Panasonic Car Stereo System EZANC User Manual

Chip 3-Terminal Capacitor Array  
Chip 3-Terminal Capacitor Array  
Type:  
EZASC  
EZANC  
GND  
GND  
Features  
1.  
Suitable for EMI suppression filtering  
The low residual inductance at high frequency range provides effective reduction of noise  
Equivalent noise reduction to the EMI filters with low cost design  
2.  
Compact design for high density PWB assembly  
EZASC : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.8 mm pitch  
EZANC : 6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch  
Flat and square packages suitable for high speed automatic placement machine  
3.  
Superior mountability with concave terminals  
Firm solder joint (2 times that of convex terminal type)  
Self-aligning placement during reflow soldering  
<Effect of high density placing, PWB space saving>  
Digital cordless phone  
(4 line mounting)  
RF Circuit  
(EZA SC)  
I/O  
I/O  
I/O  
I/O  
Digital Control Circuit  
Prevent high frequency harmonic  
noise to RF circuits  
EZASC: 0.8 mm pitch  
EZANC: 1.27 mm pitch  
3-Terminal Capacitors or EMI Filters  
Recommended Applications  
Digital equipment such as PCs, printers, HDD, PCMCIA cards, PDAs, and word processors  
Communication equipment, digital cordless phones, automobile phones, GSM, PHS, DECT  
Digital audio and video equipment  
Electronic musical instruments, and other digital devices  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip 3-Terminal Capacitor Array  
Ratings  
Specification  
Item  
EZASC  
EZANC  
Capacitance Values  
10 pF to 180 pF  
Standard : 22 pF, 47 pF, 100 pF  
22 pF, 47 pF, 100 pF, 220 pF, 470 pF  
(25 °C, 1 kHz(1), 1 Vrms)  
+30%  
Capacitance Tolerance  
Temperature Characteristic  
Dissipation Factor  
20% (  
in the case of Less than 22 pF)  
–20%  
E Characteristic: +20 %/ 55 % ( 25 °C to +85 °C)  
Less than 2 % (25 °C, 1 kHz(1), 1 Vrms)  
25 V  
Rated Voltage  
Rated Current (2)  
200 mA  
300 mA  
Resistance (3)  
Less than 1  
ȑ
Category Temperature Range (Operating Temperature Range)  
–25 °C to +85 °C  
(1) In measuring at 1MHz, Capacitance Value and Dissipation Factor are different.  
(2) Rated Current between Input terminal and Output terminal.  
(3) Resistance value between Input terminal and Output terminal.  
Attenuation Characteristics  
Measurement Circuit  
Measurement Circuit  
1 kȑ  
1 kȑ  
50 ȑ  
EZANC  
2000 pF  
MN74HC04  
MN74HC04 MN74HC04  
~
50 ȑ  
8 MHz  
EZA  
SCE470M  
Chip 3-Terminal Capacitor Array (EZANC)  
100  
80  
100  
80  
0
10  
20  
30  
40  
50  
60  
60  
40  
40  
20  
20  
100  
200  
400  
600  
800  
1000  
100  
200  
400  
600  
800 1000  
Frequency (MHz)  
Frequency (MHz)  
1M  
10M  
100M  
1G  
3G  
Frequency (Hz)  
Equivalent to EMI filter  
Packaging Methods (Taping)  
Standard Quantity  
Type  
Kind of Taping  
Embossed Carrier Taping  
Pitch (P1)  
4 mm  
Quantity  
4000 pcs./reel  
EZASC  
EZANC  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip 3-Terminal Capacitor Array  
Embossed Carrier Taping  
Taping Reel  
t1  
T
Compartment  
Sprocket hole  
f
D0  
A
fC  
f
D1  
t2  
P1 P2 P0  
Tape running direction  
Chip component  
fA  
W
Type  
A
B
W
F
E
P0  
0.20  
0.20  
0.20  
0.20  
EZASC 2.50  
EZANC 3.50  
4.40  
6.80  
Dimensions  
0.30  
0.20  
0.20  
0.10  
12.00  
5.50  
1.75  
4.00  
(mm)  
f
f
f
C
A
B
Dimensions  
(mm)  
+0  
1.0  
180  
60 min.  
13.0  
−3.0  
f
f
Type  
EZASC  
EZANC  
P1  
P2  
D0  
t1  
t2  
1.15  
1.30  
D1  
0.20  
0.20  
W
T
Dimensions  
(mm)  
Dimensions  
(mm)  
0.10  
0.05  
0.05  
+0.10  
−0  
4.00  
2.00  
1.50+0.10  
−0  
0.25  
1.50  
1.0  
2.0  
13.0  
15.4  
Recommended Land Pattern Design  
Chip 3-Terminal Capacitor Array  
(EZANC/EZASC)  
f2  
c
GND  
b
P
Land pattern  
Solder resistant  
Type  
a
b
c
d
e
f1  
f2  
P
EZASC  
EZANC  
1.2 to 1.4  
0.4  
3.1 to 3.3 0.4 to 0.5  
0.8  
1.8  
2.9 to 3.3 4.8 to 5.2  
4.2 to 4.6 7.5 to 7.9  
0.8  
Dimensions  
(mm)  
2.2 to 2.4 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8  
1.27  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip 3-Terminal Capacitor Array  
Recommended Soldering Conditions  
Recommendations and precautions are described below.  
Recommended soldering conditions for reflow  
For soldering (Example : Sn/Pb)  
Temperature  
140 °C to 160 °C  
·Reflow soldering shall be performed a maximum of  
two times.  
Time  
·Please contact us for additional information when  
used in conditions other than those specified.  
·Please measure the temperature of the terminals and  
study every kind of solder and printed circuit board  
for solderability before actual use.  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Above 200 °C  
235 5 °C  
For lead-free soldering (Example : Sn/Ag/Cu)  
Peak  
Temperature  
150 °C to 180 °C  
Above 230 °C  
max. 260 °C  
Time  
Preheating  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Heating  
Time  
Flow Soldering  
We do not recommend flow soldering to the Chip 3-Terminal Capacitor Array: EZASC, because solder  
bridging may occur due to the narrow 0.8 mm pitch of EZASC. Please contact us regarding flow soldering  
of EZANC type.  
Safety Precautions  
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,  
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.  
1. Take measures against mechanical stress during and after mounting of Chip 3-Terminal Capacitor Array (hereafter  
called the capacitor arrays) so as not to damage their electrodes and protective coatings.  
Be careful not to misplace the capacitor arrays on the land patterns. Otherwise, solder bridging may occur.  
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitors arrays'  
performance and/or reliability.  
3. When soldering with a soldering iron, never touch the capacitor arrays' bodies with the tip of the soldering iron. When  
°
using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350  
C max.).  
4. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor arrays increases,  
causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.  
5. Do not apply shock to the capacitor arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the  
capacitor arrays' protective coatings and bodies may be chipped, affecting their performance.  
6. Avoid excessive bending of printed circuit boards in order to protect the capacitor arrays from abnormal stress.  
7. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to  
dielectric materials having a high dielectric constant.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])  
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written  
agreement on the specifications with us in advance. The design and specifications in this catalog are subject  
to change without prior notice.  
• Do not use the products beyond the specifications described in this catalog.  
• This catalog explains the quality and performance of the products as individual components. Before use, check  
and evaluate their operations when installed in your products.  
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment  
where a defect in these products may cause the loss of human life or other significant damage, such as damage to  
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating  
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.  
Systems equipped with a protection circuit and a protection device  
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault  
(1) Precautions for use  
• These products are designed and manufactured for general and standard use in general electronic equipment  
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)  
• These products are not intended for use in the following special conditions. Before using the products,  
carefully check the effects on their quality and performance, and determine whether or not they can be used.  
1. In liquid, such as water, oil, chemicals, or organic solvent  
2. In direct sunlight, outdoors, or in dust  
3. In salty air or air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO  
4. Electric Static Discharge (ESD) Environment  
2
2
3
2
2
These components are sensitive to static electricity and can be damaged under static shock (ESD).  
Please take measures to avoid any of these environments.  
Smaller components are more sensitive to ESD environment.  
5. Electromagnetic Environment  
Avoid any environment where strong electromagnetic waves exist.  
6. In an environment where these products cause dew condensation  
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with  
resin or other materials  
• These products generate Joule heat when energized. Carefully position these products so that their heat will  
not affect the other components.  
• Carefully position these products so that their temperatures will not exceed the category temperature range due  
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components  
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).  
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the  
performance or reliability of the products.  
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance  
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water  
residues. Otherwise, the insulation performance may be deteriorated.  
(2) Precautions for storage  
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival  
at your company, provided that they remain packed as they were when delivered and stored at a temperature  
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the  
date of arrival at your company)  
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on  
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %  
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a  
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of  
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.  
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,  
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping  
materials) may be deformed or deteriorated, resulting in mounting failures.  
2
2
3
2
2
1. In salty air or in air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO  
2. In direct sunlight  
<Package markings>  
Package markings include the product number, quantity, and country of origin.  
In principle, the country of origin should be indicated in English.  
Feb. 2006  
– EX2 –  
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