HP Hewlett Packard Server 595166 001 User Manual

HP ProLiant DL/ML370 G6 Server  
User Guide  
Abstract  
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the  
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.  
Part Number: 513482-004  
May 2011  
Edition: 4  
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Contents  
Contents  
3
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Contents  
4
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Contents  
5
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6
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Component identification  
Front panel components  
Item  
Description  
USB connectors (2)  
1
2
3
4
5
6
7
8
Drive cage blank  
SAS/SATA drives (8)  
Front video connector (rack model only)  
Systems Insight Display  
Removable media bay  
DVD-ROM drive  
Optical drive blank  
Component identification  
7
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Front panel LEDs and buttons  
Item  
Description  
Status  
Power On/Standby button  
and system power LED  
Green = Normal (system on)  
Amber = System in standby, but power still applied  
Off = Power cord not attached or power supply failure  
1
Health LED  
UID LED  
Green = Normal (system on)  
Amber = System health is degraded  
Red = System health is critical.  
Off = Normal (system off)  
2
3
Blue = Activated  
Flashing blue = System is being managed remotely  
Off = Deactivated  
Component identification  
8
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Systems Insight Display LEDs  
The HP Systems Insight Display LEDs represent the system board layout.  
Item  
Description  
Status  
Power cap  
To determine Power cap status, see  
"Systems Insight Display LED combinations  
(on page 9)."  
1
AMP Status  
DIMM LEDs  
All other LEDs  
Green = AMP mode enabled  
Amber = Failover  
Flashing amber = Invalid configuration  
Off = AMP mode disabled  
2
3
All LEDs flashing = DIMM unseated  
Amber = Failure  
Off = Normal  
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.  
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing  
each DIMM in a bank with a known working DIMM.  
Systems Insight Display LED combinations  
When the health LED on the front panel illuminates either amber or red, the server is experiencing a health  
event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED  
indicate system status.  
Component identification  
9
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Systems Insight Display Health LED  
LED and color  
System power  
LED  
Status  
Red  
Amber  
One or more of the following conditions may  
exist:  
Processor (amber)  
Processor in socket X has failed.  
Processor X is not installed in the socket.  
Processor X is unsupported.  
ROM detects a failed processor during  
POST  
Amber  
Green  
Processor in socket X is in a pre-failure  
condition.  
Processor (amber)  
Red  
Green  
Green  
Green  
One or more DIMMs have failed.  
DIMM (amber)  
Amber  
Amber  
DIMM in slot X is in a pre-failure condition.  
DIMM (amber)  
The Health Driver has detected a cautionary  
temperature level.  
Overtemperature (amber)  
Red  
Amber  
The server has detected a hardware critical  
temperature level.  
Overtemperature (amber)  
Amber  
Red  
Green  
Green  
One fan has failed or has been removed.  
Fan (amber)  
Fan (amber)  
Two or more fans have failed or been  
removed.  
Red  
Amber  
Power supply (amber)  
Only one power supply is installed and  
that power supply is in standby.  
Power supply fault  
System board fault  
Amber  
Green  
Power supply (amber)  
Redundant power supply is installed and  
only one power supply is functional.  
AC power cord is not plugged into  
redundant power supply.  
Redundant power supply fault  
Power supply mismatch at POST or  
power supply mismatch through hot-plug  
addition.  
Amber  
Standby  
Power cap (off)  
Flashing green  
Amber  
Waiting for power  
Power cap has been exceeded  
Power cap (green)  
Power cap (flashing  
amber)  
Green  
Power is available  
Power cap (green)  
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.  
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing  
each DIMM in a bank with a known working DIMM.  
Component identification 10  
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Rear panel components  
Item  
Description  
Mouse connector  
Keyboard connector  
Serial connector  
iLO 2 connector  
USB connectors (2)  
1
2
3
4
5
NIC connectors (4)  
6
7
8
PCI expansion slots  
Reserved for PCI-X option kit  
Video connector  
9
Power supply bay 2  
10  
11  
Power supply bay 1 (populated)  
Component identification 11  
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Rear panel LEDs  
Item  
Description  
Status  
UID LED  
Blue = Activated  
Flashing blue = System is being managed remotely.  
Off = Deactivated  
1
iLO 2 activity LED  
iLO 2 link LED  
Green or flashing green = Network activity  
Off = No network activity  
2
3
4
5
6
Green = Linked to network  
Off = No network connection  
NIC link LED  
Green = Linked to network  
Off = No network connection  
NIC activity LED  
Power supply LED  
Green or flashing green = Network activity  
Off = No network activity  
Green = System has AC power and is powered up.  
Off = System has no AC power, the system is off, or the power supply  
has failed.  
Component identification 12  
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System board components  
Item  
Description  
SD card slot  
1
Power backplane connector  
Processor 1 DIMM slots  
Power supply connector  
SAS connector B  
2
3
4
5
SAS connector A  
6
Front panel connector  
Systems Insight Display connector  
Front video connector  
Front USB connector  
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
Smart Array P410i memory module  
Reserved  
System battery  
TPM connector  
SATA connectors (6)  
Slot 1 PCIe x8 (4, 2, 1)  
Slot 2 PCIe2 x8 (4, 2, 1)  
Slot 3 PCIe2 x16 (16, 8, 4, 2, 1)  
System maintenance switch  
Slot 4 PCIe2 x8 (4, 2, 1)  
Slot 5 PCIe2 x8 (4, 2, 1)  
Slot 6 PCIe2 x16 (8, 4, 2, 1)  
Slot 7 PCIe2 x8 (4, 2, 1)  
Slot 8 PCIe2 x16 (16, 8, 4, 2, 1)  
Slot 9 PCIe2 x8 (4, 2, 1)  
24  
25  
Component identification 13  
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Item  
Description  
Slot 10 PCIe2 x8 (8, 4, 2, 1)  
26  
Internal USB connector  
27  
Processor socket 2  
28  
29  
30  
31  
Processor 2 DIMM slots  
Power supply connector  
Processor socket 1 (populated)  
DIMM slots  
DIMM slots are numbered sequentially (1 through 9) for each processor. The supported AMP modes use the  
letter assignments for population guidelines.  
System maintenance switch  
The system maintenance switch (SW1) is a ten-position switch that is used for system configuration.  
Position  
Description  
Function  
iLO security  
Off = iLO security is enabled.  
On = iLO security is disabled.  
S1  
Component identification 14  
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Position  
Description  
Function  
Configuration  
lock  
Off = System configuration can be  
changed.  
S2  
On = System configuration is  
locked.  
Rack/Tower ID  
Reserved  
Off = Tower  
On = Rack  
S3  
Reserved  
S4  
S5  
Password  
protection  
override  
Off = No function  
On = Clears power-on password  
and administrator password  
Invalidate  
configuration  
Off = Normal  
On = ROM treats the system  
configuration as invalid.  
S6  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
S7  
S8  
S9  
S10  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all  
system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
NMI functionality  
An NMI crash dump enables administrators to create crash dump files when a system is hung and not  
responding to traditional debug mechanisms.  
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating  
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for  
administrators is to cycle the system power. Resetting the system erases any information that could support  
problem analysis, but the NMI feature preserves that information by performing a memory dump before a  
hard reset.  
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can do any of  
the following:  
Short the NMI jumper pins  
Press the NMI switch  
Use the iLO Virtual NMI feature  
For additional information, see the whitepaper on the HP website  
Component identification 15  
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SAS and SATA device numbers  
With optional hard drive cages installed, the server supports up to 24 SFF hard drives or up to 14 LFF hard  
drives. The server does not support mixing SFF and LFF hard drives.  
HP recommends populating hard drive bays starting with the lowest SAS or SATA device number.  
SFF hard drives  
LFF hard drives  
Component identification 16  
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SAS and SATA hard drive LEDs  
Item  
Description  
Status  
Fault/UID LED  
Amber = Drive failure  
1
Flashing amber = Fault-process activity  
Blue = Unit identification is active  
Off = No fault-process activity  
Online/activity LED  
Green = Drive activity  
2
Flashing green = High activity on the drive or  
drive is being configured as part of an array  
Off = No drive activity  
SAS and SATA hard drive LED combinations  
Online/activity Fault/UID LED  
Interpretation  
LED (green)  
(amber/blue)  
Alternating amber and The drive has failed, or a predictive failure alert has been  
On, off, or  
flashing  
blue  
received for this drive; it also has been selected by a management  
application.  
Steadily blue  
The drive is operating normally, and it has been selected by a  
management application.  
On, off, or  
flashing  
Amber, flashing  
regularly (1 Hz)  
A predictive failure alert has been received for this drive.  
Replace the drive as soon as possible.  
On  
Off  
The drive is online, but it is not active currently.  
On  
Amber, flashing  
regularly (1 Hz)  
Do not remove the drive. Removing a drive may terminate the  
current operation and cause data loss.  
The drive is part of an array that is undergoing capacity  
expansion or stripe migration, but a predictive failure alert has  
been received for this drive. To minimize the risk of data loss, do  
not replace the drive until the expansion or migration is complete.  
Flashing regularly  
(1 Hz)  
Component identification 17  
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Online/activity Fault/UID LED  
Interpretation  
LED (green)  
(amber/blue)  
Off  
Do not remove the drive. Removing a drive may terminate the  
current operation and cause data loss.  
The drive is rebuilding, or it is part of an array that is undergoing  
capacity expansion or stripe migration.  
Flashing regularly  
(1 Hz)  
Amber, flashing  
regularly (1 Hz)  
The drive is active, but a predictive failure alert has been received  
for this drive. Replace the drive as soon as possible.  
Flashing  
irregularly  
Off  
The drive is active, and it is operating normally.  
Flashing  
irregularly  
Steadily amber  
A critical fault condition has been identified for this drive, and the  
controller has placed it offline. Replace the drive as soon as  
possible.  
Off  
Amber, flashing  
regularly (1 Hz)  
A predictive failure alert has been received for this drive. Replace  
the drive as soon as possible.  
Off  
Off  
Off  
The drive is offline, a spare, or not configured as part of an array.  
Fans  
Item  
Description  
Fan 1  
Configuration  
Redundant  
Primary  
1
2
3
4
5
Fan 2  
Fan 3  
Redundant  
Primary  
Fan 4  
Fan 5  
Primary  
Component identification 18  
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Battery pack LEDs  
Item ID Color  
Description  
Green  
System Power LED. This LED glows steadily when the system  
is powered up and 12 V system power is available. This  
power supply is used to maintain the battery charge and  
provide supplementary power to the cache microcontroller.  
1
Green  
Auxiliary Power LED. This LED glows steadily when 3.3V  
auxiliary voltage is detected. The auxiliary voltage is used  
to preserve BBWC data and is available any time that the  
system power cords are connected to a power supply.  
2
Amber  
Green  
Battery Health LED. To interpret the illumination patterns of  
this LED, see the following table.  
3
4
BBWC Status LED. To interpret the illumination patterns of  
this LED, see the following table.  
LED3 pattern  
LED4 pattern  
Interpretation  
One blink every  
two seconds  
The system is powered down, and the cache contains data that has not  
yet been written to the drives. Restore system power as soon as  
possible to prevent data loss.  
Data preservation time is extended any time that 3.3 V auxiliary  
power is available, as indicated by LED 2. In the absence of auxiliary  
power, battery power alone preserves the data. A fully-charged  
battery can normally preserve data for at least two days.  
The battery lifetime also depends on the cache module size. For further  
information, refer to the controller QuickSpecs on the HP website  
Double blink, then The cache microcontroller is waiting for the host controller to  
pause communicate.  
Component identification 19  
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LED3 pattern  
LED4 pattern  
Interpretation  
One blink per  
second  
The battery pack is below the minimum charge level and is being  
charged. Features that require a battery (such as write cache, capacity  
expansion, stripe size migration, and RAID migration) are temporarily  
unavailable until charging is complete. The recharge process takes  
between 15 minutes and two hours, depending on the initial capacity  
of the battery.  
Steady glow  
Off  
The battery pack is fully charged, and posted write data is stored in the  
cache.  
The battery pack is fully charged, and there is no posted write data in  
the cache.  
One blink per  
second  
An alternating green and amber blink pattern indicates that the cache  
microcontroller is executing from within its boot loader and receiving  
new flash code from the host controller.  
One blink per  
second  
There is a short circuit across the battery terminals or within the battery  
pack. BBWC features are disabled until the battery pack is replaced.  
The life expectancy of a battery pack is typically more than three  
years.  
Steady glow  
There is an open circuit across the battery terminals or within the  
battery pack. BBWC features are disabled until the battery pack is  
replaced. The life expectancy of a battery pack is typically more than  
three years.  
One blink per  
second  
FBWC module LEDs  
The FBWC module has two single-color LEDs (green and amber). The LEDs are duplicated on the reverse side  
of the cache module to facilitate status viewing.  
Green LED  
Amber LED  
Interpretation  
On  
On  
Off  
Off  
A backup is in progress.  
Off  
A restore is in progress.  
Flashing (1 Hz)  
Flashing (1 Hz)  
On  
The capacitor pack is charging.  
The capacitor pack has completed charging.  
Component identification 20  
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Green LED  
Amber LED  
Interpretation  
Flashing (2 Hz)  
Alternating with  
green LED  
One of the following conditions exists:  
Flashing (2 Hz)  
Alternating with  
amber LED  
The charging process has timed out.  
The capacitor pack is not connected.  
On  
Off  
The flash code image failed to load.  
The flash code is corrupt.  
On  
Off  
Power supply backplane connectors  
Item  
BP1  
BP2  
BP3  
P1  
Description  
Drive bay 1 power cable  
Drive bay 2 power cable  
Drive bay 3 power cable  
Power supply 1 cable  
Power supply 2 cable  
SATA power cable  
P2  
P6  
SATA power cable  
P7  
SATA power cable  
P8  
Video adapter power cable  
Data cable  
P9  
P10  
P12  
Video adapter power cable  
Drive cage jumper configuration settings  
Drive cage  
Installation  
Standard  
Optional  
Optional  
Pin setting  
No jumper  
1-2*  
1
2
3
2-3  
*Optional drive cages ship with the jumper set across pins 1 and 2.  
Component identification 21  
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Operations  
Power up the server  
To power up the server, press the Power On/Standby button.  
Power down the server  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.  
1.  
2.  
Back up the server data.  
Shut down the operating system as directed by the operating system documentation.  
NOTE: If the operating system automatically places the server in Standby mode, omit the next  
step.  
3.  
Press the Power On/Standby button to place the server in Standby mode. When the server activates  
Standby power mode, the system power LED changes to amber.  
IMPORTANT: Pressing the UID button illuminates the blue UID LEDs on the front and rear panels.  
In a rack environment, this feature facilitates locating a server when moving between the front and  
rear of the rack.  
4.  
Disconnect the power cords.  
The system is now without power.  
Open or remove the tower bezel  
This server has a removable bezel that must be unlocked and opened before accessing the hard drives or  
removing the access panel. The bezel should be kept closed during normal server operations.  
Operations 22  
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Use the key provided with the server to unlock the bezel with a counterclockwise turn.  
If necessary, remove the tower bezel.  
Operations 23  
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The middle panel can be removed to access the Systems Insight Display and I/O bezel.  
The top panel can be removed to access the removable media bays.  
Extend the server from the rack  
IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access  
internal components.  
1.  
Extend the server on the rack rails until the server rail-release latches engage.  
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is  
adequately stabilized before extending a component from the rack.  
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release  
latches and sliding the server into the rack. The sliding rails could pinch your fingers.  
Operations 24  
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2.  
After performing the installation or maintenance procedure, slide the server into the rack by pressing the  
server rail-release latches.  
Remove the access panel  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
To remove the component:  
Do one of the following:  
1.  
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Operations 25  
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o
Extend the server from the rack (on page 24).  
2.  
Open the locking latch, slide the access panel to the rear of the chassis, and remove the access panel.  
If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch.  
Remove fans 1-4  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
IMPORTANT: When installing or replacing server components, one or more fans might need to  
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends  
powering down the server during these procedures. To determine if powering down is required,  
see the specific procedure.  
To remove the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
Remove the access panel (on page 25).  
Locate the fan to be removed ("Fans" on page 18).  
Remove the fan.  
Remove fan 5  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
Operations 26  
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IMPORTANT: When installing or replacing server components, one or more fans might need to  
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends  
powering down the server during these procedures. To determine if powering down is required,  
see the specific procedure.  
To remove the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
Remove the access panel (on page 25).  
Remove the fan from the air baffle.  
To replace the component, reverse the removal procedure.  
Remove the BBWC battery pack or the FBWC  
capacitor pack  
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove  
the battery pack while an array capacity expansion, RAID level migration, or stripe size migration  
is in progress.  
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED  
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do  
not remove the cable from the cache module. The cache module is backing up data, and data is  
lost if the cable is detached.  
To remove the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
Operations 27  
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o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
Remove the access panel (on page 25).  
Disconnect the cable from the cache module only if the battery pack is not being used to recover data  
from the server or transfer data to another server.  
5.  
Remove the battery pack.  
To replace the component, reverse the removal procedure.  
Remove the air baffle  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Operations 28  
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6.  
Remove the air baffle.  
Remove the fan cage  
IMPORTANT: When installing or replacing server components, one or more fans might need to  
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends  
powering down the server during these procedures. To determine if powering down is required,  
see the specific procedure.  
To remove the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Operations 29  
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7.  
Remove the fan cage.  
Remove the media bay blank  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
Remove the access panel (on page 25).  
Remove the media bay blank.  
Save the blank for future use.  
Operations 30  
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Remove the DVD-ROM drive  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Disconnect and remove the DVD-ROM drive data/power cable. For more information, see "DVD-ROM  
drive cabling (on page 110)."  
9.  
Remove the DVD-ROM drive.  
Remove the hard drive cage blank  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
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3.  
Remove the hard drive cage blank.  
Operations 32  
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Setup  
Optional installation services  
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and  
running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate  
both hardware and software support into a single package. A number of service level options are available  
to meet your needs.  
HP Care Pack Services offer upgraded service levels to expand your standard product warranty with  
easy-to-buy, easy-to-use support packages that help you make the most of your server investments. Some of  
the Care Pack services are:  
Hardware support  
o
o
o
6-Hour Call-to-Repair  
4-Hour 24x7 Same Day  
4-Hour Same Business Day  
Software support  
o
o
o
o
Microsoft®  
Linux  
HP ProLiant Essentials (HP SIM and RDP)  
VMWare  
Integrated hardware and software support  
o
o
o
o
Critical Service  
Proactive 24  
Support Plus  
Support Plus 24  
Startup and implementation services for both hardware and software  
For more information on HP Care Pack Services, see the HP website  
Rack planning resources  
The rack resource kit ships with all HP branded or Compaq branded 9000, 10000, and H9 series racks. For  
more information on the content of each resource, refer to the rack resource kit documentation.  
If you intend to deploy and configure multiple servers in a single rack, refer to the white paper on high-density  
Setup 33  
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Optimum environment  
When installing the server, select a location that meets the environmental standards described in this section.  
Space and airflow requirements  
Tower server  
In a tower configuration, leave at least a 7.6-cm (3-in) clearance space at the front and back of the server for  
proper ventilation.  
Rack server  
To allow for servicing and adequate airflow, observe the following space and airflow requirements when  
deciding where to install a rack:  
Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.  
Leave a minimum clearance of 76.2 cm (30 in) behind the rack.  
Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack  
or row of racks.  
HP servers draw in cool air through the front door and expel warm air through the rear door. Therefore, the  
front and rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and  
the rear door must be adequately ventilated to allow the warm air to escape from the cabinet.  
CAUTION: To prevent improper cooling and damage to the equipment, do not block the  
ventilation openings.  
When vertical space in the rack is not filled by a server or rack component, the gaps between the  
components cause changes in airflow through the rack and across the servers. Cover all gaps with blanking  
panels to maintain proper airflow.  
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement  
ensures proper airflow. Using a rack without blanking panels results in improper cooling that can  
lead to thermal damage.  
The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the front  
and rear doors that provide 64 percent open area for ventilation.  
CAUTION: When using a Compaq branded 7000 Series rack, you must install the high airflow  
rack door insert [P/N 327281-B21 (42U) or P/N 157847-B21 (22U)] to provide proper  
front-to-back airflow and cooling.  
CAUTION: If a third-party rack is used, observe the following additional requirements to ensure  
adequate airflow and to prevent damage to the equipment:  
Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow  
5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit adequate  
airflow (equivalent to the required 64 percent open area for ventilation).  
Side—The clearance between the installed rack component and the side panels of the rack  
must be a minimum of 7 cm (2.75 in).  
Setup 34  
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Temperature requirements  
To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated,  
climate-controlled environment.  
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C  
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).  
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:  
Do not permit optional equipment to impede airflow around the server or to increase the  
internal rack temperature beyond the maximum allowable limits.  
Do not exceed the manufacturer’s TMRA.  
Power requirements  
Installation of this equipment must comply with local and regional electrical regulations governing the  
installation of information technology equipment by licensed electricians. This equipment is designed to  
operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992  
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on  
options, refer to the product rating label or the user documentation supplied with that option.  
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not  
overload the AC supply branch circuit that provides power to the rack. Consult the electrical  
authority having jurisdiction over wiring and installation requirements of your facility.  
CAUTION: Protect the server from power fluctuations and temporary interruptions with a  
regulating uninterruptible power supply (UPS). This device protects the hardware from damage  
caused by power surges and voltage spikes and keeps the system in operation during a power  
failure.  
When installing more than one server, you may need to use additional power distribution devices to safely  
provide power to all devices. Observe the following guidelines:  
Balance the server power load between available AC supply branch circuits.  
Do not allow the overall system AC current load to exceed 80 percent of the branch circuit AC current  
rating.  
Do not use common power outlet strips for this equipment.  
Provide a separate electrical circuit for the server.  
Electrical grounding requirements  
The server must be grounded properly for proper operation and safety. In the United States, you must install  
the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as  
any local and regional building codes. In Canada, you must install the equipment in accordance with  
Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must  
install the equipment in accordance with any regional or national electrical wiring codes, such as the  
International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure  
that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed  
or certified grounding-type devices.  
Setup 35  
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Because of the high ground-leakage currents associated with multiple servers connected to the same power  
source, HP recommends the use of a PDU that is either permanently wired to the building’s branch circuit or  
includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those  
complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for  
the server is not recommended.  
Rack warnings  
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:  
The leveling jacks are extended to the floor.  
The full weight of the rack rests on the leveling jacks.  
The stabilizing feet are attached to the rack if it is a single-rack installation.  
The racks are coupled together in multiple-rack installations.  
Only one component is extended at a time. A rack may become unstable if more than one  
component is extended for any reason.  
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:  
At least two people are needed to safely unload the rack from the pallet. An empty 42U rack  
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and may become  
unstable when being moved on its casters.  
Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle  
the rack from both sides.  
WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately  
secured to the top and bottom of the building structure.  
Server warnings and cautions  
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the  
equipment:  
Observe local occupational health and safety requirements and guidelines for manual  
material handling.  
Get help to lift and stabilize the product during installation or removal, especially when the  
product is not fastened to the rails. When the server weighs more than 22.5 kg (50 lb), at least  
two people must lift the server into the rack together. A third person may be required to help  
align the server if the server is installed higher than chest level.  
Use caution when installing the server in or removing the server from the rack; it is unstable  
when not fastened to the rails.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
Setup 36  
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CAUTION: Protect the server from power fluctuations and temporary interruptions with a  
regulating uninterruptible power supply (UPS). This device protects the hardware from damage  
caused by power surges and voltage spikes and keeps the system in operation during a power  
failure.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
Identifying tower server shipping carton contents  
Unpack the server shipping carton and locate the materials and documentation necessary for installing the  
server.  
The contents of the server shipping carton include:  
Server  
Power cord  
Keyboard  
Mouse  
Tower feet  
Hardware documentation, Documentation CD, and software products  
In addition to the supplied items, you may need:  
Hardware options  
Operating system or application software  
PDU  
Identifying rack server shipping carton contents  
Unpack the server shipping carton and locate the materials and documentation necessary for installing the  
server. All the rack mounting hardware necessary for installing the server into the rack is included with the  
rack or the server.  
The contents of the server shipping carton include:  
Server  
Power cord  
Hardware documentation, Documentation CD, and software products  
Rack-mounting hardware  
In addition to the supplied items, you may need:  
Hardware options  
Operating system or application software  
PDU  
Setup 37  
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Installing hardware options  
Install any hardware options before initializing the server. For options installation information, refer to the  
option documentation. For server-specific information, refer to "Hardware options installation (on page 41)."  
Setting up a tower server  
Follow the steps in this section to set up a tower model server. If you are going to install the server into a rack,  
refer to the rack installation section ("Installing the server into the rack" on page 39).  
1.  
2.  
Place the server on a flat, stable surface.  
Install the tower feet.  
3.  
Connect peripheral devices to the server. ("Rear panel components" on page 11)  
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug  
telephone or telecommunications connectors into RJ-45 connectors.  
4.  
5.  
Connect the power cord to the rear of the server.  
Open the power cord retaining clip, and thread the power cord through the retaining clip.  
Setup 38  
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6.  
Push the tab into place to secure the power cord.  
7.  
Connect the power cord to the AC power source.  
WARNING: To reduce the risk of electric shock or damage to the equipment:  
Do not disable the power cord grounding plug. The grounding plug is an important safety  
feature.  
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all  
times.  
Unplug the power cord from the power supply to disconnect power to the equipment.  
Do not route the power cord where it can be walked on or pinched by items placed against it.  
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from  
the server.  
Installing the server into the rack  
To install the server into a rack with square, round, or threaded holes, refer to the instructions that ship with  
the rack hardware kit.  
If you are installing the server into a telco rack, order the appropriate option kit at the RackSolutions.com  
website (http://www.racksolutions.com/hp). Follow the server-specific instructions on the website to install  
the rack brackets.  
CAUTION: Always plan the rack installation so that the heaviest item is on the bottom of the rack.  
Install the heaviest item first, and continue to populate the rack from the bottom to the top.  
Setup 39  
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WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the  
equipment:  
Observe local occupational health and safety requirements and guidelines for manual  
material handling.  
Get help to lift and stabilize the product during installation or removal, especially when the  
product is not fastened to the rails. When the server weighs more than 22.5 kg (50 lb), at least  
two people must lift the server into the rack together. A third person may be required to help  
align the server if the server is installed higher than chest level.  
Use caution when installing the server in or removing the server from the rack; it is unstable  
when not fastened to the rails.  
1.  
2.  
Install the server and cable management arm into the rack. For more information, refer to the installation  
instructions that ship with the 3-7U Quick Deploy Rail System (rack installation only).  
Connect peripheral devices to the server ("Rear panel components" on page 11).  
Powering up and configuring the server  
To power up the server, press the Power On/Standby button.  
While the server boots, RBSU and the ORCA utility are automatically configured to prepare the server for  
operating system installation.  
To configure these utilities manually:  
Press the F8 key when prompted during the array controller initialization to configure the array  
controller using ORCA.  
Press the F9 key when prompted during the boot process to change the server settings using RBSU. The  
system is set up by default for the English language.  
For more information on the automatic configuration, refer to the HP ROM-Based Setup Utility User Guide  
located on the Documentation CD.  
Installing the operating system  
To operate properly, the server must have a supported operating system. For the latest information on  
supported operating systems, refer to the HP website (http://www.hp.com/go/supportos).  
Two methods are available to install an operating system on the server:  
SmartStart assisted installation—Insert the SmartStart CD into the CD-ROM drive and reboot the server.  
Manual installation—Insert the operating system CD into the CD-ROM drive and reboot the server. This  
process may require you to obtain additional drivers from the HP website  
Follow the on-screen instructions to begin the installation process.  
For information on using these installation paths, refer to the SmartStart installation poster in the HP ProLiant  
Essentials Foundation Pack, included with the server.  
Registering the server  
To register the server, refer to the HP Registration website (http://register.hp.com).  
Setup 40  
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Hardware options installation  
Introduction  
If more than one option is being installed, read the installation instructions for all the hardware options and  
identify similar steps to streamline the installation process.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: To prevent damage to electrical components, properly ground the server before  
beginning any installation procedure. Improper grounding can cause electrostatic discharge.  
Processor option  
The server supports single- and dual-processor operation. With two processors installed, the server supports  
boot functions through the processor installed in processor socket 1. However, if processor 1 fails, the system  
attempts to boot from processor 2 and provides a processor failure message.  
The server uses embedded PPMs to provide power to each processor.  
CAUTION: To avoid damage to the processor and system board, only authorized personnel  
should attempt to replace or install the processor in this server.  
CAUTION: To avoid damage to the processor:  
Handle the processor only by the edges.  
Do not touch the bottom of the processor, especially the contact area.  
IMPORTANT: Processor socket 1 must always be populated. If processor socket 1 is empty, the  
server halts during POST.  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
CAUTION: Failure to completely open the processor locking lever prevents the processor from  
seating during installation, leading to hardware damage.  
Hardware options installation 41  
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7.  
Open the processor locking lever and the processor socket retaining bracket. Do not remove the  
processor socket cover.  
IMPORTANT: Be sure the processor remains inside the processor installation tool.  
8.  
If the processor has separated from the installation tool, carefully re-insert the processor in the tool.  
Handle the processor by the edges only, and do not touch the bottom of the processor, especially the  
contact area.  
Hardware options installation 42  
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9.  
Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE  
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board:  
Never install or remove a processor without using the processor installation tool.  
Do not touch the processor socket contacts.  
Do not tilt or slide the processor when lowering the processor into the socket.  
Hardware options installation 43  
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10. Press the tabs on the processor installation tool to separate it from the processor, and then remove the  
tool.  
11. Close the processor socket retaining bracket and the processor locking lever. The processor socket  
cover is automatically ejected. Remove the cover.  
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor  
locking lever. The lever should close without resistance. Forcing the lever closed can damage the  
processor and socket, requiring system board replacement.  
Hardware options installation 44  
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12. Open the heatsink retaining latches.  
13. Remove the protective cover from the heatsink.  
CAUTION: To prevent thermal instability and damage to the server, do not separate the  
processor from the heatsink after assembling.  
Hardware options installation 45  
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14. Install the heatsink, and then close the heatsink retaining latches.  
15. Install the air baffle.  
16. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
17. Install fan 5.  
18. Install the access panel.  
19. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
20. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Memory options  
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix  
these two types causes the server to halt during BIOS initialization.  
The memory subsystem in this server can support RDIMMs or UDIMMs. Both types are referred to as DIMMs  
when the information applies to both types. When specified as RDIMM or UDIMM, the information applies  
to that type only. All memory installed in the server must be the same type.  
The server supports the following DIMM speeds:  
Single- and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1333 and 1066 MHz  
Quad-rank PC3-8500 (DDR-1067) DIMMs operating at 1066 MHz  
Depending on the processor model, the number of DIMMs installed, and whether UDIMMs or RDIMMs are  
installed, the memory clock speed may be reduced to 1066 or 800 MHz. For more information on the effect  
of DIMM slot population, see "General DIMM slot population guidelines (on page 50)."  
Hardware options installation 46  
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Memory subsystem architecture  
The memory subsystem in this server is divided into channels. Each processor supports three channels, and  
each channel supports three DIMM slots, as shown in the following table.  
Channel  
Population order  
Slot number  
G
D
A
1
2
3
1
H
E
B
4
5
6
2
3
I
F
C
7
8
9
This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture  
also enables the Lockstep, Online Spare, and Mirrored Memory modes. This server supports both Registered  
PC3 DIMMs (RDIMMs) and Unbuffered DIMMs (UDIMMs).  
DIMM slots in this server are identified by number and by letter. Letters identify the slots to populate for  
specific AMP modes. Slot numbers are reported by ROM messages during boot and for error reporting.  
Single-, dual-, and quad-rank DIMMs  
To understand and configure memory protection modes properly, an understanding of single-, dual-, and  
quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.  
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the  
memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only one  
rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same module. Only  
one rank is accessible at a time. The server memory control subsystem selects the proper rank within the  
DIMM when writing to or reading from the DIMM.  
Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For  
example, if current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4-GB,  
and a quad-rank DIMM would be 8-GB.  
DIMM identification  
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix  
these two types causes the server to halt during BIOS initialization.  
Hardware options installation 47  
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The memory subsystem may be populated with either RDIMMs or UDIMMs, but mixing the two types is not  
supported. To determine DIMM characteristics, use the label attached to the DIMM and the following  
illustration and table.  
Item Description  
Definition  
Size  
1
2
Rank  
1R = Single-rank  
2R = Dual-rank  
4R = Quad-rank  
Data width  
x4 = 4-bit  
x8 = 8-bit  
3
4
5
Memory speed  
DIMM type  
10600 = 1333-MHz  
8500 = 1066-MHz  
R = RDIMM (registered)  
E = UDIMM (unbuffered with ECC)  
For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com).  
Memory configurations  
To optimize server availability, the server supports the following AMP modes:  
Advanced ECC—provides the greatest memory capacity for a given DIMM size, while providing up to  
4-bit error correction. This mode is the default option for this server.  
Mirrored Memory—provides maximum protection against failed DIMMs. Uncorrectable errors in one  
channel are corrected by the mirror channel.  
Lockstep—provides enhanced protection while making all installed memory available to the operating  
system. The server can continue to function if a single- or multi-bit memory failure within a single DRAM  
device occurs.  
Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported  
by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see  
"HP ROM-Based Setup Utility (on page 116)."  
Hardware options installation 48  
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For the latest memory configuration information, see the QuickSpecs on the HP website  
RDIMM maximum memory configurations  
The following table lists the maximum memory configurations possible with 16-GB RDIMMs.  
Rank  
Single-processor  
36 GB  
Dual-processor  
72 GB  
Single-rank  
Dual-rank  
Quad-rank  
72 GB  
144 GB  
96 GB  
192 GB  
UDIMM maximum memory configurations  
When using 2-GB single- or dual-rank UDIMMs, the server supports a maximum of 24 GB with one processor  
and 48 GB with two processors.  
Advanced ECC memory configuration  
Advanced ECC memory is the default memory protection mode for this server. Standard ECC can correct  
single-bit memory errors and detect multi-bit memory errors. When multi-bit errors are detected using  
Standard ECC, the error is signaled to the server and causes the server to halt.  
Advanced ECC protects the server against some multi-bit memory errors. Advanced ECC can correct both  
single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM device on the DIMM.  
Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain  
memory errors that would otherwise be uncorrected and result in a server failure. The server provides  
notification that correctable error events have exceeded a pre-defined threshold rate.  
Lockstep memory configuration  
Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device.  
Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in each  
channel must have identical HP part numbers.  
Lockstep mode uses channel 1 and channel 2. Channel 3 is not populated. Because channel 3 cannot be  
populated when using Lockstep mode, the maximum memory capacity is lower than Advanced ECC mode.  
Memory performance with Advanced ECC is also slightly higher.  
Online Spare memory configuration  
Online spare memory provides protection against degraded DIMMs by reducing the likelihood of  
uncorrected memory errors. This protection is available without any operating system support.  
Online spare memory protection dedicates one rank of each memory channel for use as spare memory. The  
remaining ranks are available for OS and application use. If correctable memory errors occur at a rate  
higher than a specific threshold on any of the non-spare ranks, the server automatically copies the memory  
contents of the degraded rank to the online spare rank. The server then deactivates the failing rank and  
automatically switches over to the online spare rank.  
Hardware options installation 49  
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General DIMM slot population guidelines  
Observe the following guidelines for all AMP modes:  
Populate DIMM slots for a processor only if the processor is installed.  
To maximize performance in multi-processor configurations, distribute the total memory capacity  
between all processors as evenly as possible.  
Do not mix Unbuffered and Registered PC3 DIMMs.  
Each channel supports up to two Unbuffered DIMMs.  
If quad-rank DIMMs are installed for a processor, a maximum of two DIMMs can be installed on each  
channel for that processor.  
If a channel contains quad-rank DIMMs, the quad-rank DIMM must be installed first on that channel.  
DIMM speeds are supported as indicated in the following table.  
Populated slots  
(per channel)  
Rank  
Speeds supported  
(MHz)  
Single- or dual-rank  
Quad-rank  
1333, 1066  
1066  
1
1
2
3
Single- or dual-rank  
Single- or dual-rank  
1066  
800  
Advanced ECC population guidelines  
For Advanced ECC mode configurations, observe the following guidelines:  
Observe the general DIMM slot population guidelines (on page 50).  
DIMMs may be installed individually.  
Multi-processor Advanced ECC population order  
For Advanced ECC mode configurations with multiple processors, populate the DIMM slots for each  
processor in the following order:  
RDIMM: Sequentially in alphabetical order (A through I)  
UDIMM: A through F, sequentially in alphabetical order. Do not populate DIMM slots G through I.  
Single-processor Advanced ECC population order  
For Advanced ECC mode configurations with a single processor, populate the DIMM slots in the following  
order:  
RDIMM: Sequentially in alphabetical order (A through I)  
UDIMM: A through F, sequentially in alphabetical order. Do not populate DIMM slots G through I.  
Lockstep Memory population guidelines  
For Lockstep memory mode configurations, observe the following guidelines:  
Observe the general DIMM slot population guidelines (on page 50).  
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Always install DIMMs in channels 1 and 2 for each installed processor.  
Do not install DIMMs in channel 3 for any processor.  
DIMM configuration on channel 1 and channel 2 of a processor must be identical.  
In multi-processor configurations, each processor must have a valid Lockstep Memory configuration.  
In multi-processor configurations, each processor may have a different valid Lockstep Memory  
configuration.  
Single-processor Lockstep population order  
For Lockstep memory mode configurations with a single processor, populate the DIMM slots in the following  
order:  
RDIMM  
o
o
o
o
First: A and B  
Next: D and E  
Last: G and H  
Do not populate slots C, F, or I.  
UDIMM  
o
o
o
First: A and B  
Last: D and E  
Do not populate slots C, F, G, H, or I.  
After installing the DIMMs, use RBSU to configure the system for Lockstep memory support ("Configuring  
Multi-processor Lockstep population order  
For Lockstep memory mode configurations with multiple processors, populate the DIMM slots for each  
processor in the following order:  
RDIMM  
o
o
o
o
First: A and B  
Next: D and E  
Last: G and H  
Do not populate slots C, F, or I.  
UDIMM  
o
o
o
First: A and B  
Last: D and E  
Do not populate slots C, F, G, H, or I.  
After installing the DIMMs, use RBSU to configure the system for Lockstep memory support ("Configuring  
Online Spare population guidelines  
For Online Spare mode configurations, observe the following guidelines:  
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Observe the general DIMM slot population guidelines (on page 50).  
DIMM configuration on each channel of a processor must be identical.  
Each processor must have a valid Online Spare configuration.  
In multi-processor configurations, each processor can have a different valid Online Spare  
configuration.  
Installing a DIMM  
CAUTION: To avoid damage to the hard drives, memory, and other system components, the air  
baffle, drive blanks, and access panel must be installed when the server is powered up.  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Open the DIMM slot latches.  
Install the DIMM.  
9.  
Install the air baffle.  
10. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
11. Install fan 5.  
12. Install the access panel.  
If you are installing DIMMs in lock-step configuration, configure this mode in RBSU ("HP ROM-Based Setup  
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For more information about LEDs and troubleshooting failed DIMMs, see "Systems Insight Display LED  
combinations (on page 9)."  
Redundant fans option  
Redundant fan guidelines  
The server supports redundant hot-plug fans to provide proper airflow to the system if a primary fan fails.  
In the standard, non-redundant, configuration, fans 2, 4, and 5 cool the server.  
For the redundant configuration, fans 1 and 3 are added to back up the primary fans. This configuration  
enables the server to continue operation in non-redundant mode, if a fan failure occurs. The following rules  
apply:  
If one fan fails or is removed in non-redundant mode, the server shuts down.  
If one fan fails or is removed in redundant mode, the server converts to non-redundant mode.  
If two fans fail or are removed in redundant mode, the server shuts down.  
IMPORTANT: When installing or replacing server components, one or more fans might need to  
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends  
powering down the server during these procedures. To determine if powering down is required,  
see the specific procedure.  
Installing redundant fans  
WARNING: To prevent personal injury from hazardous energy:  
Remove watches, rings, or other metal objects.  
Use tools with insulated handles.  
Do not place tools or metal parts on top of batteries.  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
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8.  
Remove the fan blanks from bay 1 and bay 3. Retain the blanks for future use.  
9.  
Install the redundant fans.  
10. Install the fan cage.  
11. Install the air baffle.  
12. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
13. Install fan 5.  
14. Install the access panel.  
15. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
16. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
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Redundant hot-plug power supply option  
The server supports a second hot-plug power supply to provide redundant power to the system if the primary  
power supply fails.  
WARNING: To reduce the risk of electric shock or damage to the equipment:  
Do not disable the power cord grounding plug. The grounding plug is an important safety  
feature.  
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all  
times.  
Unplug the power cord from the power supply to disconnect power to the equipment.  
Do not route the power cord where it can be walked on or pinched by items placed against it.  
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from  
the equipment.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or  
power supply blank to cool before touching it.  
WARNING: To reduce the risk of electric shock or damage to the equipment, do not connect the  
power cord to the power supply until the power supply is installed.  
CAUTION: Always install either a hot-plug power supply or a power supply blank into each bay  
to maintain proper airflow and cooling in the server. Improper airflow can lead to thermal  
damage.  
Power supply configuration  
CAUTION: All power supplies installed in the server must have the same output power capacity.  
Verify that all power supplies have the same part number and label color. The system becomes  
unstable and may shut down when it detects mismatched power supplies.  
Label color  
Output  
460W  
Blue  
750W  
Orange  
Green  
1,200W  
Hot-plug power supply calculations  
For more information on the hot-plug power supply and calculators to determine server power consumption  
in various system configurations, refer to the HP Enterprise Configurator website  
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Installing a redundant hot-plug power supply  
To install the component:  
1.  
2.  
3.  
Remove the power supply blank.  
Install the second hot-plug power supply.  
Connect the power cord to the redundant power supply.  
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4.  
Use the power cord management clip to secure the cord and form a service loop.  
5.  
6.  
Connect the power cord to the AC power source.  
Be sure that the power supply LED is green ("Rear panel LEDs" on page 12).  
IMPORTANT: For maximum server availability, be sure that the two power supplies are powered  
by separate AC power sources.  
Hot-plug SAS hard drive options  
When adding hard drives to the server, observe the following general guidelines:  
The system automatically sets all device numbers.  
If only one hard drive is used, install it in the bay with the lowest device number.  
Drives should be the same capacity to provide the greatest storage space efficiency when drives are  
grouped together into the same drive array.  
Installing a hot-plug SAS hard drive  
1.  
Remove the SAS hard drive blank.  
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2.  
Prepare the hard drive.  
3.  
Install the hard drive.  
4.  
Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and  
Removing a hot-plug SAS hard drive  
CAUTION: For proper cooling do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
1.  
2.  
Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and  
Back up all server data on the hard drive.  
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3.  
Remove the hard drive.  
Eight-bay SFF drive cage option  
Install the optional eight-bay SFF drive cage in drive cage bay 2 or drive cage bay 3.  
To install an additional eight-bay SFF drive cage, an optional SAS controller is required. To obtain the option,  
contact an HP authorized reseller.  
To configure this option for drive cage bay 3, locate the three jumper pins on the backplane. Move the  
jumper from pins 1 and 2 to pins 2 and 3.  
For more information, see "Drive cage jumper configuration settings (on page 21)."  
Installing the eight-bay SFF drive cage (bay 2)  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Remove the hard drive cage blank (on page 31).  
Using a T-10 Torx screwdriver, remove the two screws on top of the drive cage.  
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Save the screws.  
10. Using the screws, install the eight-bay SFF drive cage.  
11. Connect the SAS cables to an optional SAS controller ("Storage controller option" on page 84).  
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12. Route and connect the drive cage bay 2 power cable (BP2) and the SAS cables to the drive cage  
backplane.  
13. Install the fan cage.  
14. Install the air baffle.  
15. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
16. Install fan 5.  
17. Install the access panel.  
18. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
19. Install the hard drives and hard drive blanks.  
20. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Installing the eight-bay SFF drive cage (bay 3)  
To configure this option for drive cage bay 3, locate the three jumper pins on the backplane. Move the  
jumper from pins 1 and 2 to pins 2 and 3.  
For more information, see "Drive cage jumper configuration settings (on page 21)."  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
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5.  
6.  
7.  
8.  
9.  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Remove the media bay blank (on page 30).  
Remove the DVD-ROM drive (on page 31).  
10. Using a T-10 Torx screwdriver, remove the two screws on top of the drive cage.  
11. Using a T-15 Torx screwdriver, remove the sleeve from the drive cage.  
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12. Install the drive cage.  
13. Using a T-15 Torx screwdriver, install the locking brackets.  
14. Connect the SAS cables to an optional SAS controller ("Storage controller option" on page 84).  
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15. Route and connect the drive cage bay 3 power cable (BP3) and the SAS cables to the drive cage  
backplane.  
16. Install the fan cage.  
17. Install the air baffle.  
18. Install fan 5.  
19. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
20. Install the access panel.  
21. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
22. Install the hard drives and hard drive blanks.  
23. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Six-bay LFF backplane option  
When installing a single six-bay LFF backplane, HP recommends installing it in drive cage bay 1.  
When installing a second six-bay LFF backplane, one of the following options is required:  
An optional SAS controller  
An optional 24-port SAS expander  
To obtain either of these options, contact an HP authorized reseller.  
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Installing the six-bay LFF backplane (bay 1)  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Remove any SFF drives installed in bay 1.  
Disconnect the power and data cables from the eight-bay SFF drive cage in drive cage bay 1.  
10. Using a T-10 Torx screwdriver, remove the eight-bay SFF drive cage from drive cage bay 1.  
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11. Using a T-15 Torx screwdriver, install the six-bay LFF backplane.  
12. Connect the power cable.  
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13. Route and connect the SAS cables.  
14. Install the fan cage.  
15. Install the air baffle.  
16. Install fan 5.  
17. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
18. Install the access panel.  
19. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
20. Install the hard drives and hard drive blanks.  
21. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Installing the six-bay LFF backplane (bay 2)  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
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7.  
8.  
9.  
Remove the fan cage (on page 29).  
Remove the hard drive cage blank (on page 31).  
Using a T-15 Torx screwdriver, install the six-bay LFF backplane.  
10. Connect the power cable.  
The cabling for drive cage bay 1 is not shown for clarity.  
11. Connect the SAS cables to an optional SAS controller ("Storage controller option" on page 84) or to an  
optional SAS expander ("HP SAS Expander Card option" on page 87).  
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12. Route and connect the SAS cables.  
13. Install the fan cage.  
14. Install the air baffle.  
15. Install fan 5.  
16. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
17. Install the access panel.  
18. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
19. Install the hard drives and hard drive blanks.  
20. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Two-bay LFF drive cage option  
To configure this option for drive cage bay 3, locate the three jumper pins on the backplane. Move the  
jumper from pins 1 and 2 to pins 2 and 3.  
For more information, see "Drive cage jumper configuration settings (on page 21)."  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
Remove the access panel (on page 25).  
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4.  
5.  
6.  
7.  
8.  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Remove all SFF drives and the drive cage from bay 3, if installed.  
For more information, see the server maintenance and service guide.  
Remove the media bay blank (on page 30).  
9.  
10. Remove the DVD-ROM drive (on page 31).  
11. Install the two-bay LFF drive cage.  
12. Using a T-15 Torx screwdriver, install the locking brackets.  
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13. Connect the drive cage bay 3 power cable (BP3) to the two-bay LFF drive cage backplane.  
14. Connect the two-bay LFF drive cage to one of the following:  
o
o
A six-bay LFF backplane. See step 15.  
An optional SAS controller. See step 16.  
15. Connect the SAS/SATA controller cable:  
a. Connect the "6LFF" labeled connector to SAS connector 5-6 on the six-bay LFF backplane.  
b. Connect the "2LFF" labeled connector to the two-bay LFF drive cage backplane.  
c. Connect the remaining connector to SAS connector B on the system board.  
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d. Connect the LED cable to the two-bay LFF drive cage backplane and to the six-bay LFF backplane.  
e. Proceed to step 17.  
16. Connect the SAS/SATA controller cable:  
a. Connect the main branch of the SAS/SATA controller cable to an optional SAS controller ("Storage  
b. Connect the "6LFF" labeled connector to the two-bay LFF drive cage backplane.  
For this cabling scenario, the "2LFF" labeled connector is not used.  
c. Coil the excess cable to minimize the impact to airflow.  
17. Install the fan cage.  
18. Install the air baffle.  
19. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
20. Install fan 5.  
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21. Install the access panel.  
22. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
23. Install the hard drives and hard drive blanks.  
24. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Removable media device options  
The server supports the installation of up to two half-height devices or one full-height device in the removable  
media bays.  
Installing a half-height media device  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Remove the media bay blank (on page 30).  
Using a T-15 Torx screwdriver, remove the screws from the blank and install them on the device.  
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10. Slide the media device part of the way into the bay.  
11. Connect the server data and power cables to the rear of the device.  
12. Slide the media drive fully into the bay until it is seated securely.  
13. Install the fan cage.  
14. Install the air baffle.  
15. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
16. Install fan 5.  
17. Install the access panel.  
18. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
19. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Installing a full-height media device  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Remove the media bay blank (on page 30).  
Remove the DVD-ROM drive (on page 31).  
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10. Using a T-15 Torx screwdriver, remove the screws from the blank and install them on the device.  
11. Slide the media device part of the way into the bay.  
12. Connect the server data and power cables to the rear of the device.  
13. Slide the media drive fully into the bay until it is seated securely.  
14. Install the fan cage.  
15. Install the air baffle.  
16. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
17. Install fan 5.  
18. Install the access panel.  
19. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
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20. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Slimline optical drive option  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Remove the optical drive blank.  
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9.  
Slide the optical drive into the drive bay.  
10. Route and connect the cables:  
a. Connect the power and data cable to the optical drive.  
b. Connect the power cable to an available system power cable.  
c. Route and connect the data cable to the system board.  
11. Install the fan cage.  
12. Install the air baffle.  
13. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
14. Install fan 5.  
15. Install the access panel.  
16. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
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17. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Expansion board options  
The server supports up to ten PCIe expansion boards. For more information, see "System board components  
(on page 13)."  
IMPORTANT: The HP SAS Expander Card and the HP NC524SFP Adapter are not supported in  
expansion slot 1.  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Open the expansion board retainer.  
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8.  
Remove the expansion slot cover.  
9.  
Install the expansion board.  
10. Close the expansion slot retainer.  
11. Connect any internal cables to the expansion board.  
12. Install the air baffle.  
13. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
14. Install fan 5.  
15. Install the access panel.  
16. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
17. Connect any external cables to the expansion boards.  
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18. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
HP NC524SFP Dual Port 10GbE Module option  
When installed on the HP NC375i Integrated Quad Port Multifunction Gigabit Server Adapter, the HP  
NC524SFP Dual Port 10GbE Module provides two 10G NIC connectors for server I/O.  
If more than one HP NC375i adapter is installed in the server, always install the HP NC524SFP module on  
the adapter in expansion slot 10.  
The HP NC375i adapter supports four NIC connectors at a time. When the HP NC524SFP module is  
installed, two 1G NIC connectors on the adapter are unavailable.  
IMPORTANT: When both an HP NC524SFP module and an optional HP NC522SFP Dual Port  
10GbE Server Adapter are installed in the server, only expansion slot 1 has Wake On LAN  
capability.  
To install the component:  
1.  
2.  
3.  
Power down the server (on page 22).  
Disconnect the network cables.  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
4.  
5.  
6.  
7.  
8.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Using a T-15 Torx screwdriver, remove the 10G NIC adapter blank.  
Save the retaining screw.  
9.  
Open the expansion board slot retainer.  
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10. Remove the HP NC375i adapter from expansion slot 10.  
11. Install the HP NC524SFP module on the HP NC375i adapter.  
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12. Install the mini-DIMM on the expansion board.  
13. Install the HP NC375i adapter in expansion slot 10.  
14. Close the expansion board slot retainer.  
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15. Secure the 10G NIC connectors to the chassis with the retaining screw.  
16. Install the RJ-45 plugs on the bottom (rack model) or right (tower model) two RJ-45 connectors on the HP  
NC375i adapter.  
17. Install the air baffle.  
18. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
19. Install fan 5.  
20. Install the access panel.  
21. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
22. Connect the network cables.  
23. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
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Storage controller option  
IMPORTANT: For additional installation and configuration information, refer to the  
documentation that ships with the option.  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Install the storage controller ("Expansion board options" on page 78).  
Connect the hot-plug SAS/SATA cable to the controller.  
For connector locations, see the documentation that ships with the controller.  
Install the air baffle.  
9.  
10. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
11. Install fan 5.  
12. Install the access panel.  
13. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
14. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
BBWC and FBWC options  
The server supports either of the following:  
Battery-backed write cache (BBWC) options  
BBWC consists of a cache module and a battery pack (also called a BBWC enabler). The DDR cache  
module buffers and stores data being written by the controller. When the system is powered on, the  
battery pack continuously recharges through a trickle-charging process lasting 15 minutes to 2 hours,  
depending on the original charge. In the event of system power failure, a fully charged battery pack can  
maintain the cached data for up to 72 hours.  
Flash-backed write cache (FBWC) options  
FBWC consists of a cache module and a capacitor pack. The DDR cache module buffers and stores  
data being written by the controller. When the system is powered on, the capacitor pack charges fully  
in about 5 minutes. In the event of a system power failure, a fully charged capacitor pack provides  
power for up to 80 seconds. During that interval, the controller transfers the cached data from DDR  
memory to flash memory, where the data remains indefinitely or until a controller retrieves the data.  
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CAUTION: Do not use this controller with cache modules designed for other controller models,  
because the controller can malfunction and you can lose data. Also, do not transfer this cache  
module to a different controller module, because you can lose data.  
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove  
the battery pack while an array capacity expansion, RAID level migration, or stripe size migration  
is in progress.  
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED  
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do  
not remove the cable from the cache module. The cache module is backing up data, and data is  
lost if the cable is detached.  
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST  
error message is displayed when the server is powered up, indicating that the battery pack is  
temporarily disabled. No action is necessary on your part. The internal circuitry automatically  
recharges the batteries and enables the battery pack. This process might take up to four hours.  
During this time, the cache module functions properly, but without the performance advantage of  
the battery pack.  
NOTE: The data protection and the time limit also apply if a power outage occurs. When power  
is restored to the system, an initialization process writes the preserved data to the hard drives.  
Installing the cache module  
CAUTION: Do not use this controller with cache modules designed for other controller models,  
because the controller can malfunction and you can lose data. Also, do not transfer this cache  
module to a different controller module, because you can lose data.  
To install the component:  
1.  
2.  
3.  
Back up all data.  
Close all applications.  
Power down the server (on page 22).  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
4.  
5.  
Do one of the following:  
o
o
Unlock and remove the bezel ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
Remove the access panel (on page 25).  
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6.  
Install the cache module.  
7.  
8.  
Install the access panel.  
Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
9.  
Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Installing the BBWC battery pack or the FBWC capacitor pack  
CAUTION: Do not use this controller with cache modules designed for other controller models,  
because the controller can malfunction and you can lose data. Also, do not transfer this cache  
module to a different controller module, because you can lose data.  
To install the component:  
1.  
2.  
3.  
Back up all data.  
Close all applications.  
Power down the server (on page 22).  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
4.  
Do one of the following:  
o
o
Unlock and remove the bezel ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
5.  
6.  
7.  
Remove the access panel (on page 25).  
Install the cache module ("Installing the cache module" on page 85).  
Install the storage controller ("Storage controller option" on page 84), if not already installed.  
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8.  
Install the battery pack or the capacitor pack, and then connect the cable to the connector on the top of  
the cache module.  
9.  
Install the access panel.  
10. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
11. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
HP SAS Expander Card option  
The HP SAS Expander Card is an optional controller that provides up to 24 connectors for internal SAS hard  
drives.  
IMPORTANT: The HP SAS Expander Card is not supported in expansion slot 1.  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Install the plastic bracket on the expander card (optional).  
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The plastic bracket ships with the expander card. For more information, see the documentation that  
ships with the option.  
9.  
Install the expander card ("Expansion board options" on page 78).  
10. Route and connect the cables.  
For more information, see the documentation that ships with the expander card.  
11. Install the fan cage.  
12. Install the air baffle.  
13. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
14. Install fan 5.  
15. Install the access panel.  
16. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
17. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Graphics adapter option  
The server supports up to three high-power graphics adapters.  
Install graphics adapters in the x16 PCIe expansion slots. For more information, see "System board  
components (on page 13)."  
Before installing a high-power graphics adapter in the server, be sure that the power supplies support the  
installation of the adapter. Due the high power requirements for the adapter, a 750W or higher power  
supply may be required. For more information, see the HP Enterprise Configurator website  
To install the component:  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
Install the graphics adapter in a x16 PCIe expansion slot ("Expansion board options" on page 78).  
Connect the power cables.  
For more information, see the documentation that ships with the graphics adapter power cable kit.  
10. Install the fan cage.  
11. Install the air baffle.  
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12. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
13. Install fan 5.  
14. Install the access panel.  
15. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
16. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Tower-to-rack conversion kit option  
The tower-to-rack conversion kit includes all equipment required to convert the tower model server into a rack  
model server and to install the server into most square- or round-hole racks.  
The tower-to-rack conversion kit includes:  
Rack-mounting hardware kit  
Rack bezel  
Front video connector cable  
T-15 screws (6)  
Screwlocks (2)  
This document  
In addition to the items supplied in the conversion kit, you will also need the following items:  
A Torx T-15 screwdriver (clipped to the rear panel of the server)  
A 3/16-in nut driver  
To convert a tower model server to a rack model server:  
1.  
2.  
Power down the server (on page 22).  
Disconnect all rear panel cabling.  
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3.  
Remove the feet.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove the tower bezel ("Open or remove the tower bezel" on page 22).  
Remove the access panel (on page 25).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove fan 5 (on page 26).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
10. Remove all SFF hard drives ("Removing a hot-plug SAS hard drive" on page 58).  
11. Disconnect all cables from the drive cages.  
12. Remove the SFF drive cages.  
For more information, see the server maintenance and service guide.  
13. Remove the hard drive cage blank (on page 31).  
14. Remove the DVD-ROM drive (on page 31), if installed.  
15. Remove the two-bay LFF drive cage, if installed.  
For more information, see the server maintenance and service guide.  
16. (Optional) Reduce the weight of the server:  
o
o
o
Remove the power supplies.  
Remove all LFF hard drives and blanks.  
Disconnect cabling and remove all devices from the removable media bays.  
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17. Extend the Systems Insight Display from the chassis.  
For the remaining steps, the Systems Insight Display is not shown for clarity.  
18. With a T-15 Torx screwdriver, remove the following seven screws:  
o
Inside (4)  
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o
Rear (1)  
o
Front (2)  
19. Remove the chassis from the tower side panels:  
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a. Disengage the chassis from the tower side panels by pushing the bottom side panel back and by  
pulling the chassis forward.  
b. Lift the chassis up and out of the tower side panels.  
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20. With the T-10 Torx screwdriver, remove the tower bezel bracket.  
21. Extend the I/O bezel from the chassis.  
22. Install the rack bezel using the T-15 screws provided.  
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The I/O bezel is not shown for clarity.  
23. Remove the front video connector cable blank from the I/O bezel.  
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24. Using a 3/16-in nut driver and the screwlocks, install the front video connector cable.  
25. Route the front video connector cable through the front of the chassis.  
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26. Install the I/O bezel.  
27. Route and connect the front video connector cable to the front video connector on the system board.  
28. Remove the Systems Insight Display cable from the tower slot.  
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29. Route the Systems Insight Display cable into the rack slot.  
30. Connect the Systems Insight Display cable to the Systems Insight Display.  
31. Install the Systems Insight Display.  
32. Install the SFF drive cages.  
33. Install the two-bay LFF drive cage, if removed.  
34. Install the DVD-ROM drive, if removed.  
35. Connect the drive cables.  
36. Install the fan cage.  
37. Install the air baffle.  
38. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
39. Install fan 5.  
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IMPORTANT: For the system to operate properly in a rack configuration, be sure to change the  
setting on the system maintenance switch.  
40. Set position 3 on the system maintenance switch to On.  
For the location of the system maintenance switch, see the label attached to the access panel.  
41. Install the access panel.  
42. Install the server in the rack.  
See the instructions in the rack-mounting hardware kit.  
43. Install the following items:  
o
o
o
Hard drives and blanks  
Media blank  
Power supplies  
44. Connect all rear panel cabling.  
45. Power up the server.  
HP Trusted Platform Module option  
Use these instructions to install and enable a TPM on a supported server. This procedure includes three  
sections:  
1.  
2.  
3.  
Installing the Trusted Platform Module board (on page 100).  
Retaining the recovery key/password (on page 101).  
Enabling the Trusted Platform Module (on page 101).  
Enabling the TPM requires accessing the ROM-Based Setup Utility (RBSU) ("HP ROM-Based Setup  
Utility" on page 116). For more information about RBSU, see the HP website  
TPM installation requires the use of drive encryption technology, such as the Microsoft® Windows®  
BitLocker™ Drive Encryption feature. For more information on BitLocker™, see the Microsoft website  
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines  
can cause hardware damage or halt data access.  
When installing or replacing a TPM, observe the following guidelines:  
Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system  
board.  
When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption  
technology. For security reasons, only the customer can enable these features.  
When returning a system board for service replacement, do not remove the TPM from the system board.  
When requested, HP Service provides a TPM with the spare system board.  
Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security  
rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the  
system compromised and take appropriate measures to ensure the integrity of the system data.  
When using BitLocker™, always retain the recovery key/password. The recovery key/password is  
required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity.  
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HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see the  
encryption technology feature documentation provided by the operating system.  
Installing the Trusted Platform Module board  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
1.  
2.  
Power down the server (on page 22).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).  
Extend the server from the rack (on page 24).  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove the server from the rack, if necessary.  
Place the server on a flat, level work surface.  
Remove the access panel (on page 25).  
Remove fan 5 (on page 26).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).  
Remove the air baffle (on page 28).  
Remove the fan cage (on page 29).  
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures  
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,  
administrators should consider the system compromised and take appropriate measures to ensure  
the integrity of the system data.  
10. Install the TPM board. Press down on the connector to seat the board ("System board components" on  
page 13).  
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11. Install the TPM security rivet by pressing the rivet firmly into the system board.  
12. Install the fan cage.  
13. Install the air baffle.  
14. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery  
15. Install fan 5.  
16. Install the access panel.  
17. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Install the server in the rack.  
18. Power up the server (on page 22, "Powering up and configuring the server" on page 40).  
Retaining the recovery key/password  
The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after  
BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery  
key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system  
integrity.  
To help ensure maximum security, observe the following guidelines when retaining the recovery  
key/password:  
Always store the recovery key/password in multiple locations.  
Always store copies of the recovery key/password away from the server.  
Do not save the recovery key/password on the encrypted hard drive.  
Enabling the Trusted Platform Module  
1.  
2.  
When prompted during the start-up sequence, access RBSU by pressing the F9 key.  
From the Main Menu, select Server Security.  
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3.  
4.  
5.  
6.  
7.  
8.  
From the Server Security Menu, select Trusted Platform Module.  
From the Trusted Platform Module Menu, select TPM Functionality.  
Select Enable, and then press the Enter key to modify the TPM Functionality setting.  
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.  
Reboot the server.  
Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.  
CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail  
to follow the proper procedures for updating the system or option firmware, replacing the system  
board, replacing a hard drive, or modifying OS application TPM settings.  
For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module  
Best Practices White Paper on the HP website (http://www.hp.com/support).  
For more information on adjusting TPM usage in BitLocker™, see the Microsoft website  
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Cabling  
Storage device cabling guidelines  
CAUTION: To prevent damage to the equipment, be sure that the server is powered down, all  
cables are disconnected from the back of the server, and the power cord is disconnected from the  
grounded (earthed) AC outlet before installing devices.  
CAUTION: To prevent damage to electrical components, properly ground the server before  
beginning any installation procedure. Improper grounding can cause electrostatic discharge.  
Data cabling  
Server data cabling  
Item  
Description  
SATA connector  
1
2
SAS connector A  
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Item  
Description  
SAS connector B  
3
4
5
6
DVD-ROM drive  
Hard drive cage 1, SAS connector 2  
Hard drive cage 1, SAS connector 1  
SAS hard drive cabling  
Item  
Description  
Optional SAS controller 1, port 1  
Optional SAS controller 1, port 2  
Optional SAS controller 2, connector 1  
Optional SAS controller 2, connector 2  
SAS connector A  
1
2
3
4
5
SAS connector B  
6
Hard drive cage 3, SAS connector 2  
Hard drive cage 3, SAS connector 1  
Hard drive cage 2, SAS connector 2  
Hard drive cage 2, SAS connector 1  
Hard drive cage 1, SAS connector 2  
Hard drive cage 1, SAS connector 1  
7
8
9
10  
11  
12  
Cabling 104  
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Two-bay LFF drive cage cabling  
Two-bay LFF drive cage cabling to an optional six-bay LFF backplane  
Item  
Description  
Drive cage bay 1 power cable  
Drive cage bay 3 power cable  
SAS cable (connector A)  
SAS cable (connector B)  
LED cable  
1
2
3
4
5
Two-bay LFF drive cage cabling to an optional SAS controller  
Cabling 105  
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Six-bay LFF backplane cabling  
Drive cage bay 1  
Drive cage bay 2  
Cabling 106  
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Eight-bay SFF drive cage cabling  
Drive cage bay 1  
Drive cage bay 2  
Cabling 107  
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Drive cage bay 3  
SAS expander cabling  
The colors are shown for illustration purposes only.  
Item  
Description  
SAS expander card, connectors C and D  
1
Cabling 108  
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Item  
Description  
SAS expander card, connectors E and F  
SAS expander card, connectors G and H  
SAS expander card, connectors A and B  
System board SAS connectors A and B  
Hard drive cage 3  
2
3
4
5
6
7
8
Hard drive cage 2  
Hard drive cage 1  
Media device data cabling  
Item  
Description  
SATA connectors  
Slimline optical drive  
DVD-ROM drive  
1
2
3
4
Half-height media device  
Cabling 109  
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DVD-ROM drive cabling  
Slimline optical drive cabling  
Cabling 110  
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Power cabling  
Server power cabling (basic configuration)  
Item  
Description  
Power supply backplane connector  
24-pin power connector  
Hard drive cage 1  
1
2
3
4
DVD-ROM drive  
Cabling 111  
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Server power cabling (maximum configuration)  
The colors are shown for illustration purposes only.  
Item  
Description  
Video card, slot 6  
1
Video card, slot 8  
2
Power connector  
3
Power supply backplane connector  
24-pin power connector  
Hard drive cage 1  
Hard drive cage 2  
Half-height media device  
DVD-ROM drive  
4
5
6
7
8
9
Slimline optical drive  
P9 power connector  
P12 power connector  
10  
11  
12  
Cabling 112  
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Hard drive cage power cabling  
Item  
Description  
24-pin power connector  
1
2
3
4
5
Power supply backplane connector  
Hard drive bay 1 (must use BP1 power cable)  
Hard drive bay 2 (must use BP2 power cable)  
Hard drive bay 3 (must use BP3 power cable)  
Cabling 113  
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Front panel cabling  
Item  
Description  
Front USB connector  
Front video connector  
Systems Insight Display connector  
Front panel connector  
1
2
3
4
Cabling 114  
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BBWC battery pack and FBWC capacitor pack  
cabling  
Cabling 115  
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Software and configuration utilities  
Configuration tools  
SmartStart software  
SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent  
way to deploy server configuration. SmartStart has been tested on many ProLiant server products, resulting  
in proven, reliable configurations.  
SmartStart assists the deployment process by performing a wide range of configuration activities, including:  
Preparing the system for installing "off-the-shelf" versions of leading operating system software  
Installing optimized server drivers, management agents, and utilities automatically with every assisted  
installation  
Testing server hardware using the Insight Diagnostics Utility ("HP Insight Diagnostics" on page 123)  
Installing software drivers directly from the CD. With systems that have Internet connection, the  
SmartStart Autorun Menu provides access to a complete list of ProLiant system software.  
Enabling access to the Array Configuration Utility (on page 119) and Erase Utility (on page 122)  
SmartStart is included in the HP Insight Foundation suite for ProLiant. For more information about SmartStart  
software, see the HP Insight Foundation suite for ProLiant or the HP website  
SmartStart Scripting Toolkit  
The SmartStart Scripting Toolkit is a server deployment product that allows you to build an unattended  
automated installation for high-volume server deployments. The SmartStart Scripting Toolkit is designed to  
support ProLiant BL, ML, DL, and SL servers. The toolkit includes a modular set of utilities and important  
documentation that describes how to apply these tools to build an automated server deployment process.  
The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are  
used to automate many of the manual steps in the server configuration process. This automated server  
configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server  
deployments.  
For more information, and to download the SmartStart Scripting Toolkit, see the HP website  
HP ROM-Based Setup Utility  
RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration  
activities that can include the following:  
Configuring system devices and installed options  
Enabling and disabling system features  
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Displaying system information  
Selecting the primary boot controller  
Configuring memory options  
Language selection  
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or  
Using RBSU  
To use RBSU, use the following keys:  
To access RBSU, press the F9 key during power-up when prompted.  
To navigate the menu system, use the arrow keys.  
To make selections, press the Enter key.  
To access Help for a highlighted configuration option, press the F1 key.  
IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does  
not prompt you for confirmation of settings before you exit the utility. To change a selected setting,  
you must select a different setting and press the Enter key.  
Default configuration settings are applied to the server at one of the following times:  
Upon the first system power-up  
After defaults have been restored  
Default configuration settings are sufficient for proper typical server operation, but configuration settings can  
be modified using RBSU. The system will prompt you for access to RBSU with each power-up.  
Auto-configuration process  
The auto-configuration process automatically runs when you boot the server for the first time. During the  
power-up sequence, the system ROM automatically configures the entire system without needing any  
intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a  
default setting based on the number of drives connected to the server.  
NOTE: The server may not support all the following examples.  
NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not  
automatically configure the array. You must run ORCA to configure the array settings.  
Drives installed  
Drives used  
1
RAID level  
RAID 0  
RAID 1  
RAID 5  
None  
1
2
2
3, 4, 5, or 6  
0
3, 4, 5, or 6  
More than 6  
To change any ORCA default settings and override the auto-configuration process, press the F8 key when  
prompted.  
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For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or  
Boot options  
Near the end of the boot process, the boot options screen is displayed. This screen is visible for several  
seconds before the system attempts to boot from a supported boot device. During this time, you can do the  
following:  
Access RBSU by pressing the F9 key.  
Access the System Maintenance Menu (which enables you to launch ROM-based Diagnostics or  
Inspect) by pressing the F10 key.  
Access the boot menu by pressing the F11 key.  
Force a PXE Network boot by pressing the F12 key.  
BIOS Serial Console  
BIOS Serial Console allows you to configure the serial port to view POST error messages and run RBSU  
remotely through a serial connection to the server COM port. The server that you are remotely configuring  
does not require a keyboard and mouse.  
For more information about BIOS Serial Console, see the BIOS Serial Console User Guide on the  
Configuring AMP modes  
Not all ProLiant servers support all AMP modes. RBSU provides menu options only for the modes supported  
by the server. Advanced memory protection within RBSU enables the following advanced memory.  
Advanced ECC Mode—Provides memory protection beyond Standard ECC. All single-bit failures and  
some multi-bit failures can be corrected without resulting in system downtime.  
Online Spare Mode—Provides protection against failing or degraded DIMMs. Certain memory is set  
aside as spare, and automatic failover to spare memory occurs when the system detects a degraded  
DIMM. DIMMs that are likely to receive a fatal/uncorrectable memory error are removed from  
operation automatically, resulting in less system downtime.  
See the server-specific user guide for DIMM population requirements.  
Mirrored Memory Mode—Provides protection against uncorrectable memory errors that would  
otherwise result in system failure. In this mode, the system maintains two copies of all data. If an  
uncorrectable memory error occurs, the system automatically retrieves the good data from the mirrored  
copy. The system continues to operate normally without any user intervention. If the system supports  
hot-plug memory, the failed memory can be replaced while the system continues to operate.  
RAID Memory Mode—Provides protection levels similar to Mirrored Memory Mode, and it requires less  
memory allocation than full redundancy.  
Configuring mirrored memory  
To configure mirrored memory:  
1.  
2.  
Install the required DIMMs ("Installing a DIMM" on page 52).  
Access RBSU by pressing the F9 key during power-up when the prompt is displayed.  
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3.  
4.  
5.  
6.  
7.  
Select System Options.  
Select Advanced Memory Protection.  
Select Mirrored Memory with Advanced ECC Support.  
Press the Enter key.  
Press the Esc key to exit the current menu or press the F10 key to exit RBSU.  
For more information on mirrored memory, see the white paper on the HP website  
Configuring Advanced ECC memory  
To configure Advanced ECC memory:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
Install the required DIMMs ("Installing a DIMM" on page 52).  
When the prompt appears, access RBSU by pressing the F9 key during power-up.  
Select System Options.  
Select Advanced Memory Protection.  
Select Advanced ECC Memory.  
Press the Enter key.  
Press the Esc key to exit the current menu or press the F10 key to exit RBSU.  
For more information on Advanced ECC, see the HP website  
Configuring lockstep memory  
To configure Lockstep memory:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
Install the required DIMMs ("Installing a DIMM" on page 52).  
Access RBSU by pressing the F9 key during power-up when the prompt is displayed.  
Select System Options.  
Select Advanced Memory Protection.  
Select Lockstep with Advanced ECC Support.  
Press the Enter key.  
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.  
For more information on Lockstep memory, see the white paper on the HP website  
Array Configuration Utility  
ACU is a browser-based utility with the following features:  
Runs as a local application or remote service  
Supports online array capacity expansion, logical drive extension, assignment of online spares, and  
RAID or stripe size migration  
Suggests the optimum configuration for an unconfigured system  
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Provides different operating modes, enabling faster configuration or greater control over the  
configuration options  
Remains available any time that the server is on  
Displays on-screen tips for individual steps of a configuration procedure  
Beginning with ACU version 8.28.13.0, provides diagnostic functionality on the Diagnostics tab  
(formerly known as Array Diagnostics Utility).  
For optimum performance, the minimum display settings are 1024 × 768 resolution and 16-bit color. Servers  
running Microsoft® operating systems require one of the following supported browsers:  
Internet Explorer 6.0 or later  
Mozilla Firefox 2.0 or later  
For Linux servers, see the README.TXT file for additional browser and support information.  
For more information, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the  
Documentation CD or the HP website (http://www.hp.com).  
Option ROM Configuration for Arrays  
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign  
RAID levels, and establish online spare configurations.  
The utility also provides support for the following functions:  
Reconfiguring one or more logical drives  
Viewing the current logical drive configuration  
Deleting a logical drive configuration  
Setting the controller to be the boot controller  
If you do not use the utility, ORCA will default to the standard configuration.  
For more information regarding array controller configuration, refer to the controller user guide.  
For more information regarding the default configurations that ORCA uses, refer to the HP ROM-Based Setup  
Utility User Guide on the Documentation CD.  
Re-entering the server serial number and product ID  
After you replace the system board, you must re-enter the server serial number and the product ID.  
1.  
2.  
3.  
4.  
During the server startup sequence, press the F9 key to access RBSU.  
Select the Advanced Options menu.  
Select Service Options.  
Select Serial Number. The following warnings appear:  
WARNING! WARNING! WARNING! The serial number is loaded into the system during  
the manufacturing process and should NOT be modified. This option should only  
be used by qualified service personnel. This value should always match the  
serial number sticker located on the chassis.  
Warning: The serial number should ONLY be modified by qualified personnel.  
This value should always match the serial number located on the chassis.  
5.  
Press the Enter key to clear the warning.  
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6.  
7.  
Enter the serial number and press the Enter key.  
Select Product ID. The following warning appears:  
Warning: The Product ID should ONLY be modified by qualified personnel. This  
value should always match the Product ID on the chassis.  
8.  
9.  
Enter the product ID and press the Enter key.  
Press the Esc key to close the menu.  
10. Press the Esc key to exit RBSU.  
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.  
Management tools  
Automatic Server Recovery  
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as  
a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management  
driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the  
system periodically resets the timer. However, when the operating system fails, the timer expires and restarts  
the server.  
ASR increases server availability by restarting the server within a specified time after a system hang or  
shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated pager  
number that ASR has restarted the system. You can disable ASR from the HP SIM console or through RBSU.  
ROMPaq utility  
The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert a  
ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online Flash  
Components for Windows and Linux operating systems are available for updating the system firmware.  
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available firmware  
revisions.  
For more information, see the Download drivers and software page for the server. To access the  
server-specific page, enter the following web address into the browser:  
http://www.hp.com/support/<servername>  
For example:  
http://www.hp.com/support/dl360g6  
Integrated Lights-Out 2 technology  
The iLO 2 subsystem is a standard component of selected ProLiant servers that provides server health and  
remote server manageability. The iLO 2 subsystem includes an intelligent microprocessor, secure memory,  
and a dedicated network interface. This design makes iLO 2 independent of the host server and its operating  
system.  
In addition to remote management features, iLO 2 is also responsible for managing the health of the ProLiant  
server. The intelligence of iLO 2 manages the Sea of Sensors thermal control, directs the Dynamic Power  
Capping technology, and monitors the health of server components.  
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The iLO 2 subsystem provides secure remote access from any authorized network client. The enhancements  
to iLO 2 enable customers to get work done faster by providing turbo-charged remote access performance,  
a streamlined user experience, and enhanced standards support.  
Using iLO 2, you can do the following:  
Access a high-performance and secure Remote Console to the server from anywhere in the world.  
Use the shared iLO 2 Remote Console to collaborate with up to six server administrators.  
Remotely mount high-performance Virtual Media devices to the server.  
Securely and remotely control the power state of the managed server.  
Send alerts from iLO 2 regardless of the state of the host server.  
Access advanced troubleshooting features through the iLO 2 interface.  
For more information about iLO 2 features (which may require an iLO Advanced Pack or iLO Advanced for  
BladeSystem license), see the iLO 2 documentation on the Documentation CD or on the HP website  
Erase Utility  
CAUTION: Perform a backup before running the System Erase Utility. The utility sets the system  
to its original factory state, deletes the current hardware configuration information, including  
array setup and disk partitioning, and erases all connected hard drives completely. Refer to the  
instructions for using this utility.  
Run the Erase Utility if you must erase the system for the following reasons:  
You want to install a new operating system on a server with an existing operating system.  
You encounter an error when completing the steps of a factory-installed operating system installation.  
To access the Erase Utility, use the System Erase button on the home screen of the SmartStart CD ("SmartStart  
Redundant ROM support  
The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server has  
a single ROM that acts as two separate ROM images. In the standard implementation, one side of the ROM  
contains the current ROM program version, while the other side of the ROM contains a backup version.  
NOTE: The server ships with the same version programmed on each side of the ROM.  
Safety and security benefits  
When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a  
backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for  
any reason. This feature protects the existing ROM version, even if you experience a power failure while  
flashing the ROM.  
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USB support  
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by  
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB  
devices through legacy USB support, which is enabled by default in the system ROM.  
Legacy USB support provides USB functionality in environments where USB support is not available normally.  
Specifically, HP provides legacy USB functionality for the following:  
POST  
RBSU  
Diagnostics  
DOS  
Operating environments which do not provide native USB support  
Diagnostic tools  
HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,  
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server  
installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS  
is not running. To run this utility, launch the SmartStart CD.  
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and  
other related data needed for effective server management. Available in Microsoft® Windows® and Linux  
versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).  
HP Insight Diagnostics survey functionality  
HP Insight Diagnostics (on page 123) provides survey functionality that gathers critical hardware and  
software information on ProLiant servers.  
This functionality supports operating systems that may not be supported by the server. For operating systems  
supported by the server, see the HP website (http://www.hp.com/go/supportos).  
If a significant change occurs between data-gathering intervals, the survey function marks the previous  
information and overwrites the survey data files to reflect the latest changes in the configuration.  
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be  
installed through the HP PSP ("ProLiant Support Packs" on page 125).  
NOTE: The current version of SmartStart provides the memory spare part numbers for the server.  
To download the latest version, see the HP website (http://www.hp.com/support).  
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Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event  
with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within HP SIM  
From within Survey Utility  
From within operating system-specific IML viewers  
o
o
o
For NetWare: IML Viewer  
For Windows®: IML Viewer  
For Linux: IML Viewer Application  
From within the iLO 2 user interface  
From within HP Insight Diagnostics (on page 123)  
For more information, see the Management CD in the HP Insight Foundation suite for ProLiant.  
Remote support and analysis tools  
HP Insight Remote Support software  
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or  
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or  
HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure  
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of  
hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s  
service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if  
configured and available in your country. The software is available in two variants:  
HP Insight Remote Support Standard: This software supports server and storage devices and is  
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive  
notification but do not need proactive service delivery and integration with a management platform.  
HP Insight Remote Support Advanced: This software provides comprehensive remote monitoring and  
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus  
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight  
Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight  
Remote Support Advanced.  
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).  
To download the software, go to Software Depot (http://www.software.hp.com).  
Select Insight Remote Support from the menu on the right.  
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Keeping the system current  
Drivers  
IMPORTANT: Always perform a backup before installing or updating device drivers.  
The server includes new hardware that may not have driver support on all OS installation media.  
If you are installing a SmartStart-supported OS, use the SmartStart software (on page 116) and its Assisted  
Path feature to install the OS and latest driver support.  
If you are installing drivers from the SmartStart CD, be sure that you are using the latest SmartStart version  
that your server supports. To verify that your server is using the latest supported version, see the HP website  
(http://www.hp.com/support). For more information, see the documentation provided with the SmartStart  
CD.  
If you do not use the SmartStart CD to install an OS, drivers for some of the new hardware are required.  
These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded  
To directly locate the OS drivers for a particular server, enter the following web address into the browser:  
http://www.hp.com/support/<servername>  
In place of <servername>, enter the server name.  
For example:  
http://www.hp.com/support/dl360g6 (http://www.hp.com/support/dl360g6)  
Version control  
The VCRM and VCA are Web-enabled Insight Management Agents tools that HP SIM uses to facilitate and  
schedule software update tasks to the entire enterprise.  
VCRM manages the repository for Windows and Linux PSPs as well as online firmware. Administrators  
can browse a graphical view of the PSPs or configure VCRM to automatically update the repository with  
Internet downloads of the latest software from HP.  
VCA compares installed software versions and available updates. Administrators can configure VCA to  
point to a repository managed by VCRM.  
For more information about version control tools, see the HP Systems Insight Manager Help Guide and the  
Version Control User Guide on the HP Systems Insight Manager website (http://www.hp.com/go/hpsim).  
ProLiant Support Packs  
PSPs represent operating system-specific bundles of ProLiant optimized drivers, utilities, and management  
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Operating System Version Support  
For information about specific versions of a supported operating system, refer to the operating system  
Firmware  
The Smart Update Firmware DVD is an organized firmware collection for ProLiant servers and options  
powered by HP Smart Update Manager (on page 126). The Smart Update Firmware DVD combines the  
following resources on a single DVD:  
Firmware Maintenance CD  
HP BladeSystem Firmware Deployment Tool (FDT)  
The HP BladeSystem online firmware bundles  
The ProLiant BladeSystem Release Sets  
Offline, automatic mode for HP ProLiant BL, DL, ML, and 100 Series servers  
Firmware deployment support for HP ProLiant 100 Series servers  
HP Smart Update Manager  
The HP Smart Update Manager provides intelligent and flexible firmware and software deployment. This  
technology assists in reducing the complexity of provisioning and updating HP ProLiant Servers, options, and  
Blades within the datacenter. HP SUM is delivered on The Smart Update Firmware DVD, ProLiant Support  
Packs, and Easy Set-up CDs.  
HP SUM enables system administrators to upgrade ROM images efficiently across a wide range of servers  
and options. This tool has the following features:  
Enables GUI and a command-line, scriptable interface  
Enables scriptable, command-line deployment  
Requires no agent for remote installations  
Enables dependency checking, which ensures appropriate install order and dependency checking  
between components  
Deploys software and firmware on Windows and Linux operating systems  
Performs local or remote (one-to-many) online deployment  
Deploys firmware and software together  
Supports offline and online deployment  
Deploys necessary component updates only (except Linux RPMs)  
Downloads the latest components from Web (except Linux RPMs)  
Enables direct update of BMC firmware (iLO and LO100i)  
For more information about HP Smart Update Manager and to access the HP Smart Update Manager User  
Guide, see the HP website (http://www.hp.com/go/foundation).  
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Change control and proactive notification  
HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of  
upcoming hardware and software changes on HP commercial products.  
For more information, refer to the HP website (http://www.hp.com/go/pcn).  
Care Pack  
HP Care Pack Services offer upgraded service levels to extend and expand bundled services with  
easy-to-buy, easy-to-use support packages that help you make the most of your server investments. For more  
information, see the HP website (http://www.hp.com/services/carepack).  
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Troubleshooting  
Troubleshooting resources  
The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and  
comprehensive courses of action for fault isolation and identification, error message interpretation, issue  
resolution, and software maintenance on ProLiant servers and server blades. This guide includes  
problem-specific flowcharts to help you navigate complex troubleshooting processes. To view the guide,  
select a language:  
Pre-diagnostic steps  
WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary  
information in the server documentation before removing, replacing, reseating, or modifying  
system components.  
IMPORTANT: This guide provides information for multiple servers. Some information may not  
apply to the server you are troubleshooting. Refer to the server documentation for information on  
procedures, hardware options, software tools, and operating systems supported by the server.  
1.  
2.  
3.  
4.  
Review the important safety information (on page 128).  
Gather symptom information (on page 130).  
Prepare the server for diagnosis (on page 130).  
Use the Start diagnosis flowchart (on page 133) to begin the diagnostic process.  
Important safety information  
Familiarize yourself with the safety information in the following sections before troubleshooting the server.  
Important safety information  
Before servicing this product, read the Important Safety Information document provided with the server.  
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Symbols on equipment  
The following symbols may be placed on equipment to indicate the presence of potentially hazardous  
conditions.  
This symbol indicates the presence of hazardous energy circuits or electric shock  
hazards. Refer all servicing to qualified personnel.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.  
This symbol indicates the presence of electric shock hazards. The area contains no user  
or field serviceable parts. Do not open for any reason.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure.  
This symbol on an RJ-45 receptacle indicates a network interface connection.  
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do  
not plug telephone or telecommunications connectors into this receptacle.  
This symbol indicates the presence of a hot surface or hot component. If this surface is  
contacted, the potential for injury exists.  
WARNING: To reduce the risk of injury from a hot component, allow the surface to cool  
before touching.  
This symbol indicates that the component exceeds the recommended weight for one  
individual to handle safely.  
WARNING: To reduce the risk of personal injury or damage to the equipment, observe  
local occupational health and safety requirements and guidelines for manual material  
handling.  
49-109 kg  
100-240 lb  
These symbols, on power supplies or systems, indicate that the equipment is supplied  
by multiple sources of power.  
WARNING: To reduce the risk of injury from electric shock, remove all power cords to  
completely disconnect power from the system.  
Warnings and cautions  
WARNING: Only authorized technicians trained by HP should attempt to repair this equipment.  
All troubleshooting and repair procedures are detailed to allow only subassembly/module-level  
repair. Because of the complexity of the individual boards and subassemblies, no one should  
attempt to make repairs at the component level or to make modifications to any printed wiring  
board. Improper repairs can create a safety hazard.  
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:  
The leveling feet are extended to the floor.  
The full weight of the rack rests on the leveling feet.  
The stabilizing feet are attached to the rack if it is a single-rack installation.  
The racks are coupled together in multiple-rack installations.  
Only one component is extended at a time. A rack may become unstable if more than one  
component is extended for any reason.  
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WARNING: To reduce the risk of electric shock or damage to the equipment:  
Do not disable the power cord grounding plug. The grounding plug is an important safety  
feature.  
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all  
times.  
Unplug the power cord from the power supply to disconnect power to the equipment.  
Do not route the power cord where it can be walked on or pinched by items placed against it.  
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from  
the server.  
WARNING: To reduce the risk of personal injury or damage to the equipment:  
Observe local occupation health and safety requirements and guidelines for manual  
49-109 kg  
100-240 lb  
handling.  
Obtain adequate assistance to lift and stabilize the chassis during installation or  
removal.  
The server is unstable when not fastened to the rails.  
When mounting the server in a rack, remove the power supplies and any other  
removable module to reduce the overall weight of the product.  
CAUTION: To properly ventilate the system, you must provide at least 7.6 cm (3.0 in) of  
clearance at the front and back of the server.  
CAUTION: The server is designed to be electrically grounded (earthed). To ensure proper  
operation, plug the AC power cord into a properly grounded AC outlet only.  
Symptom information  
Before troubleshooting a server problem, collect the following information:  
What events preceded the failure? After which steps does the problem occur?  
What has been changed since the time the server was working?  
Did you recently add or remove hardware or software? If so, did you remember to change the  
appropriate settings in the server setup utility, if necessary?  
How long has the server exhibited problem symptoms?  
If the problem occurs randomly, what is the duration or frequency?  
To answer these questions, the following information may be useful:  
Run HP Insight Diagnostics (on page 123) and use the survey page to view the current configuration or  
to compare it to previous configurations.  
Refer to your hardware and software records for information.  
Refer to server LEDs and their statuses.  
Prepare the server for diagnosis  
1.  
Be sure the server is in the proper operating environment with adequate power, air conditioning, and  
humidity control. For required environmental conditions, see the server documentation.  
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2.  
3.  
4.  
Record any error messages displayed by the system.  
Remove all diskettes, CD-ROMs, DVD-ROMs, and USB drive keys.  
Power down the server and peripheral devices if you will be diagnosing the server offline. If possible,  
always perform an orderly shutdown:  
a. Exit any applications.  
b. Exit the operating system.  
c. Power down the server (on page 22).  
5.  
6.  
Disconnect any peripheral devices not required for testing (any devices not necessary to power up the  
server). Do not disconnect the printer if you want to use it to print error messages.  
Collect all tools and utilities, such as a Torx screwdriver, loopback adapters, ESD wrist strap, and  
software utilities, necessary to troubleshoot the problem.  
o
You must have the appropriate Health Drivers and Management Agents installed on the server.  
To verify the server configuration, connect to the System Management homepage and select Version  
Control Agent. The VCA gives you a list of names and versions of all installed HP drivers,  
Management Agents, and utilities, and whether they are up-to-date.  
o
o
HP recommends you have access to the server documentation for server-specific information.  
HP recommends you have access to the SmartStart CD for value-added software and drivers  
required during the troubleshooting process. Download the current version of SmartStart from the  
Performing processor procedures in the troubleshooting process  
Before performing any troubleshooting steps that involve processors, review the following guidelines:  
Be sure that only authorized personnel perform the troubleshooting steps that involve installing,  
removing, or replacing a processor.  
Always locate the documentation for your processor model before performing any steps that require  
installing, removing, or replacing a processor. If you cannot locate the hard copy of the instructions that  
shipped with the processor, see the processor instructions in this document.  
Some processor models require the use of a processor installation tool, and specific steps are  
documented to ensure that you do not damage the processor or processor socket on the system board.  
For server models that have pins inside the processor socket, remember that THE PINS ON THE SYSTEM  
BOARD ARE VERY FRAGILE AND EASILY DAMAGED. If you damage the socket, you must replace the  
system board.  
Depending on the server model, the contacts may be on the processor or they may be inside the  
processor socket. Never touch the contacts. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND  
EASILY DAMAGED. If the contacts inside the processor socket are damaged, the system board must be  
replaced.  
Always complete all other troubleshooting procedures before removing or replacing a processor.  
Breaking the server down to the minimum hardware configuration  
During the troubleshooting process, you may be asked to break the server down to the minimum hardware  
configuration. A minimum configuration consists of only the components needed to boot the server and  
successfully pass POST.  
Troubleshooting 131  
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When requested to break the server down to the minimum configuration, uninstall the following components,  
if installed:  
All additional DIMMs  
Leave only the minimum required to boot the server—either one DIMM or a pair of DIMMs. For more  
information, see the memory guidelines in the server user guide.  
All additional cooling fans, if applicable  
For the minimum fan configuration, see the server user guide.  
All additional power supplies, if applicable (leave one installed)  
All hard drives  
All optical drives (DVD-ROM, CD-ROM, and so forth)  
All optional mezzanine cards  
All expansion boards  
Before removing the components, be sure to determine the minimum configuration for each component and  
follow all guidelines in the server user guide.  
Always use the recommended minimum configuration above before removing any processors. If you are  
unable to isolate the issue with the configuration above, you will then remove all but one of the additional  
processors.  
CAUTION: Before removing or replacing any processors, be sure to follow the guidelines  
provided in "Performing processor procedures in the troubleshooting process (on page 131)."  
Failure to follow the recommended guidelines can cause damage to the system board, requiring  
replacement of the system board.  
Loose connections  
Action:  
Be sure all power cords are securely connected.  
Be sure all cables are properly aligned and securely connected for all external and internal  
components.  
Remove and check all data and power cables for damage. Be sure no cables have bent pins or  
damaged connectors.  
If a fixed cable tray is available for the server, be sure the cords and cables connected to the server are  
routed correctly through the tray.  
Be sure each device is properly seated. Avoid bending or flexing circuit boards when reseating  
components.  
If a device has latches, be sure they are completely closed and locked.  
Check any interlock or interconnect LEDs that may indicate a component is not connected properly.  
If problems continue to occur, remove and reinstall each device, checking the connectors and sockets  
for bent pins or other damage.  
Troubleshooting 132  
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Service notifications  
To view the latest service notifications, refer to the HP website (http://www.hp.com/go/bizsupport). Select  
the appropriate server model, and then click the Troubleshoot a Problem link on the product page.  
Server health LEDs  
Some servers have an internal health LED and an external health LED, while other servers have a single  
system health LED. The system health LED provides the same functionality as the two separate internal and  
external health LEDs. Depending on the model, the internal health LED and external health LED may either  
appear solid or they may flash. Both conditions represent the same symptom.  
For the location of server LEDs and information on their statuses, see the server documentation on the HP  
Troubleshooting flowcharts  
To effectively troubleshoot a problem, HP recommends that you start with the first flowchart in this section,  
"Start diagnosis flowchart (on page 133)," and follow the appropriate diagnostic path. If the other  
flowcharts do not provide a troubleshooting solution, follow the diagnostic steps in "General diagnosis  
flowchart (on page 134)." The General diagnosis flowchart is a generic troubleshooting process to be used  
when the problem is not server-specific or is not easily categorized into the other flowcharts.  
The available flowcharts include:  
Start diagnosis flowchart (on page 133)  
General diagnosis flowchart (on page 134)  
Server power-on problems flowchart (on page 136)  
POST problems flowchart (on page 139)  
OS boot problems flowchart (on page 141)  
Server fault indications flowchart (on page 142)  
Start diagnosis flowchart  
Use the following flowchart to start the diagnostic process.  
Item  
See  
"General diagnosis flowchart (on page 134)"  
1
"Power-on problems flowchart ("Server power-on problems flowchart" on  
2
"POST problems flowchart (on page 139)"  
"OS boot problems flowchart (on page 141)"  
"Server fault indications flowchart (on page 142)"  
3
4
5
Troubleshooting 133  
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General diagnosis flowchart  
The General diagnosis flowchart provides a generic approach to troubleshooting. If you are unsure of the  
problem, or if the other flowcharts do not fix the problem, use the following flowchart.  
Item  
See  
"Symptom information (on page 130)"  
"Loose connections (on page 132)"  
1
2
"Service notifications (on page 133)"  
3
4
The most recent version of a particular server or option firmware is  
available on the HP Support website (http://www.hp.com/support).  
Troubleshooting 134  
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Item  
See  
"General memory problems are occurring" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
5
Server maintenance and service guide, located on the Documentation CD  
6
7
"Hardware problems" in the HP ProLiant Servers Troubleshooting  
Guide located on the Documentation CD or see "Troubleshooting  
resources (on page 128)"  
Server maintenance and service guide, located on the Documentation  
CD or the HP website  
"Breaking the server down to the minimum hardware configuration (on  
page 131)" or in the HP ProLiant Servers Troubleshooting Guide located on  
the Documentation CD or see "Troubleshooting resources (on page 128)"  
8
9
"Server information you need" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
"Operating system information you need" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
"HP contact information (on page 158)"  
10  
Troubleshooting 135  
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Server power-on problems flowchart  
Symptoms:  
The server does not power on.  
The system power LED is off or amber.  
Troubleshooting 136  
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The external health LED is red or amber.  
The internal health LED is red or amber.  
NOTE: For the location of server LEDs and information on their statuses, refer to the server  
documentation.  
Possible causes:  
Improperly seated or faulty power supply  
Loose or faulty power cord  
Power source problem  
Power on circuit problem  
Improperly seated component or interlock problem  
Faulty internal component  
See  
Item  
"Server health LEDs (on page 133)" and "Component identification (on  
page 7)"  
1
"HP Insight Diagnostics (on page 123)" or in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
2
"Loose connections (on page 132)"  
3
4
Server maintenance and service guide, located on the Documentation CD,  
"Integrated Management Log (on page 124)" or in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
5
6
7
"Power source problems" in the HP ProLiant Servers Troubleshooting Guide  
located on the Documentation CD or see "Troubleshooting resources (on  
"Power supply problems" in the HP ProLiant Servers Troubleshooting  
Guide located on the Documentation CD or see "Troubleshooting  
resources (on page 128)"  
Server maintenance and service guide, located on the Documentation  
CD, or the HP website  
"System open circuits and short circuits" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
8
Troubleshooting 137  
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POST problems flowchart  
Symptoms:  
Server does not complete POST  
NOTE: The server has completed POST when the system attempts to access the boot device.  
Server completes POST with errors  
Possible problems:  
Improperly seated or faulty internal component  
Faulty KVM device  
Faulty video device  
See  
Item  
"Video problems" in the HP ProLiant Servers Troubleshooting Guide  
located on the Documentation CD or see "Troubleshooting resources (on  
1
KVM or iLO 2 documentation  
2
3
4
5
"POST error messages and beep codes (on page 144)"  
"Symptom information (on page 130)"  
"Port 85 and iLO messages" in the HP ProLiant Servers Troubleshooting  
Guide located on the Documentation CD or see "Troubleshooting resources  
(on page 128)"  
"Server health LEDs (on page 133)" and "Component identification (on  
page 7)"  
6
"Loose connections (on page 132)"  
7
8
"General memory problems are occurring" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
Server maintenance and service guide, located on the Documentation CD  
9
"Breaking the server down to the minimum hardware configuration (on  
page 131)" or in the HP ProLiant Servers Troubleshooting Guide located on  
the Documentation CD or see "Troubleshooting resources (on page 128)"  
10  
11  
12  
"Hardware problems" in the HP ProLiant Servers Troubleshooting  
Guide located on the Documentation CD or see "Troubleshooting  
resources (on page 128)"  
Server maintenance and service guide, located on the Documentation  
CD or the HP website  
"HP contact information (on page 158)"  
Troubleshooting 139  
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Item  
See  
13  
"Server information you need" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
"Operating system information you need" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
Troubleshooting 140  
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OS boot problems flowchart  
Symptoms:  
Server does not boot a previously installed operating system  
Server does not boot SmartStart  
Possible causes:  
Corrupted operating system  
Hard drive subsystem problem  
Incorrect boot order setting in RBSU  
See  
Item  
HP ROM-Based Setup Utility User Guide  
1
"POST problems flowchart (on page 139)"  
2
3
"Hard drive problems" in the HP ProLiant Servers Troubleshooting  
Guide located on the Documentation CD or see "Troubleshooting  
resources (on page 128)"  
Controller documentation  
"HP Insight Diagnostics (on page 123)" or in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
4
5
"CD-ROM and DVD drive problems" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
Controller documentation  
"Loose connections (on page 132)"  
"General memory problems are occurring" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
6
7
"Operating system problems" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
"HP contact information (on page 158)"  
"Breaking the server down to the minimum hardware configuration (on  
page 131)" in the HP ProLiant Servers Troubleshooting Guide located on  
the Documentation CD or see "Troubleshooting resources (on page 128)"  
8
9
"Hardware problems" in the HP ProLiant Servers Troubleshooting  
Guide located on the Documentation CD or see "Troubleshooting  
resources (on page 128)"  
Server maintenance and service guide, located on the Documentation  
CD or the HP website  
"General diagnosis flowchart (on page 134)"  
10  
Troubleshooting 141  
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Server fault indications flowchart  
Symptoms:  
Server boots, but a fault event is reported by Insight Management Agents  
Server boots, but the internal health LED, external health LED, or component health LED is red or amber  
NOTE: For the location of server LEDs and information on their statuses, refer to the server  
documentation.  
Troubleshooting 142  
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Possible causes:  
Improperly seated or faulty internal or external component  
Unsupported component installed  
Redundancy failure  
System overtemperature condition  
See  
Item  
1
"Integrated Management Log (on page 124)" or in the HP ProLiant  
Servers Troubleshooting Guide located on the Documentation CD or  
see "Troubleshooting resources (on page 128)"  
"Event list error messages" in the HP ProLiant Servers Troubleshooting  
Guide located on the Documentation CD or see "Troubleshooting  
resources (on page 128)"  
"Component identification (on page 7)"  
2
3
4
5
"Server health LEDs (on page 133)"  
System Management Homepage (https://localhost:2381)  
"Power-on problems flowchart ("Server power-on problems flowchart" on  
"HP Insight Diagnostics (on page 123)" or in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
6
7
"Hardware problems" in the HP ProLiant Servers Troubleshooting  
Guide located on the Documentation CD or see "Troubleshooting  
resources (on page 128)"  
Server maintenance and service guide, located on the Documentation  
CD or the HP website  
8
"Smart Array SCSI Diagnosis feature" or in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or see  
"Troubleshooting resources (on page 128)"  
Server maintenance and service guide, located on the Documentation  
CD or the HP website  
"HP contact information (on page 158)"  
Troubleshooting 143  
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POST error messages and beep codes  
For a complete listing of error messages, refer to the "POST error messages" in the HP ProLiant Servers  
Troubleshooting Guide located on the Documentation CD or on the HP website  
Troubleshooting 144  
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WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary  
information in the server documentation before removing, replacing, reseating, or modifying  
system components.  
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Battery replacement  
If the server no longer automatically displays the correct date and time, you may need to replace the battery  
that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare designated for this product.  
To remove the component:  
1.  
2.  
3.  
4.  
Power down the server (on page 22).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 24).  
Remove the access panel (on page 25).  
Remove the PCI riser cage.  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the expansion boards.  
5.  
Remove the battery.  
IMPORTANT: Replacing the system board battery resets the system ROM to its default  
configuration. After replacing the battery, reconfigure the system through RBSU.  
To replace the component, reverse the removal procedure.  
Battery replacement 146  
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For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
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Regulatory compliance notices  
Regulatory compliance identification numbers  
For the purpose of regulatory compliance certifications and identification, this product has been assigned a  
unique regulatory model number. The regulatory model number can be found on the product nameplate  
label, along with all required approval markings and information. When requesting compliance information  
for this product, always refer to this regulatory model number. The regulatory model number is not the  
marketing name or model number of the product.  
Federal Communications Commission notice  
Part 15 of the Federal Communications Commission (FCC) Rules and Regulations has established Radio  
Frequency (RF) emission limits to provide an interference-free radio frequency spectrum. Many electronic  
devices, including computers, generate RF energy incidental to their intended function and are, therefore,  
covered by these rules. These rules place computers and related peripheral devices into two classes, A and  
B, depending upon their intended installation. Class A devices are those that may reasonably be expected  
to be installed in a business or commercial environment. Class B devices are those that may reasonably be  
expected to be installed in a residential environment (for example, personal computers). The FCC requires  
devices in both classes to bear a label indicating the interference potential of the device as well as additional  
operating instructions for the user.  
FCC rating label  
The FCC rating label on the device shows the classification (A or B) of the equipment. Class B devices have  
an FCC logo or ID on the label. Class A devices do not have an FCC logo or ID on the label. After you  
determine the class of the device, refer to the corresponding statement.  
Class A equipment  
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to  
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful  
interference when the equipment is operated in a commercial environment. This equipment generates, uses,  
and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,  
may cause harmful interference to radio communications. Operation of this equipment in a residential area  
is likely to cause harmful interference, in which case the user will be required to correct the interference at  
personal expense.  
Class B equipment  
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to  
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful  
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency  
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to  
Regulatory compliance notices 148  
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radio communications. However, there is no guarantee that interference will not occur in a particular  
installation. If this equipment does cause harmful interference to radio or television reception, which can be  
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by  
one or more of the following measures:  
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and receiver.  
Connect the equipment into an outlet on a circuit that is different from that to which the receiver is  
connected.  
Consult the dealer or an experienced radio or television technician for help.  
Declaration of conformity for products marked with  
the FCC logo, United States only  
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)  
this device may not cause harmful interference, and (2) this device must accept any interference received,  
including interference that may cause undesired operation.  
For questions regarding this product, contact us by mail or telephone:  
Hewlett-Packard Company  
P. O. Box 692000, Mail Stop 530113  
Houston, Texas 77269-2000  
1-800-HP-INVENT (1-800-474-6836). (For continuous quality improvement, calls may be recorded or  
monitored.)  
For questions regarding this FCC declaration, contact us by mail or telephone:  
Hewlett-Packard Company  
P. O. Box 692000, Mail Stop 510101  
Houston, Texas 77269-2000  
1-281-514-3333  
To identify this product, refer to the part, series, or model number found on the product.  
Modifications  
The FCC requires the user to be notified that any changes or modifications made to this device that are not  
expressly approved by Hewlett-Packard Company may void the user’s authority to operate the equipment.  
Cables  
Connections to this device must be made with shielded cables with metallic RFI/EMI connector hoods in  
order to maintain compliance with FCC Rules and Regulations.  
Canadian notice (Avis Canadien)  
Class A equipment  
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This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment  
Regulations.  
Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur  
du Canada.  
Class B equipment  
This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment  
Regulations.  
Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur  
du Canada.  
European Union regulatory notice  
Products bearing the CE marking comply with the following EU Directives:  
Low Voltage Directive 2006/95/EC  
EMC Directive 2004/108/EC  
Ecodesign Directive 2009/125/EC, where applicable  
CE compliance of this product is valid if powered with the correct CE-marked AC adapter provided by HP.  
Compliance with these directives implies conformity to applicable harmonized European standards  
(European Norms) that are listed in the EU Declaration of Conformity issued by HP for this product or product  
family and available (in English only) either within the product documentation or at the following HP website  
(http://www.hp.eu/certificates) (type the product number in the search field).  
The compliance is indicated by one of the following conformity markings placed on the product:  
For non-telecommunications products and for EU harmonized telecommunications products, such as  
Bluetooth® within power class below 10mW.  
For EU non-harmonized telecommunications products (If applicable, a 4-digit notified body number is  
inserted between CE and !).  
Please refer to the regulatory label provided on the product.  
The point of contact for regulatory matters is Hewlett-Packard GmbH, Dept./MS: HQ-TRE, Herrenberger  
Strasse 140, 71034 Boeblingen, GERMANY.  
Disposal of waste equipment by users in private  
households in the European Union  
Regulatory compliance notices 150  
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This symbol on the product or on its packaging indicates that this product must not be disposed of  
with your other household waste. Instead, it is your responsibility to dispose of your waste  
equipment by handing it over to a designated collection point for the recycling of waste electrical  
and electronic equipment. The separate collection and recycling of your waste equipment at the  
time of disposal will help to conserve natural resources and ensure that it is recycled in a manner  
that protects human health and the environment. For more information about where you can drop  
off your waste equipment for recycling, please contact your local city office, your household  
waste disposal service or the shop where you purchased the product.  
Japanese notice  
BSMI notice  
Korean notice  
Class A equipment  
Regulatory compliance notices 151  
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Class B equipment  
Chinese notice  
Class A equipment  
Vietnam compliance marking notice  
This marking is for applicable products only.  
Laser compliance  
This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic  
transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance  
with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.  
Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser  
Notice No. 50, dated June 24, 2007; and with IEC 60825-1:2007.  
WARNING: Use of controls or adjustments or performance of procedures other than those  
specified herein or in the laser product's installation guide may result in hazardous radiation  
exposure. To reduce the risk of exposure to hazardous radiation:  
Do not try to open the module enclosure. There are no user-serviceable components inside.  
Do not operate controls, make adjustments, or perform procedures to the laser device other  
than those specified herein.  
Allow only HP Authorized Service technicians to repair the unit.  
The Center for Devices and Radiological Health (CDRH) of the U.S. Food and Drug Administration  
implemented regulations for laser products on August 2, 1976. These regulations apply to laser products  
manufactured from August 1, 1976. Compliance is mandatory for products marketed in the United States.  
Battery replacement notice  
Regulatory compliance notices 152  
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WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Batteries, battery packs, and accumulators should not be disposed of together with the general  
household waste. To forward them to recycling or proper disposal, use the public collection system or  
return them to HP, an authorized HP Partner, or their agents.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
Taiwan battery recycling notice  
The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of the  
Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or promotion.  
Contact a qualified Taiwanese recycler for proper battery disposal.  
Power cord statement for Japan  
Acoustics statement for Germany (Geräuschemission)  
Schalldruckpegel LpA < 70 dB(A)  
Zuschauerpositionen (bystander positions), Normaler Betrieb (normal operation)  
Nach ISO 7779:1999 (Typprüfung)  
Regulatory compliance notices 153  
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Electrostatic discharge  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system  
or handling parts. A discharge of static electricity from a finger or other conductor may damage system  
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.  
To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Grounding methods to prevent electrostatic discharge  
Several methods are used for grounding. Use one or more of the following methods when handling or  
installing electrostatic-sensitive parts:  
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist  
straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To  
provide proper ground, wear the strap snug against the skin.  
Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when  
standing on conductive floors or dissipating floor mats.  
Use conductive field service tools.  
Use a portable field service kit with a folding static-dissipating work mat.  
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install  
the part.  
For more information on static electricity or assistance with product installation, contact an authorized  
reseller.  
Electrostatic discharge 154  
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Specifications  
Environmental specifications  
Specification  
Value  
Temperature range*  
Operating  
10°C to 35°C (50°F to 95°F)  
-40°C to 70°C (-40°F to 158°F)  
28°C (82.4°F)  
Shipping  
Maximum wet bulb temperature  
Relative humidity  
(noncondensing)**  
10% to 90%  
5% to 95%  
Operating  
Non-operating  
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048  
m (10,000 ft) is applicable. No direct sunlight allowed.  
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for  
storage corresponds to a pressure minimum of 70 kPa.  
Server specifications  
Specification  
Value  
Dimensions  
Rack model  
17.48 cm (6.88 in)  
69.93 cm (27.53 in)  
48.34 cm (19.03 in)  
Height  
Depth  
Width  
Tower model  
47.04 cm (18.52 in)  
73.96 cm (29.12 in)  
24.77 cm (9.75 in)  
Height  
Depth  
Width  
Weight  
Weight (when lightly loaded)  
Rack  
25.00 kg (55.12 lbs)  
30.00 kg (66.14 lbs)  
46.75 kg (103.06 lbs)  
Tower  
Weight (maximum)  
Power supply specifications  
Depending on installed options, the server is configured with one of the following power supplies:  
Specifications 155  
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HP ProLiant 1200 W Power Supply  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
10 A at 100 VAC  
4.9 A at 200 VAC  
930 W at 100V AC input  
1348 W at 200V AC input  
Rated input power  
BTUs per hour  
3530 at 120V AC input  
4600 at 200V to 240V AC input  
Power supply output  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Rated steady-state power  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Maximum peak power  
HP ProLiant 750 W Power Supply  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
8.9 A at 100 VAC  
4.3 A at 200 VAC  
857 W at 100V AC input  
824 W at 200V AC input  
Rated input power  
BTUs per hour  
2925 at 100V AC input  
2812 at 200V AC input  
Power supply output  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Rated steady-state power  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Maximum peak power  
HP ProLiant 460 W Power Supply  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Specifications 156  
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5.5 A at 100 VAC  
2.6 A at 200 VAC  
Rated input current  
Rated input power  
BTUs per hour  
526 W at 100V AC input  
505 W at 200V AC input  
1794 at 100V AC input  
1725 at 200V AC input  
Power supply output  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Rated steady-state power  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Maximum peak power  
Specifications 157  
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Technical support  
Before you contact HP  
Be sure to have the following information available before you call HP:  
Technical support registration number (if applicable)  
Product serial number  
Product model name and number  
Product identification number  
Applicable error messages  
Add-on boards or hardware  
Third-party hardware or software  
Operating system type and revision level  
HP contact information  
For the name of the nearest HP authorized reseller:  
See the Contact HP worldwide (in English) webpage  
For HP technical support:  
In the United States, for contact options see the Contact HP United States webpage  
o
Call 1-800-HP-INVENT (1-800-474-6836). This service is available 24 hours a day, 7 days a  
week. For continuous quality improvement, calls may be recorded or monitored.  
o
If you have purchased a Care Pack (service upgrade), call 1-800-633-3600. For more information  
about Care Packs, refer to the HP website (http://www.hp.com/hps).  
In other locations, see the Contact HP worldwide (in English) webpage  
Customer Self Repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for  
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service  
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will  
ship that part directly to you for replacement. There are two categories of CSR parts:  
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Technical support 158  
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer  
self repair. If, however, you require that HP replace them for you, there may or may not be additional  
charges, depending on the type of warranty service designated for your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,  
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the  
Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business day  
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.  
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the  
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must  
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective  
part back to HP within a defined period of time, normally five (5) business days. The defective part must be  
returned with the associated documentation in the provided shipping material. Failure to return the defective  
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping  
and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service provider. For the  
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin  
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la  
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être  
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:  
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de  
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à  
votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la  
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué  
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.  
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation  
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même  
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le  
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise  
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai  
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans  
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les  
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de  
retour, et détermine la société de courses ou le transporteur à utiliser.  
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus  
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Technical support 159  
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Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti  
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente  
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza  
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per  
la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere  
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.  
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un "No" nel Catalogo illustrato dei componenti.  
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il  
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento  
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del  
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente  
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve  
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il  
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione  
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.  
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il  
corriere/vettore da utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il  
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere  
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der  
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses  
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:  
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den  
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen  
Service berechnet.  
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche  
Kosten anfallen.  
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des  
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog  
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
Technical support 160  
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CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.  
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen  
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und  
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert  
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es  
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen  
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen  
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das  
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer  
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den  
Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner  
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self  
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar  
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios  
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente  
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se  
clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de  
desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si  
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de  
servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que  
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado  
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el  
catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su  
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el  
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de  
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales  
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán  
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá  
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes  
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no  
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas  
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de  
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.  
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Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en  
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite  
la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een  
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze  
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij  
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat  
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee  
categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen  
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen  
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het  
product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met  
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.  
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de  
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden  
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service  
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het  
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte  
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde  
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de  
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het  
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij  
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en  
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.  
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma  
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a  
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,  
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo  
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.  
Existem duas categorias de peças CSR:  
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
Technical support 162  
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de  
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de  
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão  
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o  
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser  
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico  
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR  
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é  
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.  
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte  
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a  
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço  
postal a ser utilizado.  
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o  
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP  
Technical support 163  
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Technical support 165  
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Acronyms and abbreviations  
ABEND  
abnormal end  
ACU  
Array Configuration Utility  
AMP  
Advanced Memory Protection  
ASR  
Automatic Server Recovery  
BBWC  
battery-backed write cache  
CSA  
Canadian Standards Association  
CSR  
Customer Self Repair  
DDR  
double data rate  
ECC  
error checking and correcting  
FBWC  
flash-backed write cache  
IEC  
International Electrotechnical Commission  
iLO  
Integrated Lights-Out  
Acronyms and abbreviations 166  
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IML  
Integrated Management Log  
NMI  
non-maskable interrupt  
NVRAM  
non-volatile memory  
ORCA  
Option ROM Configuration for Arrays  
PCIe  
peripheral component interconnect express  
POST  
Power-On Self Test  
PPM  
processor power module  
PSP  
ProLiant Support Pack  
RBSU  
ROM-Based Setup Utility  
RDIMM  
Registered Dual In-line Memory Module  
RDP  
Rapid Deployment Pack  
SAS  
serial attached SCSI  
SFF  
small form-factor  
SIM  
Systems Insight Manager  
Acronyms and abbreviations 167  
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TMRA  
recommended ambient operating temperature  
UDIMM  
Unregistered Dual In-Line Memory Module  
UID  
unit identification  
UPS  
uninterruptible power system  
USB  
universal serial bus  
VCA  
Version Control Agent  
Acronyms and abbreviations 168  
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Index  
change control and proactive notification 127  
Chinese notice 152  
components 7  
configuration of system 40, 116  
configuring AMP modes 118, 119  
connection problems 132  
connectors 7  
A
access panel 25  
acoustics statement for Germany 153  
ACU (Array Configuration Utility) 119  
Advanced ECC memory 49, 50, 118, 119  
air baffle 28  
contacting HP 158  
crash dump analysis 15  
airflow requirements 35  
AMP (Advanced Memory Protection) 118  
Array Configuration Utility (ACU) 119  
authorized reseller 158  
D
authorized technician 129  
auto-configuration process 117  
Declaration of Conformity 149  
default settings 49  
device numbers 16  
B
diagnosing problems 128  
diagnostic tools 121, 123  
diagnostics utility 123  
DIMM identification 47  
DIMM installation guidelines 50  
DIMM population guidelines 50  
DIMM slots 13, 14, 50  
DIMMs, installation 52  
disposal, waste 150  
downloading files 158  
drive cage jumper 21  
drive cage, installing 59, 61, 69  
drive LEDs 17  
battery cabling for BBWC 115  
battery-backed write cache (BBWC) 19, 27, 84, 85,  
battery-backed write cache battery pack 27, 84, 85,  
battery-backed write cache procedures 84, 85, 86  
BBWC (battery-backed write cache) 19, 27, 84, 85,  
BBWC battery pack 27, 84, 85, 86  
BIOS Serial Console 118  
BIOS upgrade 121  
blue screen event 15  
boot options 118  
BSMI notice 151  
buttons 7  
drivers 125  
DVD-ROM drive 7, 31  
C
E
Canadian notice 149  
capacitor pack 20, 86  
Care Pack 33, 127  
Eight-bay SFF drive cage 59, 61, 107  
electrical grounding requirements 35  
electrostatic discharge 154  
environmental requirements 34, 155  
Erase Utility 122  
error messages 144  
cautions 129  
European Union notice 150  
expansion slots 11, 13, 78  
extending server from rack 24  
cautions, electrical 129  
cautions, power cord 129  
cautions, ventilation 129  
Index 169  
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HP ProLiant Essentials Foundation Pack 40  
HP Smart Update Manager overview 126  
HP website 158  
F
fan cage 29  
FBWC cabling 115  
FBWC capacitor pack 27, 115  
FBWC module 20, 86  
I
identification number 148  
identifying components 7  
iLO (Integrated Lights-Out) 121  
iLO 2 activity LED 12  
FCC (Federal Communications Commission)  
FCC rating label 148  
IML (Integrated Management Log) 124  
Important Safety Information document 128  
Insight Diagnostics 123, 125  
installation services 33  
installing operating system 40  
internal cables 103  
features 7  
Federal Communications Commission (FCC)  
firmware upgrade utility, troubleshooting 128  
flash-backed write cache capacitor pack 27, 84, 85,  
flash-backed write cache module 84, 85, 86  
flash-backed write cache procedures 84, 85, 86  
front panel 114  
J
Japanese notice 151  
front panel buttons 8  
front panel cabling 114  
K
front panel components 7  
front panel LEDs 8  
full-height media device 74  
keyboard connector 11  
Korean notices 151  
L
G
laser devices 152  
general diagnosis flowchart 134  
graphics card option 88  
grounding methods 154  
LEDs, FBWC module 20  
LEDs, hard drive 17  
LFF backplane 64  
grounding requirements 35  
link LED 12  
lockstep memory 49, 50, 119  
loose connections 132  
H
half-height media device 73  
hard drive cage blank 31  
M
management tools 121  
hard drive drawer, removing 58  
hard drive LEDs 17  
hard drives, determining status of 17  
hard drives, installing 41, 57  
hardware options 41  
media bay blank 30  
media device data cabling 109, 110  
memory configurations 48, 49  
memory dump 15  
hardware options installation 38, 41  
health driver 121  
health LEDs 8, 15, 133  
help resources 158  
HP contact information 158  
memory subsystem architecture 47  
memory, configuration requirements 48, 50  
memory, configuring 48, 49, 119  
memory, lockstep 49, 50, 51, 119  
minimum hardware configuration 131  
mouse connector 11  
HP Insight Diagnostics 123  
HP Insight Diagnostics survey functionality 123  
HP Insight Remote Support software 124  
HP NC524SFP Dual Port 10GbE Module 80  
multi-processor Advanced ECC population order 50  
multi-processor Lockstep population order 51  
Index 170  
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rear panel components 11  
rear panel LEDs 12  
recovery key 101  
N
NIC connectors 11  
NMI switch 15  
redundant ROM 122  
registering the server 40  
O
regulatory compliance notices 148, 150  
remote support and analysis tools 124  
removable media devices 73, 74  
required information 158  
resetting the system 15  
ROM redundancy 122  
ROM-Based Setup Utility (RBSU) 101, 116  
ROMPaq utility 121, 122  
online spare memory 49, 51, 118  
operating system crash 15  
operating systems 40, 126  
optical device 76  
optimum environment 34  
Option ROM Configuration for Arrays (ORCA) 120  
options installation 38, 41  
ORCA (Option ROM Configuration for Arrays) 120  
OS boot problems flowchart 141  
S
safety considerations 128  
safety information 122  
P
SAN configuration 119  
SAS expander 87  
SAS/SATA backplane 15  
SATA connectors 13  
serial number 120  
passwords 101  
PCI expansion slots 11, 13, 22  
phone numbers 158  
POST error messages 144  
POST problems flowchart 139  
power cabling 111, 112, 113  
power calculator 55  
series number 148  
server fault indications flowchart 142  
server features and options 41  
server power-on problems flowchart 136  
server specifications 155  
server warnings and cautions 36  
service notifications 133  
SFF drive cage 59  
shipping carton contents 37  
single-processor Advanced ECC population order 50  
single-processor Lockstep population order 51  
site requirements 35  
power cap 9  
power cord 129, 153  
power distribution unit (PDU) 35  
power LEDs, system 19  
Power On button 8, 22, 40  
power requirements 35  
power supplies 55, 56  
power supply backplane connector 21  
power supply configuration 55  
power supply LEDs 12  
power supply specifications 155  
powering down 22  
powering up 22, 117  
pre-diagnostic steps 128  
preparation procedures 22, 130  
problem diagnosis 128  
processors 13, 41, 131  
ProLiant Support Packs 125  
six-bay LFF backplane 64, 65, 67, 106  
SmartStart autorun menu 116  
SmartStart Scripting Toolkit 116  
SmartStart software 40  
space requirements 34  
specifications, server 155  
start diagnosis flowchart 133  
static electricity 154  
storage controller 84  
support packs 116  
switches 15  
symbols on equipment 129  
symptom information 130  
system board battery 146, 152  
system board components 13  
system components 7  
R
rack installation 33, 36, 39  
rack resources 33  
rack stability 129  
RBSU (ROM-Based Setup Utility) 116, 118  
RDIMM configuration 49  
Index 171  
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system configuration settings 40, 116  
system maintenance switch 13, 14, 15  
system power LED 8, 19  
Systems Insight Display 7, 9  
Systems Insight Display connector 13  
Systems Insight Display LEDs 9  
T
Taiwan battery recycling notice 153  
technical support 158  
telephone numbers 158  
temperature requirements 35  
tower bezel, removing 22  
tower server, setting up 38  
tower-to-rack conversion 89  
TPM (Trusted Platform Module) 13, 99, 100, 101  
troubleshooting 128  
troubleshooting flowcharts 133  
troubleshooting, firmware upgrade utility 128  
Trusted Platform Module (TPM) 99, 100, 101  
U
UDIMM configuration 49  
UID LED 8, 12, 15  
updating the system ROM 122  
UPS (uninterruptible power supply) 35  
USB connectors 7, 11, 13  
USB support 123  
utilities 116  
V
ventilation 34  
Version Control 125  
video connector 7, 11, 13  
Vietnam compliance marking notice 152  
W
warnings 129  
website, HP 158  
Index 172  
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