Executive Series
®
Intel Desktop Board
DQ77KB
Executive Series
Thin Mini-ITX Form Factor
proDucT BrIeF
Intel® Desktop Board DQ77KB
Executive Series
Features and
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Supports the 2nd and 3rd Generation
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1 Full Length PCI Express* Mini Card(supports
mSATA) and 1 Half Length PCI Express*
Mini Card (supports wireless Intel® AMT) slots
Intel® CoreTM vProTM processors and
other Intel® processors in the
LGA1155 package , up to 65W
4 USB 3.0 ports: 4 back panel ports – 2 ports
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Intel® Q77 Express Chipset PCH
support high current
Dual-Channel DDR3 with two connectors
for 1600/1333 MHz memory support:
Supports 1.2V to 1.8V memory voltage
control for maximum DIMM compatibility
10 5 USB 2.0 ports: 5 ports via internal headers
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11 eDP*, LVDS, DisplayPort* and HDMI*:
Support tripal independent display capability
for multiple display support
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4 SATA ports (2 SATA 6.0 Gb/s;
2 SATA 3.0 Gb/s): Facilitates high-speed
storage and data transfers at up to 6.0 Gb/s
12 Serial and Custom Solutions headers
13 Thin Mini-ITX form factor
Dual Integrated 10/100/1000 Network
Connection: Enables link aggregation
and improves Ethernet throughput
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Audio3: Audio subsystem with two
analog audio outputs (2 + 2 independent
multi-streaming)
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PCI Express* 3.0 x4 connector
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6.7” (17cm)
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Intel® Desktop Board DQ77KB
Executive Series
Technical
PROCESSOR
Processor Support
• Intel® Core™ i7 and Intel® Core™ i5 processors and other
• Intel® processors in the LGA1155 package.
• Supports Intel® 64 architecture4
MEMORY MODES
Dual- or single-channel operation support
MEMORY VOLTAGE
1.2 V to 1.8 V
EMC REGULATIONS (tested in representative chassis)
united States
FCC 47 CFR Part 15, Subpart B
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Canada
MECHANICAL BOARD STYLE
• Thin Mini-ITX
ICES-003 Class B
CHIPSET
• Intel® Q77 express chipset
• Intel® Q77 Platform Controller Hub (PCH)
Europe
BOARD SIZE
• 6.7” × 6.7” (17 cm × 17 cm)
(EMC Directive 2004 / 108 / EC) EN 55022 and EN 55024
PERIPHERAL CONNECTIVITY
Australia / New Zealand
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4 SATA ports (2 SATA 6.0 Gb/s; 2 SATA 3.0 Gb/s)
Dual Integrated 10/100/1000 Network Connection
4 Super-Speed USB 3.0 ports (4 back panel ports)
5 Hi-Speed USB 2.0 ports (5 internal headers)
BASEBOARD POWER REQUIREMENTS
• Thin Mini-ITX 19 V
EN 55022 Class B
INTEL® PRO 10/100/1000 NETWORK CONNECTION
Low-power design
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Japan
VCCI V-3, V-4 Class B
ENVIRONMENT
OPERATING TEMPERATURE
EXPANSION CAPABILITIES
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One PCI Express* 3.0 x4 connector
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0° C to +55° C
South Korea
KN-22 and KN-24
One Full-length PCI Express* Mini Card slot – supports mSATA
One Half-length PCI Express* Mini Card slot – supports
wireless Intel® AMT
STORAGE TEMPERATURE
-20°C to +70°C
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Taiwan
CNS 13438 Class B
HEADERS
REGULATIONS AND SAFETY STANDARDS
UNITED STATES AND CANADA
CSA / UL 60950-1, First Edition (Binational Standard)
SYSTEM MEMORY
Memory capacity
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One serial port header
International
CISPR 22 Class B
Custom Solutions header
Digital microphone (DMIC) header
Stereo speaker header
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Two 204-pin SODIMM connectors supporting up to two double-sided
SODIMMs (16 GB5 max)
EUROPE
ENVIRONMENTAL COMPLIANCE EUROPE
Europe
(Low Voltage Directive 2006 / 95 / EC) EN 60950-1
Memory Types
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Europe RoHS (Directive 2002/95/EC) china
China RoHS (MII Order # 39)
DDR3 16006/ 1333 SDRAM memory support
Non-ECC Memory
INTERNATIONAL
IEC 60950-1
JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
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Single configuration jumper design
Jumper access for BIOS maintenance mode
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System resources and hardware (such as PCI and PCI Express*) require physical
memory address locations that can reduce available addressable system memory.
This could result in a reduction of as much as 1 GB or more of physical addressable
memory being available to the operating system and applications, depending on
the system configuration and operating system.
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Intel® Turbo Boost Technology – maximum single-core turbo frequency (GHz). Intel
turbo Boost Technology requires a PC with a processor with Intel Turbo boost
Technology capability. Intel Turbo Boost Technology performance varies depending
on hardware,software, and overall system configuration. Check with your PC
manufacturer on whether your system delivers Intel Turbo Boost Technology. See
Intel® Hyper-Threading Technology requires a computer system with a processor
supporting HT Technology and an HT Technology-enabled chipset, BIOS, and
operating system. Performance will vary depending on the specific hardware and
Intel® High Definition Audio requires a system with an appropriate Intel® chipset
and a motherboard with an appropriate codec and the necessary drivers installed.
System sound quality will vary depending on actual implementation, controller,
codec, drivers, and speakers. For more information about Intel® HD Audio, refer to
64-bit computing on Intel® architecture requires a computer system with a
processor,chipset, BIOS, operating system, device drivers, and applications enabled
for Intel® 64 architecture. Processors will not operate (including 32-bit operation)
without an Intel 64 architecture-enabled BIOS. Performance will vary depending on
nology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®
PRODUCTS.NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL
ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIEDWARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining
applications.
Intel may make changes to specifications and product descriptions at any
time, without notice.
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WARNING: Altering PC memory frequency, voltage and/or latency may: (i) reduce
system stability and useful life of the system, memory and processor; (ii) cause the
processor and other system components to fail; (iii) cause reductions in system
performance; (iv) cause additional heat or other damage; and (v) affect system
data integrity. Intel has not tested, and does not warranty, the operation of the
memory beyond its specifications. Intel assumes no responsibility that the memory,
including if used with altered clock frequencies and/or voltages, will be fit for any
particular
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All products, dates, and figures specified are preliminary based on current expectations,
and are subject to change without notice. Availability in different channels may vary.
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Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation
in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright© 2012, Intel Corporation 05/12/ST/MED/PDF 327431-001
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