartition on which you want to boot HP-UX.
Log in to the management processor, and enter COto access the Console list. Select the nPartition
console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
Step 2. At the EFI Boot Manager menu, select an item from the boot options list.
Each item in the boot options list references a specific boot device and provides a specific set of boot
options or arguments to be used when booting the device.
Step 3. Press Enter to initiate booting using the chosen boot option.
Step 4. Exit the console and management processor interfaces if you are finished using them.
To exit the EFI environment, press ^B (Control+B); this exits the nPartition console and returns to
the management processor Main Menu. To exit the management processor, enter Xat the Main
Menu.
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HP-UX Booting (EFI Shell)
From the EFI Shell environment, to boot HP-UX on a device first access the EFI System Partition
for the root device (for example fs0:) and then enter HPUXto initiate the loader. The EFI Shell is
available only on HP Integrity servers.
details.
Step 1. Access the EFI Shell environment for the nPartition on which you want to boot HP-UX.
Log in to the management processor, and enter COto access the Console list. Select the nPartition
console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
From the EFI Boot Manager menu, select the EFI Shell menu option to access the EFI Shell
environment.
Step 2. At the EFI Shell environment, issue the acpiconfigcommand to list the current ACPI
configuration for the local nPartition.
On cell-based HP Integrity servers, to boot the HP-UX OS, an nPartition ACPI configuration value
must be set to default. If the acpiconfigvalue is not set to default, then HP-UX cannot boot; in
this situation you must reconfigure acpiconfigor booting will be interrupted with a panic when
launching the HP-UX kernel.
To set the ACPI configuration for HP-UX:
a . At the EFI Shell interface enter the acpiconfig defaultcommand.
b . Enter the resetcommand for the nPartition to reboot with the proper (default) configuration
for HP-UX.
Step 3. At the EFI Shell environment, issue the mapcommand to list all currently mapped bootable devices.
The bootable file systems of interest typically are listed as fs0:, fs1:, and so on.
Step 4. Access the EFI System Partition for the device from which you want to boot HP-UX (fsX:where X
is the file system number).
For example, enter fs2:to access the EFI System Partition for the bootable file system number 2.
The EFI Shell prompt changes to reflect the file system currently accessed.
The file system number can change each time it is mapped (for example, when the nPartition boots,
or when the map -rcommand is issued).
Step 5. When accessing the EFI System Partition for the desired boot device, issue the HPUXcommand to
initiate the HPUX.EFIloader on the device you are accessing.
The full path for the loader is \EFI\HPUX\HPUX.EFI. When initiated, HPUX.EFIreferences the
\EFI\HPUX\AUTOfile and boots HP-UX using the default boot behavior specified in the AUTOfile.
You are given 10 seconds to interrupt the automatic booting of the default boot behavior. Pressing
any key during this 10-second period stops the HP-UX boot process and enables you to interact
with the HPUX.EFIloader. To exit the loader (the HPUX>prompt), enter exit(this returns you to the
EFI Shell).
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To boot the HP-UX OS, do not type anything during the 10-second period given for stopping at the
HPUX.EFIloader.
Shell> map
Device mapping table
fs0 : Acpi(000222F0,269)/Pci(0|0)/Scsi(Pun8,Lun0)/HD(Part1,Sig72550000)
blk0 : Acpi(000222F0,269)/Pci(0|0)/Scsi(Pun8,Lun0)
blk1 : Acpi(000222F0,269)/Pci(0|0)/Scsi(Pun8,Lun0)/HD(Part1,Sig72550000)
blk2 : Acpi(000222F0,269)/Pci(0|0)/Scsi(Pun8,Lun0)/HD(Part2,Sig72550000)
blk3 : Acpi(000222F0,2A8)/Pci(0|0)/Scsi(Pun8,Lun0)
blk4 : Acpi(000222F0,2A8)/Pci(0|1)/Scsi(Pun2,Lun0)
Shell> fs0:
fs0:\> hpux
(c) Copyright 1990-2002, Hewlett Packard Company.
All rights reserved
HP-UX Boot Loader for IA64 Revision 1.723
Press Any Key to interrupt Autoboot
\efi\hpux\AUTO ==> boot vmunix
Seconds left till autoboot -
9
Step 6. Exit the console and management processor interfaces if you are finished using them.
To exit the EFI environment, press ^B (Control+B); this exits the nPartition console and returns to
the management processor Main Menu. To exit the management processor, enter Xat the Main
Menu.
Sin gle-User Mod e H P -UX Boot in g
This section describes how to boot HP-UX in single-user mode on cell-based HP Integrity servers.
Single-User Mode HP-UX Booting (EFI Shell)
From the EFI Shell environment, boot in single-user mode by stopping the boot process at the
HPUX.EFIinterface (the HP-UX Boot Loader prompt, HPUX>) by entering the boot -is vmunix
command. The EFI Shell is available only on HP Integrity servers.
details.
Step 1. Access the EFI Shell environment for the nPartition on which you want to boot HP-UX in
single-user mode.
Log in to the management processor, and enter COto access the Console list. Select the nPartition
console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
From the EFI Boot Manager menu, select the EFI Shell menu option to access the EFI Shell
environment.
Step 2. Access the EFI System Partition for the device from which you want to boot HP-UX (fsX:where X
is the file system number).
Step 3. When accessing the EFI System Partition for the desired boot device, issue the HPUXcommand to
initiate the \EFI\HPUX\HPUX.EFIloader on the device you are accessing.
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Step 4. Boot to the HP-UX Boot Loader prompt (HPUX>) by pressing any key within the 10 seconds given for
interrupting the HP-UX boot process. You will use the HPUX.EFIloader to boot HP-UX in
single-user mode in the next step.
After you press any key, the HPUX.EFIinterface (the HP-UX Boot Loader prompt, HPUX>) is
provided. For help using the HPUX.EFIloader, enter the helpcommand. To return to the EFI Shell,
enter exit.
fs0:\> hpux
(c) Copyright 1990-2002, Hewlett Packard Company.
All rights reserved
HP-UX Boot Loader for IA64 Revision 1.723
Press Any Key to interrupt Autoboot
\efi\hpux\AUTO ==> boot vmunix
Seconds left till autoboot -
9
[User Types a Key to Stop the HP-UX Boot Process and Access the HPUX.EFI Loader ]
Type ’help’ for help
HPUX>
Step 5. At the HPUX.EFIinterface (the HP-UX Boot Loader prompt, HPUX>), enter the boot -is vmunix
command to boot HP-UX (the /stand/vmunixkernel) in single-user (-is) mode.
HPUX> boot -is vmunix
> System Memory = 4063 MB
loading section 0
................................................... (complete)
loading section 1
........ (complete)
loading symbol table
loading System Directory(boot.sys) to MFS
....
loading MFSFILES Directory(bootfs) to MFS
......
Launching /stand/vmunix
SIZE: Text:25953K + Data:3715K + BSS:3637K = Total:33306K
Console is on a Serial Device
Booting kernel...
Step 6. Exit the console and management processor interfaces if you are finished using them.
To exit the EFI environment, press ^B (Control+B); this exits the nPartition console and returns to
the management processor Main Menu. To exit the management processor, enter Xat the Main
Menu.
LVM-Ma in t en a n ce Mod e H P -UX Boot in g
This section describes how to boot HP-UX in LVM-maintenance mode on cell-based HP Integrity servers.
LVM-Maintenance Mode HP-UX Booting (EFI Shell)
From the EFI Shell environment, boot in LVM-maintenance mode by stopping the boot process at
the HPUX.EFIinterface (the HP-UX Boot Loader prompt, HPUX>) by entering the boot -lm vmunix
command. The EFI Shell is available only on HP Integrity servers.
details.
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Step 1. Access the EFI Shell environment for the nPartition on which you want to boot HP-UX in
LVM-maintenance mode.
Log in to the management processor, and enter COto access the Console list. Select the nPartition
console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
From the EFI Boot Manager menu, select the EFI Shell menu option to access the EFI Shell
environment.
Step 2. Access the EFI System Partition for the device from which you want to boot HP-UX (fsX:where X
is the file system number).
Step 3. When accessing the EFI System Partition for the desired boot device, issue the HPUXcommand to
initiate the \EFI\HPUX\HPUX.EFIloader on the device you are accessing.
Step 4. Type any key within the 10 seconds given for interrupting the HP-UX boot process. This stops the
boot process at the HPUX.EFIinterface (the HP-UX Boot Loader prompt, HPUX>).
Step 5. At the HPUX.EFIinterface, enter the boot -lm vmunixcommand to boot HP-UX (the
/stand/vmunixkernel) in LVM-maintenance (-lm) mode.
Step 6. Exit the console and management processor interfaces if you are finished using them.
To exit the EFI environment, press ^B (Control+B); this exits the nPartition console and returns to
the management processor Main Menu. To exit the management processor, enter Xat the Main
Menu.
Sh u ttin g Dow n HP -UX
When HP-UX is running on an nPartition, you can shut down HP-UX using the shutdowncommand.
On nPartitions you have the following options when shutting down HP-UX:
•
To shut down HP-UX and reboot an nPartition: shutdown -r
On cell-based HP Integrity servers, the shutdown -rcommand is equivalent to the shutdown -R
command.
•
To shut down HP-UX and halt an nPartition: shutdown -h
On cell-based HP Integrity servers, the shutdown -hcommand is equivalent to the shutdown -R -H
command.
•
•
To perform a reboot for reconfiguration of an nPartition: shutdown -R
To hold an nPartition at a shutdown for reconfiguration state: shutdown -R -H
For details, refer to the shutdown (1M) manpage.
Shutting Down HP-UX
From the HP-UX command line, issue the shutdowncommand to shut down the HP-UX OS.
Step 1. Log in to HP-UX running on the nPartition that you want to shut down.
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Log in to the management processor for the server and use the Console menu to access the system
console. Accessing the console through the MP enables you to maintain console access to the system
after HP-UX has shut down.
Step 2. Issue the shutdowncommand with the appropriate command-line options.
The command-line options you specify dictate the way in which HP-UX is shut down, whether the
nPartition is rebooted, and whether any nPartition configuration changes take place (for example,
adding or removing cells).
Use the following list to choose an HP-UX shutdown option for your nPartition:
•
Shut down HP-UX and halt the nPartition.
On cell-based HP Integrity servers, the shutdown -hcommand puts an nPartition into the
shutdown for reconfiguration state; for details, refer to the discussion of shutdown -R -Hin
this list.
•
Shut down HP-UX and reboot the nPartition.
Issue the shutdown -rcommand to shut down and reboot the nPartition.
On cell-based HP Integrity servers, the shutdown -rcommand is equivalent to the shutdown
-Rcommand.
•
•
Perform a reboot for reconfiguration of the nPartition.
Issue the HP-UX shutdown -Rcommand to perform a reboot for reconfiguration.
This shuts down HP-UX, reconfigures the nPartition if needed, and reboots the nPartition.
Reboot the nPartition and put it into the shutdown for reconfiguration state.
Use the HP-UX shutdown -R -Hcommand to hold the nPartition in the shutdown for
reconfiguration state.
This leaves the nPartition and all its cells in an inactive state (the nPartition can be
reconfigured remotely).
To reboot the nPartition, you must do so manually by using the BOcommand at the
management processor Command Menu.
If HP-UX is halted on the nPartition, thus not allowing you to use the shutdowncommand, you can
reboot or reset the nPartition by issuing commands from the management processor Command
Menu.
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Boot in g a n d Sh u t t in g Dow n H P Op en VMS I64
This section presents procedures for booting and shutting down HP OpenVMS I64 on cell-based HP Integrity
servers and procedures for adding HP OpenVMS to the boot options list.
•
To determine whether the cell local memory (CLM) configuration is appropriate for HP OpenVMS, refer
•
To add an HP OpenVMS entry to the boot options list, refer to “Adding HP OpenVMS to the Boot Options
•
•
HP Op en VMS I64 Su p p or t for Cell Loca l Mem or y
On servers based on the HP sx2000 chipset, each cell has a cell local memory (CLM) parameter, which
determines how firmware interleaves memory residing on the cell.
IMPORTANT HP OpenVMS I64 does not support using CLM. Before booting OpenVMS on an nPartition, you
must ensure that the CLM parameter for each cell in the nPartition is set to zero (0). Although
you might be able to boot OpenVMS on an nPartition with CLM configured, any memory
configured as cell local is unusable, and such a configuration is untested and unsupported.
To check CLM configuration details from an OS, use Partition Manager or the parstatuscommand. For
example, the parstatus -V -c#command and parstatus -V -p#command report the CLM amount
requested and CLM amount allocated for the specified cell (-c#, where #is the cell number) or the specified
nPartition (-p#, where #is the nPartition number). For details, refer to the HP System Partitions Guide or the
Partition Manager Web site (http://docs.hp.com/en/PARMGR2/).
To display CLM configuration details from the EFI Shell on a cell-based HP Integrity server, use the info
memcommand. If the amount of noninterleaved memory reported is less than 512 MB, then no CLM is
configured for any cells in the nPartition (and the indicated amount of noninterleaved memory is used by
system firmware). If the info memcommand reports more than 512 MB of noninterleaved memory, then use
Partition Manager or the parstatuscommand to confirm the CLM configuration details.
To set the CLM configuration, use Partition Manager or the parmodifycommand. For details, refer to the HP
System Partitions Guide or the Partition Manager Web site (http://docs.hp.com/en/PARMGR2/).
Ad d in g HP Op en VMS t o t h e Boot Op t ion s List
On HP Integrity servers, you can use the following procedures to manage boot options list entries for HP
OpenVMS.
You can add the \efi\vms\vms_loader.efiloader to the boot options list from the EFI Shell or EFI Boot
Configuration menu (or in some versions of EFI, the Boot Option Maintenance Menu).
See “Boot Options List” on page 141 for additional information about saving, restoring, and creating boot
options.
NOTE
OpenVMS I64 installation and upgrade procedures assist you in setting up and validating a
boot option for your system disk. HP recommends that you allow the procedure to do this.
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To configure booting on Fibre Channel devices, you must use the OpenVMS I64 Boot Manager
utility (BOOT_OPTIONS.COM). For more information on this utility and other restrictions, refer
to the HP OpenVMS for Integrity Servers Upgrade and Installation Manual.
Adding an HP OpenVMS Boot Option
This procedure adds an HP OpenVMS item to the boot options list from the EFI Shell.
To add an HP OpenVMS boot option when logged in to OpenVMS, use the
@SYS$MANAGER:BOOT_OPTIONS.COMcommand.
Step 1. Access the EFI Shell environment.
Log in to the management processor, and enter COto access the system console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
From the EFI Boot Manager menu, select the EFI Shell menu option to access the EFI Shell
environment.
Step 2. Access the EFI System Partition for the device from which you want to boot HP OpenVMS (fsX:,
where Xis the file system number).
For example, enter fs2:to access the EFI System Partition for the bootable file system number 2.
The EFI Shell prompt changes to reflect the file system currently accessed.
The full path for the HP OpenVMS loader is \efi\vms\vms_loader.efi, and it should be on the
device you are accessing.
Step 3. At the EFI Shell environment, use the bcfgcommand to manage the boot options list.
You can also accomplish this step by using the \efi\vms\vms_bcfg.efiand
\efi\vms\vms_show.efiutilities, which are available on the EFI System Partition for HP
OpenVMS. Both vms_bcfgand vms_showare unique utilities for OpenVMS I64. The vms_bcfg
utility differs from the bcfgEFI command in that vms_bcfgenables you to specify boot devices
using device names consistent with OpenVMS naming conventions.
The bcfgcommand includes the following options for managing the boot options list:
• bcfg boot dump— Display all items in the boot options list for the system.
bcfg boot rm #— Remove the item number specified by #from the boot options list.
bcfg boot mv #a #b— Move the item number specified by #ato the position specified by #bin the boot
options list.
bcfg boot add # file.efi "Description"— Add a new boot option to the position in the boot options list
specified by #. The new boot option references file.efiand is listed with the title specified by Description.
For example, bcfg boot add 1 \efi\vms\vms_loader.efi "HP OpenVMS" adds an HP
OpenVMS item as the first entry in the boot options list.
Refer to the help bcfgcommand for details.
Step 4. Exit the console and management processor interfaces if you are finished using them.
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To exit the EFI environment, press ^B (Control+B); this exits the nPartition console and returns to
the management processor Main Menu. To exit the management processor, enter Xat the Main
Menu.
Bootin g HP Op en VMS
To boot HP OpenVMS I64 on a cell-based HP Integrity server use either of the following procedures.
•
•
CAUTION
ACPI Configuration for HP OpenVMS I64 Must Be default
On cell-based HP Integrity servers, to boot the HP OpenVMS OS, an nPartition ACPI
configuration value must be set to default.
At the EFI Shell interface, enter the acpiconfigcommand with no arguments to list the
current ACPI configuration. If the acpiconfigvalue is not set to default, then OpenVMS
cannot boot. In this situation, you must reconfigure acpiconfig; otherwise, booting will fail
and report the INCONSTATEcode when OpenVMS is launched.
To set the ACPI configuration for HP OpenVMS I64:
1. At the EFI Shell interface enter the acpiconfig defaultcommand.
2. Enter the resetcommand for the nPartition to reboot with the proper (default)
configuration for OpenVMS.
Booting HP OpenVMS (EFI Boot Manager)
From the EFI Boot Manager menu, select an item from the boot options list to boot HP OpenVMS
using the selected boot option.
Step 1. Access the EFI Boot Manager menu for the system on which you want to boot HP OpenVMS.
Log in to the management processor, and enter COto select the system console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
Step 2. At the EFI Boot Manager menu, select an item from the boot options list.
Each item in the boot options list references a specific boot device and provides a specific set of boot
options or arguments to use when booting the device.
Step 3. Press Enter to initiate booting using the selected boot option.
Step 4. Exit the console and management processor interfaces when you have finished using them.
To exit the EFI environment press ^B (Control+B); this exits the system console and returns to the
management processor Main Menu. To exit the management processor, enter Xat the Main Menu.
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Booting HP OpenVMS (EFI Shell)
From the EFI Shell environment, to boot HP OpenVMS on a device first access the EFI System
Partition for the root device (for example fs0:), and enter \efi\vms\vms_loaderto initiate the
OpenVMS loader.
Step 1. Access the EFI Shell environment for the system on which you want to boot HP OpenVMS.
Log in to the management processor, and enter COto select the system console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
From the EFI Boot Manager menu, select the EFI Shell menu option to access the EFI Shell
environment.
Step 2. At the EFI Shell environment, issue the mapcommand to list all currently mapped bootable devices.
The bootable file systems of interest typically are listed as fs0:, fs1:, and so on.
Step 3. Access the EFI System Partition for the device from which you want to boot HP OpenVMS (fsX:,
where Xis the file system number).
For example, enter fs2:to access the EFI System Partition for the bootable file system number 2.
The EFI Shell prompt changes to reflect the file system currently accessed.
Also, the file system number might change each time it is mapped (for example, when the system
boots, or when the map -rcommand is issued).
Step 4. When accessing the EFI System Partition for the desired boot device, issue the
\efi\vms\vms_loadercommand to initiate the vms_loader.efiloader on the device you are
accessing.
fs5:> \efi\vms\vms_loader.efi
HP OpenVMS Industry Standard 64 Operating System, Version V8.2-1
Copyright 1976-2005 Hewlett-Packard Development Company, L.P.
%PKA0, Copyright (c) 1998 LSI Logic PKW V3.2.20 ROM 4.19
%PKA0, SCSI Chip is SYM53C1010/66, Operating mode is LVD Ultra3 SCSI
%SMP-I-CPUTRN, CPU #01 has joined the active set.
%SMP-I-CPUTRN, CPU #02 has joined the active set.
...
Step 5. Exit the console and management processor interfaces when you have finished using them.
To exit the EFI environment press ^B (Control+B); this exits the system console and returns to the
management processor Main Menu. To exit the management processor, enter Xat the Main Menu.
Sh u ttin g Dow n HP Op en VMS
This section describes how to shut down the HP OpenVMS OS on cell-based HP Integrity servers.
Shutting Down HP OpenVMS
From the HP OpenVMS command line, issue the @SYS$SYSTEM:SHUTDOWNcommand to shut down
the OpenVMS OS.
Step 1. Log in to HP OpenVMS running on the system that you want to shut down.
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Log in to the management processor (MP) for the server and use the Console menu to access the
system console. Accessing the console through the MP enables you to maintain console access to the
system after HP OpenVMS has shut down.
Step 2. At the OpenVMS command line (DCL) issue the @SYS$SYSTEM:SHUTDOWNcommand and specify the
shutdown options in response to the prompts given.
>@SYS$SYSTEM:SHUTDOWN
SHUTDOWN -- Perform an Orderly System Shutdown
on node RSNVMS
How many minutes until final shutdown [0]:
Reason for shutdown [Standalone]:
Do you want to spin down the disk volumes [NO]?
Do you want to invoke the site-specific shutdown procedure [YES]?
Should an automatic system reboot be performed [NO]? yes
When will the system be rebooted [shortly via automatic reboot]:
Shutdown options (enter as a comma-separated list):
REBOOT_CHECK
SAVE_FEEDBACK
DISABLE_AUTOSTART
POWER_OFF
Check existence of basic system files
Save AUTOGEN feedback information from this boot
Disable autostart queues
Request console to power-off the system
Shutdown options [NONE]:
%SHUTDOWN-I-OPERATOR, this terminal is now an operator’s console
...
NOTE
HP OpenVMS I64 currently does not support the POWER_OFFshutdown option.
The SYS$SYSTEM:SHUTDOWN.COMcommand prompts establish the shutdown behavior, including the
shutdown time and whether the system is rebooted after it is shut down.
•
To perform a reboot for reconfig from OpenVMS I64 running on an nPartition, issue
@SYS$SYSTEM:SHUTDOWN.COMfrom OpenVMS, and then enter Yesat the “Should an automatic
system reboot be performed” prompt.
•
To perform a shutdown for reconfig of an nPartition running OpenVMS I64:
1. Issue @SYS$SYSTEM:SHUTDOWN.COMfrom OpenVMS and enter Noat the “Should an
automatic system reboot be performed” prompt.
2. Access the management processor and, from the management processor Command Menu,
issue the RRcommand and specify the nPartition. The nPartition you specify will be put in
the shutdown for reconfig state.
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Boot in g a n d Sh u t t in g Dow n Micr osoft Win d ow s
This section presents procedures for booting and shutting down the Microsoft Windows OS on cell-based HP
Integrity servers and a procedure for adding Windows to the boot options list.
•
To determine whether the cell local memory (CLM) configuration is appropriate for Windows, refer to
•
To add a Windows entry to the boot options list, refer to “Adding Microsoft Windows to the Boot Options
•
•
Micr osoft Win d ow s Su p p or t for Cell Loca l Mem or y
On servers based on the HP sx2000 chipset, each cell has a cell local memory (CLM) parameter, which
determines how firmware interleaves memory residing on the cell.
IMPORTANT Microsoft Windows supports using CLM on cell-based HP Integrity servers. For best
performance in an nPartition running Windows, HP recommends that you configure the CLM
parameter to 100 percent for each cell in the nPartition.
To check CLM configuration details from an OS, use Partition Manager or the parstatuscommand. For
example, the parstatus -V -c#command and parstatus -V -p#command report the CLM amount
requested and CLM amount allocated for the specified cell (-c#, where #is the cell number) or the specified
nPartition (-p#, where #is the nPartition number). For details, refer to the HP System Partitions Guide or the
Partition Manager Web site (http://docs.hp.com/en/PARMGR2/).
To display CLM configuration details from the EFI Shell on a cell-based HP Integrity server, use the info
memcommand. If the amount of noninterleaved memory reported is less than 512 MB, then no CLM is
configured for any cells in the nPartition (and the indicated amount of noninterleaved memory is used by
system firmware). If the info memcommand reports more than 512 MB of noninterleaved memory, then use
Partition Manager or the parstatuscommand to confirm the CLM configuration details.
To set the CLM configuration, use Partition Manager or the parmodifycommand. For details, refer to the HP
System Partitions Guide or the Partition Manager Web site (http://docs.hp.com/en/PARMGR2/).
Ad d in g Micr osoft Win d ow s to th e Boot Op tion s List
To add a Microsoft Windows entry to the system boot options list, you must do so from EFI. Use the
\MSUtil\nvrboot.efiutility to import boot options from the EFI\Microsoft\WINNT50\Boot00...file on
the device from which Windows is loaded.
See “Boot Options List” on page 141 for additional information about saving, restoring, and creating boot
options.
NOTE
On HP Integrity servers, the OS installer automatically adds an entry to the boot options list.
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Adding a Microsoft Windows Boot Option
This procedure adds the Microsoft Windows item to the boot options list.
Step 1. Access the EFI Shell environment.
Log in to the management processor, and enter COto access the system console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
From the EFI Boot Manager menu, select the EFI Shell menu option to access the EFI Shell
environment.
Step 2. Access the EFI System Partition for the device from which you want to boot Microsoft Windows
(fsX:where Xis the file system number).
For example, enter fs2:to access the EFI System Partition for the bootable file system number 2.
The EFI Shell prompt changes to reflect the file system currently accessed.
The full path for the Microsoft Windows loader is \efi\microsoft\winnt50\ia64ldr.efi, and it
should be on the device you are accessing. (However, you must initiate this loader only from the EFI
Boot Menu and not from the EFI Shell.)
Step 3. List the contents of the \EFI\Microsoft\WINNT50directory to identify the name of the Windows
boot option file (Boot00nn) that you want to import into the system boot options list.
fs0:\> ls EFI\Microsoft\WINNT50
Directory of: fs0:\EFI\Microsoft\WINNT50
09/18/03 11:58a <DIR>
09/18/03 11:58a <DIR>
12/18/03 08:16a
1 File(s)
1,024 .
1,024 ..
354 Boot0001
354 bytes
2 Dir(s)
fs0:\>
Step 4. At the EFI Shell environment, issue the \MSUtil\nvrboot.eficommand to launch the Microsoft
Windows boot options utility.
fs0:\> msutil\nvrboot
NVRBOOT: OS Boot Options Maintenance Tool [Version 5.2.3683]
1. SUSE SLES 9
2. HP-UX Primary Boot: 0/0/1/0/0.2.0
* 3. Windows Server 2003, Datacenter
4. EFI Shell [Built-in]
* = Windows OS boot option
(D)isplay (M)odify (C)opy E(x)port (I)mport (E)rase (P)ush (H)elp (Q)uit
Select>
Step 5. Use the Importcommand to import the Windows boot options file.
Select> i
Enter IMPORT file path: \EFI\Microsoft\WINNT50\Boot0001
Imported Boot Options from file: \EFI\Microsoft\WINNT50\Boot0001
Press enter to continue
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Step 6. Press Q to quit the NVRBOOT utility, and exit the console and management processor interfaces if
you are finished using them.
To exit the EFI environment press ^B (Control+B); this exits the system console and returns to the
management processor Main Menu. To exit the management processor, enter Xat the Main Menu.
Bootin g Micr osoft Win d ow s
You can boot the Windows Server 2003 OS on an HP Integrity server by using the EFI Boot Manager to
choose the appropriate Windows item from the boot options list.
CAUTION
ACPI Configuration for Windows Must Be windows
On cell-based HP Integrity servers, to boot the Windows OS, an nPartition ACPI configuration
value must be set to windows.
At the EFI Shell, enter the acpiconfigcommand with no arguments to list the current ACPI
configuration. If the acpiconfigvalue is not set to windows, then Windows cannot boot. In this
situation, you must reconfigure acpiconfig; otherwise, booting will be interrupted with a
panic when Windows is launched.
To set the ACPI configuration for Windows: At the EFI Shell enter the acpiconfig windows
command, and then enter the resetcommand for the nPartition to reboot with the proper
(windows) configuration for Windows.
NOTE
Microsoft Windows Booting on HP Integrity Servers
The recommended method for booting Windows is to use the EFI Boot Manager menu to choose
a Windows entry from the boot options list. Using the ia64ldr.efiWindows loader from the
EFI Shell is not recommended.
Windows Booting
From the EFI Boot Manager menu, select an item from the boot options list to boot Windows using
that boot option. The EFI Boot Manager is available only on HP Integrity servers.
configuration details.
Step 1. Access the EFI Boot Manager menu for the system on which you want to boot Windows.
Log in to the management processor, and enter COto access the Console list. Select the nPartition
console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
Step 2. At the EFI Boot Manager menu, select an item from the boot options list.
Each item in the boot options list references a specific boot device and provides a specific set of boot
options or arguments to be used when booting the device.
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Step 3. Press Enter to initiate booting using the chosen boot option.
Step 4. When Windows begins loading, wait for the Special Administration Console (SAC) to become
available.
The SAC interface provides a text-based administration tool that is available from the nPartition
console. For details, refer to the SAC online help (type ?at the SAC>prompt).
Loading.: Windows Server 2003, Datacenter
Starting: Windows Server 2003, Datacenter
Starting Windows...
********************************************************************************
Computer is booting, SAC started and initialized.
Use the "ch -?" command for information about using channels.
Use the "?" command for general help.
SAC>
Step 5. Exit the console and management processor interfaces if you are finished using them.
To exit the console environment, press ^B (Control+B); this exits the console and returns to the
management processor Main menu. To exit the management processor, enter Xat the Main menu.
Sh u ttin g Dow n Micr osoft Win d ow s
You can shut down the Windows OS on HP Integrity servers using the Start menu or the shutdowncommand.
CAUTION
Do not shut down Windows using Special Administration Console (SAC) restartor shutdown
commands under normal circumstances.
Issuing restartor shutdownat the SAC>prompt causes the system to restart or shut down
immediately and can result in the loss of data.
Instead, use the Windows Start menu or the shutdowncommand to shut down without loss of
data.
To shut down Windows use either of the following methods.
•
Select Shut Down from the Start menu, and select either Restart or Shut down from the drop-down menu.
Selecting the Restart menu item shuts down and restarts the system. Selecting the Shut down menu item
shuts down the system.
You can use this method when using the Windows graphical interface.
Issue the shutdowncommand from the Windows command line.
•
You can issue this command from a command prompt through the Special Administration Console (SAC)
or from any other command line.
The Windows shutdowncommand includes the following options:
/s
/r
Shut down the system. This is the equivalent of Start—>Shut Down, Shut down.
Shut down and restart the system. This is the equivalent of Start—>Shut Down, Restart.
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/a
Abort a system shutdown.
/t xxx
Set the timeout period before shutdown to xxxseconds. The timeout period can range
from 0–600, with a default of 30.
Refer to the help shutdownWindows command for details.
NOTE
On HP Integrity Superdome servers, the Windows shutdown /scommand shuts down the
system and keeps all cells at the boot-is-blocked (BIB) inactive state.
Windows Shutdown from the Command Line
From the Windows command line, issue the shutdowncommand to shut down the OS.
Step 1. Log in to Windows running on the system that you want to shut down.
For example, access the system console and use the Windows SAC interface to start a command
prompt, from which you can issue Windows commands to shut down the the system.
Step 2. Check whether any users are logged in.
Use the query useror query sessioncommand.
Step 3. Issue the shutdowncommand and the appropriate options to shut down the Windows Server 2003
on the system.
You have the following options when shutting down Windows:
•
•
•
To shut down Windows and reboot:
shutdown /r
Alternatively, you can select the Start —> Shut Down action and select Restart from the
drop-down menu.
To shut down Windows and not reboot:
shutdown /s
Alternatively, you can select the Start —> Shut Down action and select Shut down from the
drop-down menu.
To abort a shutdown (stop a shutdown that has been initiated): shutdown /a
For example:
shutdown /r /t 60 /c "Shut down in one minute."
This command initiates a Windows system shutdown-and-reboot after a timeout period of 60
seconds. The /coption specifies a message that is broadcast to any other users of the system.
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Booting and Shutting Down Linux
Boot in g a n d Sh u t t in g Dow n Lin u x
This section presents procedures for booting and shutting down the Linux OS on cell-based HP Integrity
servers and a procedure for adding Linux to the boot options list.
•
To determine whether the cell local memory (CLM) configuration is appropriate for Red Hat Enterprise
•
To add a Linux entry to the nPartition boot options list, refer to “Adding Linux to the Boot Options List”
•
•
•
Lin u x Su p p or t for Cell Loca l Mem or y
On servers based on the HP sx2000 chipset, each cell has a cell local memory (CLM) parameter, which
determines how firmware interleaves memory residing on the cell.
IMPORTANT Red Hat Enterprise Linux does not support using CLM. Before booting Red Hat Enterprise
Linux on an nPartition, you must ensure that the CLM parameter for each cell in the
nPartition is set to zero (0). Although you might be able to boot Red Hat Enterprise Linux on an
nPartition with CLM configured, any memory configured as cell local is unusable, and such a
configuration is untested and unsupported.
SuSE Linux Enterprise Server supports using CLM. The optimal CLM settings for SuSE Linux
Enterprise Server depend on the applications and workload the OS is running.
To check CLM configuration details from an OS, use Partition Manager or the parstatuscommand. For
example, the parstatus -V -c#command and parstatus -V -p#command report the CLM amount
requested and CLM amount allocated for the specified cell (-c#, where #is the cell number) or the specified
nPartition (-p#, where #is the nPartition number). For details, refer to the HP System Partitions Guide or the
Partition Manager Web site (http://docs.hp.com/en/PARMGR2/).
To display CLM configuration details from the EFI Shell on a cell-based HP Integrity server, use the info
memcommand. If the amount of noninterleaved memory reported is less than 512 MB, then no CLM is
configured for any cells in the nPartition (and the indicated amount of noninterleaved memory is used by
system firmware). If the info memcommand reports more than 512 MB of noninterleaved memory, then use
Partition Manager or the parstatuscommand to confirm the CLM configuration details.
To set the CLM configuration, use Partition Manager or the parmodifycommand. For details, refer to the HP
System Partitions Guide or the Partition Manager Web site (http://docs.hp.com/en/PARMGR2/).
Ad d in g Lin u x to th e Boot Op tion s List
This section describes how to add a Linux entry to the system boot options list. The processes for adding both
Red Hat Enterprise Linux and SuSE Linux Enterprise Servers are given here.
You can add the \EFI\redhat\elilo.efiloader or the \efi\SuSE\elilo.efiloader to the boot options list
from the EFI Shell or EFI Boot Configuration menu (or in some versions of EFI, the Boot Option Maintenance
Menu).
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See “Boot Options List” on page 141 for additional information about saving, restoring, and creating boot
options.
NOTE
On HP Integrity servers, the OS installer automatically adds an entry to the boot options list.
Adding a Linux Boot Option
This procedure adds a Linux item to the boot options list.
Step 1. Access the EFI Shell environment.
Log in to the management processor, and enter COto access the system console.
When accessing the console, confirm that you are at the EFI Boot Manager menu (the main EFI
menu). If you are at another EFI menu, select the Exit option from the submenus until you return
to the screen with the EFI Boot Managerheading.
From the EFI Boot Manager menu, select the EFI Shell menu option to access the EFI Shell
environment.
Step 2. Access the EFI System Partition for the device from which you want to boot Linux (fsX:, where Xis
the file system number).
For example, enter fs2:to access the EFI System Partition for the bootable file system number 2.
The EFI Shell prompt changes to reflect the file system currently accessed.
The full path for the Red Hat Enterprise Linux loader is \EFI\redhat\elilo.efi, and it should be
on the device you are accessing.
The full path for the SuSE Linux Enterprise Server loader is \efi\SuSE\elilo.efi, and it should
be on the device you are accessing.
Step 3. At the EFI Shell environment, use the bcfgcommand to manage the boot options list.
The bcfgcommand includes the following options for managing the boot options list:
• bcfg boot dump— Display all items in the boot options list for the system.
bcfg boot rm #— Remove the item number specified by #from the boot options list.
bcfg boot mv #a #b— Move the item number specified by #ato the position specified by #bin the boot
options list.
bcfg boot add # file.efi "Description"— Add a new boot option to the position in the boot options list
specified by #. The new boot option references file.efiand is listed with the title specified by Description.
For example, bcfg boot add 1 \EFI\redhat\elilo.efi "Red Hat Enterprise Linux"
adds a Red Hat Enterprise Linux item as the first entry in the boot options list.
Likewise, bcfg boot add 1 \efi\SuSE\elilo.efi "SLES 9" adds a SuSE Linux item as the
first entry in the boot options list.
Refer to the help bcfgcommand for details.
Step 4. Exit the console and management processor interfaces if you are finished using them.
To exit the EFI environment press ^B (Control+B); this exits the system console and returns to the
management processor Main Menu. To exit the management processor, enter Xat the Main Menu.
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Booting and Shutting Down Linux
Bootin g Red Ha t En t er p r ise Lin u x
You can boot the Red Hat Enterprise Linux OS on HP Integrity servers using either of the methods described
in this section.
Refer to “Shutting Down Linux” on page 167 for details on shutting down the Red Hat Enterprise Linux OS.
CAUTION
ACPI Configuration for Red Hat Enterprise Linux Must Be default
On cell-based HP Integrity servers, to boot the Red Hat Enterprise Linux OS, an nPartition
ACPI configuration must be value set to default.
At the EFI Shell, enter the acpiconfigcommand with no arguments to list the current ACPI
configuration. If the acpiconfigvalue is not set to default, then Red Hat Enterprise Linux
could panic. In this situation, you must reconfigure acpiconfigto eliminate any bus address
conflicts and ensure all I/O slots have unique addresses.
To set the ACPI configuration for Red Hat Enterprise Linux:
•
•
At the EFI Shell enter the acpiconfig defaultcommand.
Enter the resetcommand for the nPartition to reboot with the proper (default)
configuration for Red Hat Enterprise Linux.
Use either of the following methods to boot Red Hat Enterprise Linux:
•
Choose a Red Hat Enterprise Linux entry from the EFI Boot Manager menu.
To load the Red Hat Enterprise Linux OS at the EFI Boot Manager menu, choose its entry from the list of
boot options.
Choosing a Linux entry from the boot options list boots the OS using ELILO.EFIloader and the
elilo.conffile.
•
Initiate the ELILO.EFILinux loader from the EFI Shell.
After choosing the file system for the boot device (for example, fs0:), you can initiate the Linux loader
from the EFI Shell prompt by entering the full path for the ELILO.EFIloader.
On a Red Hat Enterprise Linux boot device EFI System Partition, the full paths to the loader and
configuration files are:
\EFI\redhat\elilo.efi
\EFI\redhat\elilo.conf
By default the ELILO.EFIloader boots Linux using the kernel image and parameters specified by the default
entry in the elilo.conffile on the EFI System Partition for the boot device.
To interact with the ELILO.EFIloader, interrupt the boot process (for example, type a space) at the ELILO
bootprompt. To exit the ELILO.EFIloader, use the exitcommand.
Booting Red Hat Enterprise Linux (EFI Shell)
Use this procedure to boot Red Hat Enterprise Linux from the EFI Shell.
required configuration details.
Step 1. Access the EFI Shell.
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From the system console, select the EFI Shell entry from the EFI Boot Manager menu to access the
shell.
Step 2. Access the EFI System Partition for the Red Hat Enterprise Linux boot device.
Use the mapEFI Shell command to list the file systems (fs0, fs1, and so on) that are known and
have been mapped.
To select a file system to use, enter its mapped name followed by a colon (:). For example, to operate
with the boot device that is mapped as fs3, enter fs3:at the EFI Shell prompt.
Step 3. Enter ELILOat the EFI Shell command prompt to launch the ELILO.EFIloader.
If needed, you can specify the loader’s full path by entering \EFI\redhat\eliloat the EFI Shell
command prompt.
Step 4. Allow the ELILO.EFIloader to proceed with booting the Red Hat Enterprise Linux kernel.
By default, the ELILO.EFIloader boots the kernel image and options specified by the default item
in the elilo.conffile.
To interact with the ELILO.EFIloader, interrupt the boot process (for example, type a space) at the
ELILO bootprompt. To exit the loader, use the exitcommand.
Bootin g Su SE Lin u x En ter p r ise Ser ver
You can boot the SuSE Linux Enterprise Server 9 OS on HP Integrity servers using either of the methods
described in this section.
Refer to “Shutting Down Linux” on page 167 for details on shutting down the SuSE Linux Enterprise Server
OS.
CAUTION
ACPI Configuration for SuSE Linux Enterprise Server Must Be default
On cell-based HP Integrity servers, to boot the SuSE Linux Enterprise Server OS, an
nPartition ACPI configuration value must be set to default.
At the EFI Shell, enter the acpiconfigcommand with no arguments to list the current ACPI
configuration. If the acpiconfigvalue is not set to default, then SuSE Linux Enterprise
Server could panic.
To set the ACPI configuration for SuSE Linux Enterprise Server:
•
•
At the EFI Shell enter the acpiconfig defaultcommand.
Enter the resetcommand for the nPartition to reboot with the proper (default)
configuration for SuSE Linux Enterprise Server.
Use either of the following methods to boot SuSE Linux Enterprise Server:
•
Choose a SuSE Linux Enterprise Server entry from the EFI Boot Manager menu.
To load the SuSE Linux Enterprise Server OS at the EFI Boot Manager menu, choose its entry from the
list of boot options.
Choosing a Linux entry from the boot options list boots the OS using ELILO.EFIloader and the
elilo.conffile.
•
Initiate the ELILO.EFILinux loader from the EFI Shell.
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After choosing the file system for the boot device (for example, fs0:), you can initiate the Linux loader
from the EFI Shell prompt by entering the full path for the ELILO.EFIloader.
On a SuSE Linux Enterprise Server boot device EFI System Partition, the full paths to the loader and
configuration files are:
\efi\SuSE\elilo.efi
\efi\SuSE\elilo.conf
By default the ELILO.EFIloader boots Linux using the kernel image and parameters specified by the default
entry in the elilo.conffile on the EFI System Partition for the boot device.
To interact with the ELILO.EFIloader, interrupt the boot process (for example, type a space) at the ELILO
bootprompt. To exit the ELILO.EFIloader, use the exitcommand.
Booting SuSE Linux Enterprise Server (EFI Shell)
Use this procedure to boot SuSE Linux Enterprise Server 9 from the EFI Shell.
required configuration details.
Step 1. Access the EFI Shell.
From the system console, select the EFI Shell entry from the EFI Boot Manager menu to access the
shell.
Step 2. Access the EFI System Partition for the SuSE Linux Enterprise Server boot device.
Use the mapEFI Shell command to list the file systems (fs0, fs1, and so on) that are known and
have been mapped.
To select a file system to use, enter its mapped name followed by a colon (:). For example, to operate
with the boot device that is mapped as fs3, enter fs3:at the EFI Shell prompt.
Step 3. Enter ELILOat the EFI Shell command prompt to launch the ELILO.EFIloader.
If needed, you can specify the loader’s full path by entering \efi\SuSE\eliloat the EFI Shell
command prompt.
Step 4. Allow the ELILO.EFIloader to proceed with booting the SuSE Linux kernel.
By default, the ELILO.EFIloader boots the kernel image and options specified by the default item
in the elilo.conffile.
To interact with the ELILO.EFIloader, interrupt the boot process (for example, type a space) at the
ELILO bootprompt. To exit the loader, use the exitcommand.
Sh u ttin g Dow n Lin u x
Use the shutdowncommand to shut down Red Hat Enterprise Linux or SuSE Linux Enterprise Server.
The Red Hat Enterprise Linux and SuSE Linux Enterprise Server shutdowncommand includes the following
options:
-h
Halt after shutdown.
On cell-based HP Integrity servers, this either powers down server hardware or puts the
nPartition into a shutdown for reconfiguration state.
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Use the PEcommand at the management processor Command Menu to manually power on
or power off server hardware, as needed.
-r
Reboot after shutdown.
-c
Cancel an already running shutdown.
time
When to shut down (required). You can specify the timeoption in any of the following ways:
•
Absolute time in the format hh:mm, in which hhis the hour (one or two digits) and mm
is the minute of the hour (two digits).
•
Number of minutes to wait in the format +m, in which mis the number of minutes.
• nowto immediately shut down; this is equivalent to using +0to wait zero minutes.
Refer to the shutdown(8) Linux manpage for details. Also refer to the Linux manpage for the poweroff
command.
Shutting Down Linux
From the command line for Red Hat Enterprise Linux or SuSE Linux Enterprise Server, issue the
shutdowncommand to shut down the OS.
Step 1. Log in to Linux running on the system you want to shut down.
Log in to the management processor (MP) for the server and use the Console menu to access the
system console. Accessing the console through the MP enables you to maintain console access to the
system after Linux has shut down.
Step 2. Issue the shutdowncommand with the desired command-line options, and include the required
timeargument to specify when the operating shutdown is to occur.
For example, shutdown -r +20will shut down and reboot the system starting in 20 minutes.
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sx2000 LEDs
Ta b le A-1
LED
F r on t P a n e l LE Ds
Dr iven By
Sta t e
Mea n in g
48V Good
HKP Good
PM
PM
PM
On (green)
On (green)
On (green)
48V is good
Housekeeping is good.
MP
MP is installed in this cabinet
Present
Cabinet#
PM
Numeric
Dash
Cabinet number
Invalid cabinet ID
Locate feature activated
Flashing
Housekeeping
48V Good
Present
Secure
Attention
Attention
MP
Flashing Red
Chassis log alert
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sx2000 LEDs
Ta b le A-2
P ow er a n d OL* LE Ds
Dr iven
LED
Loca t ion
St a t e
Mea n in g
By
Cell Power
Chassis beside cell,
and on cell
Cell LPM
On Green HKP, PWR_GOOD
Cell
Chassis beside cell
CLU
On
Cell OL*
Attention
Yellow
PDHC Post
PM Post
Cell
PDHC
0x0
PDHC Post or run state
oxf
0xe->0x1
On the UGUYboard, MOP
driven by the PM
0x0
No HKP
0xf
MOP is reset or dead
PM Post or run state
0xe->0x1
CLU Post
On the UGUY
board, driven by the
CLU
SARG
CLU
0x0
No HKP
0xf
CLU is reset or dead
CLU Post or run state
0xe->0x1
PCI
Cardcage
Attention
Chassis behind PCI
cardcage
On
Yellow
PCI cardcage OL* LED,
Link Cable
OL*
Main Backplane
SBCH
CLU
On
Yellow
Link cable OL*
MP Post
SBCH
0x0
No HKP
0xf
MP is reset or dead
MP Post or run state
0xe->0x1
Cabinet and
IO Bay Fans
Each fan
PM
On Green Fan running - no fault
Backplane
Power
Boards
System Backplane
RPM
On Green Power Supply running
Yellow
Power fault
Blinking
171
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sx2000 LEDs
Ta b le A-2
LED
P ow er a n d OL* LE Ds (Con tin u ed )
Dr iven
Loca t ion
St a t e
Mea n in g
By
Hot swap
oscillators
(HSO)
System Backplane
RPM
On Green HSO Supply running
On
HSO clock fault
Yellow
F igu r e A-1
Utilit ies LE Ds
Ta b le A-3
OL* LE D Sta t es
Descr ip t ion
Normal operation (powered) On
P ow er (Gr een )
OL* (Yellow )
Off
Fault detected, power on
On
On
Flashing
On
Slot selected, power on, not
ready for OLA/D
Power off or slot available
Fault detected, power off
Read for OL*
Off
Off
Off
Off
Flashing
On
172
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sx2000 LEDs
F igu r e A-2
P DH St a tu s
PDH STATUS
LSB
MSB
Power
Good
BIB SM US
HB
A label will be placed on the outside of the SDCPB Frame to indicated PDH Status, DC/DC Converter faults
that shutdown the sx2000 cell, and loss of DC/DC Converter Redundancy. Figure A-2 illustrates the label and
table A-4 describes each LED. Note: The Power Good LED is a Bi-Color LED (Green/Yellow).
Ta b le A-4
P DH St a tu s a n d P ow e r Good LE D Sta t es
Descr ip t ion
LED
Defin it ion
BIB
Boot Is Blocked
When illuminated, it tells the end user that
the system is ready to boot.
SMG
Shared Memory Good
This references non-volatile memory that
manageability and system firmware share.
When illuminated, it tells the end user that
the system is ready to begin fetching code.
USB
HB
Universal Serial Bus
Heart Beat
When illuminated, tells the end user that
PDHC is communicating with the MP.
When blinking, the PDHC processor is
executing. And the cell board can be power
enabled.
Power Good
Power Good
Solid green - All power is operating withing
specifications.
Blinking yellow - Voltage rail(s) have been
lost and the cell board has shutdown.
Solid green but blinking yellow - Cell board
still operating, but one of the redudant
converters has failed on one of the voltage
rails
173
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sx2000 LEDs
174
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B Ma n a gem en t P r ocessor Com m a n d s
This Appendix summarizes the Management Processor commands. Notice that in the examples herein, MP is
used as the command prompt. The term Guardian Service Processor has been changed to Management
Processor, but some code already written uses the old term.
175
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Management Processor Commands
MP Command: BO
MP Com m a n d : BO
BO - Boot partition
•
•
Access level—Single PD user
Scope—partition
This command boots the specified partition. It ensures that all the cells assigned to the target partition have
valid complex profiles and then releases Boot-Is-Blocked (BIB).
Exa m p le B-1
BO com m a n d
176
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Management Processor Commands
MP Command: CA
MP Com m a n d : CA
CA - Configure Asynchronous & Modem Parameters
•
•
Access level—Operator
Scope—Complex
This command allows the operator to configure the local and remote console ports. The parameters that can
be configured are the baud rate, flow control, and modem type.
Exa m p le B-2
CA Com m a n d
177
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Management Processor Commands
MP Command: CC
MP Com m a n d : CC
CC - Complex Configuration
•
•
Access level—Administrator
Scope—Complex
This command performs an initial out of the box complex configuration. The system can be configured as
either a single (user specified) cell in partition 0 (the genesis complex profile) or the last profile can be
restored. The state of the complex prior to command execution has no bearing on the changes to the
configuration. The user is responsible for ensuring that all other partitions are shut down before using this
command. The use of the ID command could be required following the creation of the genesis complex profile.
If the genesis profile is selected, then all remaining cells will be assigned to the free cell list.
NOTE
This command does not boot any partitions. The user must boot the desired partition(s) using
the BO command.
NOTE
The best choice of cell to use in the genesis complex profile is one that has a bootable device
attached.
Exa m p le B-3
CC Com m a n d
178
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Management Processor Commands
MP Command: CP
MP Com m a n d : CP
CP - Cells Assigned by Partition
•
•
Access Level - Single Partition User
Scope - Complex
The cpcommand displays a table of cells assigned to partitions and arranged by cabinets.
This is for display only, no configuration is possible with this command.
Exa m p le B-4
CP Com m a n d
179
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Management Processor Commands
MP Command: DATE
MP Com m a n d : DATE
DATE Command - Set Date and Time.
•
•
Access level—Administrator
Scope—Complex
This command changes the value of the real time clock chip on the MP.
Exa m p le B-5
DATE
180
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Management Processor Commands
MP Command: DC
MP Com m a n d : DC
DC - Default Configuration
•
•
Access level—Administratrix
Scope—Complex
This command resets some or all of the configuration parameters to their default values.
The clock setting is not effected by the DC command.
The example below shows the various parameters and their defaults.
Exa m p le B-6
DC Com m a n d
181
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Management Processor Commands
MP Command: DF
MP Com m a n d : DF
DF - Display FRUID
•
•
Access level—Single Partition User
Scope—Complex
This command displays the FRUID data of the specified FRU. FRU information for the SBC, BPS, and
processors are “constructed,” because they do not have a FRU ID EEPROM. Because of this fact, the list of
FRUs is different than the list presented in the WF command.
Exa m p le B-7
DF Com m a n d
182
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Management Processor Commands
MP Command: DI
MP Com m a n d : DI
DI - Disconnect Remote or LAN Console
•
•
Access level—Operator
Scope—Complex
This command initiates separate remote console or LAN console disconnect sequences. For the remote
console, the modem control lines are de-asserted, forcing the modem to hang up the telephone line. For the
LAN console, the telnet connection is closed.
If the console being disconnected has an access mode of single connection (see ER command), then it is
disabled, otherwise it remains enabled after the connection has been dropped.
The number after the LAN console status is the number of LAN connections.
Exa m p le B-8
DI Com m a n d
183
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Management Processor Commands
MP Command: DL
MP Com m a n d : DL
DL - Disable LAN Access
•
•
Access level—Administrator
Scope—Complex
This command disables Telnet LAN access. Disabling Telnet access kills all of the current Telnet connections
and causes future telnet connection requests to be given a connection refused message.
Exa m p le B-9
DL Com m a n d
Example:
In this example, the administrator is connected via telnet to the MP. When DL executes, his/her telnet
connection to the MP is closed.
MP:CM> dl
Disable telnet access and close open telnet connections? (Y/[N]) y
WARNING: Answering yes will close this connection.
Are you sure? (Y/[N]) y
-> Telnet access disabled. All non-diagnostic connections closed.
Connection closed by foreign host.
• See also: DI, EL
Note that this command is deprecated. It does not appear in the help menu.
Use the SA and DI commands to control both telnet and SSH connections.
184
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Management Processor Commands
MP Command: EL
MP Com m a n d : EL
DL - Enable LAN Access
•
•
Access level—Administrator
Scope—Complex
This command enables Telnet LAN access.
Exa m p le B-10
EL Com m a n d
MP:CM> el
Enable telnet access? (Y/[N]) y
-> Telnet access enabled.
MP:CM>
• See also: DI, DL
Note that this command is deprecated and does not support SSH. Use the SA command instead.
185
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Management Processor Commands
MP Command: HE
MP Com m a n d : HE
HE - Help Menu
•
•
Scope—N/A
Access level—Single PD user
This command displays a list of all MP commands available to the level of the MP access (Administrator,
Operator, or Single PD user). The commands that are available in manufacturing mode will be displayed if
the MP is in manufacturing mode.
In the following example, the MP is in manufacturing mode and as a result, the manufacturing commands
are shown in the last screen. This example is from a pre-release version of MP firmware.
186
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Management Processor Commands
MP Command: HE
Exa m p le B-11
H E Com m a n d
187
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Management Processor Commands
MP Command: ID
MP Com m a n d : ID
ID - Configure Complex Identification
•
•
Access level—Operator
Scope—Complex
This command configures the complex identification information. The complex identification information
includes the following:
•
•
•
•
•
•
•
model number
model string
complex serial number
complex system name
original product number
current product number
enterprise ID and diagnostic license
This command is similar to the SSCONFIG command in ODE.
The command is protected by an authentication mechanism. The MP generates a lock word, and the user
must supply an authentication key which is dependent on the lock word. A fixed timeout of one minute
protects against this command being entered inadvertently. This command has no effect if the timeout pops or
the wrong authentication key is entered.
This command is inoperable until the MP has determined the golden complex profile.
When the machine is powered on for the first time, the CC command must be issued before the ID command
can be used.
Exa m p le B-12
ID Com m a n d
188
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Management Processor Commands
MP Command: IO
MP Com m a n d : IO
IO - Display Connectivity Between Cells and I/O
•
•
Access level—Sinfle Partition User
Scope—Complex
This command displays a mapping of the connectivity between cells and I/O.
• Example:
MP:CM> io
--------------------------+
Cabinet | 0 | 1 |
--------+--------+--------+
Slot | 01234567| 01234567|
--------+--------+--------+
Cell | XXXX....| ........|
IO Cab | 0000....| ........|
IO Bay | 0101....| ........|
IO Chas | 1133....| ........|
MP:CM>
• See also: PS
189
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Management Processor Commands
MP Command: IT
MP Com m a n d : IT
IT - View / Configure Inactivity Timeout Parameters
•
•
Access level—Operator
Scope—Complex
This command sets the two inactivity time-outs.
The session inactivity timeout prevents a session to a partition to be inadvertently left opened, preventing
other users to log onto a partition using this path. If the system session is hung or if the partition OS is hung,
the IT command also prevents a session from being locked indefinitely i
The second timeout is a MP-Handler command timeout. This prevents a user from not completing a command
and preventing other users from using the MP-Handler.
Neither timeout can be deactivated.
Exa m p le B-13
IT Com m a n d
190
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Management Processor Commands
MP Command: LC
MP Com m a n d : LC
LC - LAN Configuration
•
•
Access level—Administrator
Scope—Complex
This command displays and modifies the LAN configurations. The IP address, Hostname, Subnet mask, and
Gateway address can be modified with this command.
Exa m p le B-14
LC Com m a n d
191
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Management Processor Commands
MP Command: LS
MP Com m a n d : LS
LS - LAN Status
•
•
Access level—Single Partition User
Scope—Complex
This command displays all parameters and current connection status of the LAN interface.
Exa m p le B-15
LS Com m a n d
192
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Management Processor Commands
MP Command: MA
MP Com m a n d : MA
MA - Main Menu
•
•
Access level—Single Partition User
Scope—N/A
The command takes the specific user from the Command menu and returns the user to the main menu. Only
the user that enters the command is returned to his private main menu.
Exa m p le B-16
MP Ma in Men u
193
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Management Processor Commands
MP Command: ND
MP Com m a n d : ND
ND - Network Diagnostics
•
•
Access level—Administrator
Scope—Complex
This command enables/disables network diagnostics. This will enable or disable the Ethernet access to MP
Ethernet ports other than the main telnet port (TCP port 23). Disabling the network diagnostic port prevents
the user from accessing the system with diagnostic tools such as J UST, GDB, LDB and firmware update
(FWUU).
Exa m p le B-17
ND Com m a n d
• Sample 1:
MP:CM> nd
Network diagnostics are currently enabled.
Do you want to disable network diagnostics? (Y/[N]) y
-> Network diagnostics are disabled.
MP:CM>
• Sample 2:
MP:CM> nd
Network diagnostics are currently disabled.
Do you want to enable network diagnostics? (Y/[N]) y
-> Network diagnostics are enabled.
MP:CM>
• See also: DC
194
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Management Processor Commands
MP Command: PD
MP Com m a n d : P D
PD - Set Default Partition
•
•
Access level—Operator
Scope—Complex
This command sets the default partition. If a default partition already exists, then this command overrides
the previously defined partition. Setting the default partition prevents the user from being forced to enter a
partition in commands that require a partition for their operation. For example, this prevents a user from
accidentally TOCing the wrong partition.
A default partition is automatically set for users who are assigned the Single Partition User access level when
they login into the MP handler. A user assigned the Single Partition User access level can not change the
default partition.
When users of the Administrator or Operator levels log in, their default partition will be set to an invalid
partition. The default partition for users of these access levels is maintained independently for each
connection. When the user logs out of the MP handler, the default partition setting is not stored in
non-volatile storage.
Exa m p le B-18
P D Com m a n d
See also: RE, SO
195
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Management Processor Commands
MP Command: PE
MP Com m a n d : P E
PE - Power Entity
•
•
Access level—Operator
Scope—Complex
This command turns power on/off to the specified entity. If there is a default partition defined then the
targeted entity must be a member of that partition. In the case when the entity being powered is an entire
cabinet this command has some interesting interactions with the physical cabinet power switch. If the cabinet
power switch is in the off position then this command will not override the switch. That is, this command will
not turn on cabinet power if the switch is in the off position. If this command is used to power off a cabinet
and then the power switch is toggled from on to off then back to on, the cabinet will be turned on. Note that
powering on/off a cell also powers on/off any attached I/O backplane. Also powering on a cell powers on the I/O
backplane attached to that cell first. The System Backplane (HLSB) cannot be selected as an entity, and can
only be controlled via the cabinet entity.
Powering off a partition that has been released from BIB could result in extraneous error events being stored
in the event logs.
Exa m p le B-19
P E Com m a n d
• Sample 1: PE for a compute cabinet.
[spudome] MP:CM> pe
This command controls power enable to a hardware device.
B - Cabinet
C - Cell
I - IO Chassis
P - Partition
Select Device: b
Enter cabinet number: 0
WARNING: Cabinet 0 is connected to cabinet 1. Cabinets 0 and 1 must be powered off and on such that both
cabinets are off for an overlapping interval.
If one cabinet is powered off then on while the other cabinet remains on, communications between the two
cabinets will be lost.
The power state is ON for cabinet 0.
In what state do you want the power? (ON/OFF) off
[spudome] MP:CM>
• Sample 2: PE for a partition.
[spudome] MP:CM> pe
This command controls power enable to a hardware device.
B - Cabinet
C - Cell
196
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Management Processor Commands
MP Command: PE
I - IO Chassis
P - Partition
Select Device: p
# Name
--- ----
0) Partition 0
1) Partition 1
2) Partition 2
3) Partition 3
Select a partition number: 0
The power state is OFF for partition 0.
In what state do you want the power? (ON/OFF) on
[spudome] MP:CM>
• See also: PS
197
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Management Processor Commands
MP Command: PS
MP Com m a n d : P S
PS - Power and Configuration Status
•
•
Access level—Single Partition User
Scope—Cabinet
This command displays the status of the specified hardware. This command adds new information from
previous versions of the PS command in other systems.
The user can retrieve a summary or more detailed information on one of the following: a cabinet, a cell, a core
IO, and the MP.
198
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Management Processor Commands
MP Command: PS
Exa m p le B-20
P S Com m a n d
199
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Management Processor Commands
MP Command: RE
MP Com m a n d : RE
RE - Reset Entity
•
•
Access level—Operator
Scope—Complex
This command resets the specified entity. Care should be exercised when resetting entities because of the side
effects. Resetting an entity has the following side effects.
– Main backplane - The CLU asserts the backplane_reset signal on the backplane which results in the
following being reset:
* All XBCs, RCs, cells plugged into backplane, Dillons, CCs, all CPUs except PDHC, any attached RIOs, all
I/O adapters installed in the I/O backplanes associated with the above RIOs.
– Cell - The SINC asserts the mpon signal to Dillon which results in the following being reset:
* Dillon, CC, all CPUs except SINC, any attached RIO, all I/O adapters installed in the I/O backplane
associated with the above RIO
– I/O backplane - The CLU asserts the iobackplane_reset signal to the appropriate I/O backplane which
results in the following being reset:
* RIO and all I/O adapters installed in the I/O backplane
• Example:
MP:CM> re
This command resets a hardware device.
C - Cell
I - IO Chassis
M - Main Backplane
Select device: m
Enter cabinet number: 0
Do you want to reset the Main Backplane in Cabinet 0? (Y/[N]) y
-> The selected device(s) will be reset.
MP:CM>
• See also: PE
200
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Management Processor Commands
MP Command: RL
MP Com m a n d : RL
RL - Re-key Complex Profile Lock
•
•
Access level—Operator
Scope—Complex
This command re-keys the complex profile lock. It should only be used to recover from the error caused by the
holder of the lock terminating before releasing the complex profile lock. It invalidates any outstanding key to
the complex profile lock. There are up to 66 complex profile locks: one for each partition in section C of plus
one key each for the A and B sections of the Complex Profile. The Default Partition is the default when
prompting the user for which lock to re-key.
Exa m p le B-21
R e-k ey lock for p a r tition 3
201
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Management Processor Commands
MP Command: RR
MP Com m a n d : RR
RR - Reset Partition for Re-configuration
•
•
Access level—Single Partition User
Scope—Partition
This command resets the specified partition but does not automatically boot it. The utility system resets each
cell that is a member of the specified partition.If the user is either Administrator or Operator, a choice of
which partition will be offered.
Exa m p le B-22
R R Com m a n d
202
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Management Processor Commands
MP Command: RS
MP Com m a n d : RS
RS - Reset Partition
•
•
Access level—Single PD user
Scope—Partition
This command resets and boots the specified partition. The utility system resets each cell that is a member of
the specified partition. Once all cells have completed reset, the partition is booted. If the user is either
Administrator or Operator, a choice of which partition is offered.
Exa m p le B-23
R S Com m a n d
203
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Management Processor Commands
MP Command: SA
MP Com m a n d : SA
SA - Set Access Parameters
•
•
Access level—Administrator
Scope—Complex
This command modifies the enablement of interfaces including telnet, SSH, modem, network diagnostics,
IPMI LAN, web console, etc.
• Example:
[spudome] MP:CM> sa
This command displays and allows modification of access parameters.
T - Telnet access : Enabled
H - Secure Shell access : Enabled
N - Network Diagnostics : Enabled
D - DIAG Menu : Enabled
I - IPMI Lan access : Enabled
Select access mode to change :
• See also: EL, DL, DI, ND, PARPERM
204
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Management Processor Commands
MP Command: SO
MP Com m a n d : SO
SO - Security Options and Access Control Configuration
•
•
Access level—Administrator
Scope—Complex
This command modifies the security options and access control to the MP handler. The parameters that can
be modified are:
•
•
•
•
Login timeout
Number of password faults allowed
Flow control time-outs
User parameters:
— User name
— Organization name
— Access level
— Mode
— User state
Exa m p le B-24
SO Com m a n d
205
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Management Processor Commands
MP Command: SYSREV
MP Com m a n d : SYSR EV
SYSREV - Display System and Manageability Firmware Revisions
•
•
Access level—Single Partition User
Scope—Complex
This command will display the firmware revisions of all of the entities in the complex.
• Example:
MP:CM> sysrev
Manageability Subsystem FW Revision Level: 7.14
| Cabinet #0 |
-----------------------+-----------------+
| SYS FW | PDHC |
Cell (slot 0) | 32.2 | 7.6 |
Cell (slot 1) | 32.2 | 7.6 |
Cell (slot 2) | 32.2 | 7.6 |
Cell (slot 3) | 32.2 | 7.6 |
Cell (slot 4) | | |
Cell (slot 5) | | |
Cell (slot 6) | | |
Cell (slot 7) | | |
| |
MP | 7.14 |
CLU | 7.6 |
PM | 7.12 |
CIO (bay 0, chassis 1) | 7.4 |
CIO (bay 0, chassis 3) | 7.4 |
CIO (bay 1, chassis 1) | 7.4 |
CIO (bay 1, chassis 3) | 7.4 |
MP:CM>
• See also: PS
206
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Management Processor Commands
MP Command: TC
MP Com m a n d : TC
TC - TOC Partition
•
•
Access level—Single Partition User
Scope—Partition
This command transfers the control (TOC) of the specified partition. The SINC on each cell in the specified
partition asserts the sys_init signal to Dillon.
Exa m p le B-25
TC Com m a n d
207
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Management Processor Commands
MP Command: TE
MP Com m a n d : TE
TE - Tell
•
•
Access level—Single Partition User
Scope—Complex
This command treats all characters following the TE as a message that is broadcast when the <CR> is
pressed. The message size is limited to 80 characters. Any extra characters are not broadcast. Also, any
message that is written is not entered into the console log.
NOTE
All users connected to the MP handler will receive the message irrespective of what Partition
the user sending the message has access to.
Exa m p le B-26
TE Com m a n d
208
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Management Processor Commands
MP Command: VM
MP Com m a n d : VM
VM - Voltage Margin
•
•
Access level—Single Partition User
Scope—Cabinet
The command adjusts the voltage of all marginable supplies within a range of +/- 5%
No reset is required for the command to become effective.
Exa m p le B-27
VM Com m a n d
209
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Management Processor Commands
MP Command: WHO
MP Com m a n d : WH O
WHO - Display List of Connected Users
•
•
Access level—Single Partition User
Scope—Complex
This command displays the login name of the connected console client user and the port on which they are
connected. For LAN console clients the remote IP address is displayed.
Exa m p le B-28
WH O Com m a n d
210
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Management Processor Commands
MP Command: XD
MP Com m a n d : XD
XD - Diagnostic and Reset of MP
•
•
Access level—Operator
Scope—Complex
This command tests certain functions of the SBC and SBCH boards. Some of the tests are destructive and
should not be performed on a system running the operating system.
Exa m p le B-29
XD Com m a n d
211
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Management Processor Commands
MP Command: XD
212
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C Pow er in g t h e Syst em On a n d Off
This appendix provides procedures to shut down and bring up a system. Chose the appropriate section for the
desired task. Not all steps in a procedure may apply. For example, if you are checking the configuration as
outlined in “Checking System Configuration” on page 214 and you already connected to the host, step 1. is
unnecessary.
213
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Powering the System On and Off
Shutting Down the System
Sh u tt in g Dow n t h e Syst em
Use this procedure whenever the system must be shut down.
Ch eck in g System Con figu r a t ion
To check the current system configuration, in preparation for shutdown, perform the following procedure:
telnet<hostname>
F igu r e C-1 Con n ectin g t o H ost
Step 2. Enter the appropriate login and password at the MPprompt. The Main Menu appears (Figure C-2):
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Powering the System On and Off
Shutting Down the System
F igu r e C-2 Ma in MP Men u
Step 3. Invoke the Command Menu by entering cmat the MPprompt.
Step 4. Make sure that no one else is using the system by entering whoat the CMprompt. Only one user
F igu r e C-3 Ch eck in g for Oth er User s
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Powering the System On and Off
Shutting Down the System
Step 5. Read the and save the current system configuration by entering cpand the CMprompt. Cabinet and
F igu r e C-4 Ch eck in g Cu r r en t Syst em Con figu r a t ion
Step 6. Go back to the Main Menu by entering maat the CMprompt.
F igu r e C-5 MP Vir tu a l F r on t P a n el
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Powering the System On and Off
Shutting Down the System
Step 8. From the VFP, enter sto select the whole system or enter the partition number to select a
F igu r e C-6 Exa m p le of P a r t ition St a te
Step 9. Enter ctrl+B to exit the Virtual Front Panel and bring up the Main Menu.
Sh u ttin g Dow n th e Op er a tin g Syst em
You must shutdown the operating system on each partition. From the Main Menu prompt, enter coto bring
F igu r e C-7
P a r tit ion Con soles Men u
For each partition, perform the following steps:
Step 1. Enter the partition number at the prompt.
Step 2. Log in to the console:
•
•
HP-UX: Log in as root
Linux: Log in as root
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Powering the System On and Off
Shutting Down the System
•
Windows: Log in as Administrator. From the Special Administration Console (SAC> prompt)
enter cmdto start a new command prompt. Press Esc+Tab to switch to the channel for the
command prompt and log in.
Step 3. At the console prompt, shut down and halt the operating system by entering the shutdown
command.
•
•
HP-UX: Enter the shutdown -hcommand
Linux: Enter the shutdown -h<time>command, where <time> is the number of minutes until
system shutdown
•
Windows: Enter the shutdown /scommand
Step 4. Exit the partition console by entering ctrl+B after shutting down the system.
P r ep a r in g th e Pa r tition s for Sh u td ow n
IMPORTANT Before powering off the cabinets, HP recommends first that all partitions be brought to the
boot-is-blocked(BIB) state.
Perform the following procedure to ensure that all partitions are ready to be shut down.
Step 2. Enter the partition number and when prompted for reset of the partition number, enter Y(yes).
F igu r e C-8 Issu in g a n r r Com m a n d
Step 4. From the de menu prompt, enter sto display the Cell PDH Controller.
Step 5. When prompted, enter the cabinet and cell board number on which the partition resides.
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Powering the System On and Off
Shutting Down the System
Step 6. Read the Cell PDH Controller status to determine if the partition is at BIB.
F igu r e C-9 Usin g th e de -sCom m a n d
Boot-is-blocked
Step 7. Repeat step 1 through step 6 for each partition.
Pow er in g Off th e Syst em Usin g th e p e Com m a n d
Perform the following steps to power off the system.
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Powering the System On and Off
Shutting Down the System
F igu r e C-10 P ow er E n tit y Com m a n d
Step 3. When prompted for the state of the cabinet power, enter off.
F igu r e C-11 P ow er St a tu s F ir st Win d ow
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Powering the System On and Off
Shutting Down the System
Step 5. Enter bat the select device prompt to select ensure that the cabinet power is off. The output should
enabled.
F igu r e C-12 P ow er St a tu s Se con d Win d ow
The cabinet is now powered off.
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Powering the System On and Off
Turning On Housekeeping Power
Tu r n in g On H ou sek eep in g P ow er
Use the following procedure to turn on housekeeping power to the system:
Step 1. Verify that the ac voltage at the input source is within specifications for each cabinet being
installed.
Step 2. Ensure that:
•
•
•
The ac breakers are in the OFF position.
The cabinet power switch at the front of the cabinet is in the OFF position.
The ac breakers and cabinet switches on the I/O expansion cabinet (if one is present) are in the
OFF position.
Step 3. If the complex has an IOX cabinet, power on this cabinet first.
IMPORTANT The 48 V switch on the front panel must be off at this time.
Step 4. Turn on the ac breakers on the PDCAs at the back of the each cabinet.
In a large complex, power on cabinets in one of the two following orders:
•
•
9, 8, 1, 0
8, 9, 0, 1
On cabinet 0, the HKP and the Present LEDs illuminate, but only the HKP LED illuminates on
cabinet 1 (the right cabinet).
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Powering the System On and Off
Turning On Housekeeping Power
F igu r e C-13 F r on t P a n e l Disp la y w it h H ou se k ee p in g (H KP ) P ow er On , a n d
P r e se n t LE Ds
HKP, Present,
and Attention
LEDs
When on, the breakers on the PDCA distribute power to the BPSs. Power is present at the BPSs
when:
•
The amber light next to the label AC0 Present is on (if the breakers are on the PDCA on the left
side at the back of the cabinet).
•
The amber light next to the label AC1 Present is on (if the breakers are on the PDCA on the
right side at the back of the cabinet).
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Powering the System On and Off
Powering On the System Using the pe Command
P ow er in g On t h e Syst em Usin g t h e p e Com m a n d
This section describes how to power on the system. Use the following procedures whenever the system needs
to be powered on.
Step 1. From the Command Menu, enter the pecommand.
IMPORTANT If the complex has an IOX cabinet, power on this cabinet first.
In a large complex, cabinets should be powered on in one of the two following orders:
•
•
9, 8, 1, 0
8, 9, 0, 1
F igu r e C-15 P ow er E n tit y Com m a n d
Step 3. The power state is OFF. Enter onto power on the cabinet.
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Powering the System On and Off
Powering On the System Using the pe Command
Step 4. From the CM> prompt, enter psto observe the power status. The status screen shown in
Figure C-16 appears.
F igu r e C-16 P ow er St a tu s F ir st Win d ow
Step 5. At the Select Device prompt, enter B then the cabinet number to check the power status of the
F igu r e C-17 P ow er St a tu s Win d ow
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Templates
Templates
F igu r e D-3
SD64 Sp a ce R e qu ir e m en t s
Equ ip m en t Footp r in t Tem p la tes
Equipment footprint templates are drawn to the same scale as the floor plan grid (1/4 inch = 1 foot). These
templates are provided to show basic equipment dimensions and space requirements for servicing.
The service areas shown on the template drawings are lightly shaded.
Use equipment templates with the floor plan grid to define the location of the equipment that will be installed
in the computer room.
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Templates
Templates
NOTE
Photocopying typically changes the scale of copied drawings. If any templates are copied, then
all templates and floor plan grids must also be copied.
Com p u ter R oom La you t P la n
Use the following procedure to create a computer room layout plan:
Step 1. Remove several copies of the floor plan grid.
Step 2. Cut and join them together (as necessary) to create a scale model floor plan of the computer room.
Step 3. Remove a copy of each applicable equipment footprint template.
Step 4. Cut out each template selected in step 3; then place it on the floor plan grid created in step 2.
Step 5. Position pieces until the desired layout is obtained; then fasten the pieces to the grid. Mark
locations of computer room doors, air-conditioning floor vents, utility outlets, and so on.
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Templates
Templates
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In d ex
A
component
ac power
ac power verification
D
acoustic noise specifications
damage
discharge
door installation
B
E
bezel
blower housings
ejectors
EMI panel
booting
equipment
F
facility guidelines
C
cables
G
H
cell board
housekeeping power
checklist
circuit breaker sizing
CLU
I
inspecting
installation
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In d ex
interference
power
IP address
power options
J
power requirements
J TAG utility for scan test
J UST
power up
K
kick plates
R
L
LAN
S
LED
leveling feet
space requirements
Superdome system
M
Support Management Station
MP
T
thermal report
tilt indicator
N
P
U
unpacking
PDCA
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