Intel Computer Hardware Q35 Express User Manual
®
®
TM  
Intel Core 2 Duo Processor and  
Intel Q35 Express Chipset  
Development Kit  
User’s Manual  
October 2007  
Order Number: 318476-001US  
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Contents—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
Contents  
1.0 About This Manual.....................................................................................................6  
1.1  
1.2  
1.3  
1.4  
Content Overview................................................................................................6  
Text Conventions ................................................................................................6  
Glossary of Terms and Acronyms...........................................................................7  
Support Options..................................................................................................8  
1.4.1 Electronic Support Systems .......................................................................8  
1.4.2 Additional Technical Support......................................................................8  
Product Literature ...............................................................................................8  
1.5  
2.0 Development Kit Hardware Features ....................................................................... 10  
2.1  
2.2  
2.3  
2.4  
2.5  
Intel® Q35 Express Chipset Development Kit Overview.......................................... 10  
System Block Diagram.......................................................................................11  
Development Kit Inventory Checklists .................................................................. 12  
Processor Support ............................................................................................. 14  
System Memory................................................................................................ 14  
2.5.1 Dual Channel (Interleaved) Mode Configurations ........................................ 15  
2.5.2 Single Channel (Asymmetric) Mode Configurations......................................17  
Back-Panel Connectors.......................................................................................18  
2.6.1 Audio-Connectors................................................................................... 18  
2.6.2 RJ-45 LAN Connector with Integrated LEDs................................................ 19  
2.6.3 USB Port...............................................................................................19  
2.6.4 Coaxial S/PDIF In/Out Connector.............................................................. 19  
2.6.5 eSATA Port............................................................................................19  
Debug Features................................................................................................. 20  
2.7.1 Extended Debug Probe (XDP)................................................................... 20  
2.7.2 Power LEDs ........................................................................................... 20  
2.7.3 Port 80 POST Code LEDs .........................................................................20  
2.7.4 Voltage Reference .................................................................................. 21  
Development Kit Major Connectors and Jumpers.................................................... 21  
2.8.1 Jumper Functions................................................................................... 22  
2.8.2 USB 2.0 Front Panel ............................................................................... 22  
2.8.3 1394a Header........................................................................................ 22  
SPI Removal / Installation Technique ................................................................... 23  
2.9.1 SPI Device Removal................................................................................ 24  
2.9.2 SPI Device Installation............................................................................24  
2.6  
2.7  
2.8  
2.9  
3.0 Setting Up and Configuring the Development Kit ..................................................... 26  
3.1  
3.2  
3.3  
Overview ......................................................................................................... 26  
Installing Board Standoffs .................................................................................. 26  
BTX Heatsink Setup with SRM ............................................................................. 28  
3.3.1 SRM Alignment on any BTX Board ............................................................ 28  
Board Setup and Configuration before Boot........................................................... 30  
Post Codes Definitions........................................................................................ 32  
3.5.1 Normal Post Codes ................................................................................. 32  
3.4  
3.5  
Figures  
1
2
3
4
5
Board Features........................................................................................................ 11  
Intel® Q35 Express Chipset Development Kit block diagram.......................................... 12  
Memory Channel and DIMM Configuration ................................................................... 15  
Dual Channel (Interleaved) Mode Configuration with 2x DIMMs ......................................16  
Dual Channel (Interleaved) Mode Configuration with 3x DIMMs ......................................16  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Contents  
6
7
8
9
Dual Channel (Interleaved) Mode Configuration with 4x DIMMs.......................................17  
Single Channel (Asymmetric) Mode Configuration with 1x DIMM .....................................17  
Single Channel (Asymmetric) Mode Configuration with 3x DIMMs....................................18  
Back-panel Connectors..............................................................................................18  
10 LAN Connector LED locations......................................................................................19  
11 ITP-XDP Connector location (J2BC) .............................................................................20  
12 Major Jumper and Header Locations............................................................................21  
13 Location for 1394a Header and USB Front Panel ...........................................................23  
14 SPI Socket with Retaining Clip....................................................................................24  
15 SPI Device Installation ..............................................................................................25  
16 Intel® Q35 Development Kits ....................................................................................26  
17 Mounting Hole Locations............................................................................................27  
18 Mounting the Standoff for BTX Heatsink.......................................................................28  
19 Casing with “Support and Retention Module”................................................................28  
20 BTX board alignment on SRM.....................................................................................29  
21 Heatsink Alignment...................................................................................................29  
22 Tightening Heatsink on the SRM and Board..................................................................30  
23 CPU Fan location ......................................................................................................31  
24 2x12 Standard power supply and 2x2 power supply ......................................................32  
Tables  
1
Definition ................................................................................................................. 7  
2
3
4
5
6
7
8
9
Intel Literature Centers .............................................................................................. 9  
Development Kit Hardware Items ...............................................................................12  
Development Kit Board Specification...........................................................................13  
Internal I/O headers.................................................................................................13  
Supported Intel Technologies.....................................................................................13  
Additional Features...................................................................................................14  
LAN Connector LED status .........................................................................................19  
Voltage Reference detail............................................................................................21  
®
TM  
®
10 Intel Core  
2 Duo Processor and Intel  
Q35 Express Chipset Development Kit Board  
Jumpers Description .................................................................................................22  
11 USB Front Panel .......................................................................................................22  
12 1394a Header..........................................................................................................23  
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Revision History—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
Revision History  
Date  
Revision Description  
001 Initial release  
October 2007  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual  
1.0  
About This Manual  
This user’s manual describes the use of the Intel® Q35 Express Chipset Development  
Kit. This manual has been written for OEMs, system evaluators, and embedded system  
developers. All jumpers, headers, LED functions, and their locations on the board,  
along with subsystem features and POST codes, are defined in this document.  
For the latest information about the Intel® Q35 Express Chipset Development Kit  
reference platform, visit:  
http://developer.intel.com/design/intarch/devkits/  
index.htm?iid=embed_body+devkits  
For design documents related to this platform, such as schematics and layout, please  
contact your Intel Representative.  
1.1  
Content Overview  
Chapter 1.0, “About This Manual”  
This chapter contains a description of conventions used in this manual. The last few  
sections explain how to obtain literature and contact customer support.  
Chapter 2.0, “Development Kit Hardware Features”  
This chapter provides information on the development kit features and the board  
capability. This includes the information on board component features, jumper settings,  
pin-out information for connectors and overall development kit board capability.  
Chapter 3.0, “Setting Up and Configuring the Development Kit”  
This chapter provides instructions on how to configure the evaluation board and  
processor assembly by setting BTX heatsink, jumpers, connecting peripherals,  
providing power, and configuring the BIOS.  
1.2  
Text Conventions  
The following notations may be used throughout this manual.  
#
The pound symbol (#) appended to a signal name indicates that  
the signal is active low.  
Variables  
Instructions  
Variables are shown in italics. Variables must be replaced with  
correct values.  
Instruction mnemonics are shown in uppercase. When you are  
programming, instructions are not case-sensitive. You may use  
either upper-case or lower-case.  
Numbers  
Hexadecimal numbers are represented by a string of  
hexadecimal digits followed by the character H. A zero prefix is  
added to numbers that begin with A through F. (For example, FF  
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About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
is shown as 0FFH.) Decimal and binary numbers are  
represented by their customary notations (That is, 255 is a  
decimal number and 1111 1111 is a binary number). In some  
cases, the letter B is added for clarity.  
Units of Measure  
The following abbreviations are used to represent units of  
measure:  
GByte  
KByte  
MByte  
MHz  
W
gigabytes  
kilobytes  
megabytes  
megahertz  
watts  
V
volts  
Signal Names  
Signal names are shown in uppercase. When several signals  
share a common name, an individual signal is represented by  
the signal name followed by a number, while the group is  
represented by the signal name followed by a variable (n). For  
example, the lower chip-select signals are named CS0#, CS1#,  
CS2#, and so on; they are collectively called CSn#. A pound  
symbol (#) appended to a signal name identifies an active-low  
signal. Port pins are represented by the port abbreviation, a  
period, and the pin number (e.g., P1.0).  
1.3  
Glossary of Terms and Acronyms  
This section defines conventions and terminology used throughout this document.  
Table 1.  
Definition (Sheet 1 of 2)  
Term  
Description  
Advanced Digital Display Card – 2nd Generation. This card provides digital display options  
for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI  
Express* connector but uses the multiplexed SDVO interface. The card adds Video In  
capabilities to platform. This Advanced Digital Display Card will not work with an Intel  
Graphics Controller that supports DVO and ADD cards. It will function as an ADD2 card in  
an ADD2 supported system, but video in capabilities will not work.  
ADD2 Card  
ACPI  
Core  
DDR2  
DMI  
Advanced Configuration and Power Interface  
The internal base logic in the (G)MCH  
A second generation Double Data Rate SDRAM memory technology  
(G)MCH-IntelÆ ICH9 Direct Media Interface  
Digital Video Interface. Specification that defines the connector and interface for digital  
displays.  
DVI  
FSB  
Front Side Bus. FSB is synonymous with Host or processor bus  
Intel® Graphic Media Accelerator 3100  
GMA 3100  
Eighth generation I/O Controller Hub component that contains additional functionality  
compared to previous ICHs. The I/O Controller Hub component contains the primary PCI  
interface, LPC interface, USB2, ATA-100, and other I/O functions. It communicates with  
the (G)MCH over a proprietary interconnect called DMI.  
IntelÆ ICH9  
IGD  
Internal Graphics Device.  
Low Voltage Differential Signaling. A high speed, low power data transmission standard  
used for display connections to LCD panels.  
LVDS  
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Table 1.  
Definition (Sheet 2 of 2)  
Term  
Description  
Advanced Digital Display Card – 2nd Generation. This card provides digital display options  
for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI  
Express* connector but uses the multiplexed SDVO interface. The card adds Video In  
capabilities to platform. This Advanced Digital Display Card will not work with an Intel  
Graphics Controller that supports DVO and ADD cards. It will function as an ADD2 card in  
an ADD2 supported system, but video in capabilities will not work.  
ADD2 Card  
Memory Controller Hub component that contains the processor interface, DRAM  
controller, and x16 PCI Express* port (typically, the external graphics interface). It  
communicates with the I/O controller hub (Intel ICH9) and other I/O controller hubs over  
the DMI interconnect. In this document MCH refers to the Intel® Q35 MCH component.  
MCH  
MEC  
Media Expansion Card, also known as ADD2+ card. Refer to ADD2+ term for description.  
Third Generation input/output graphics attach called PCI Express* Graphics. PCI Express*  
is a high-speed serial interface whose configuration is software compatible with the  
existing PCI specifications. The specific PCI Express* implementation intended for  
connecting the (G)MCH to an external Graphics Controller is a x16 link and replaces AGP.  
PCI Express*  
The Primary PCI is the physical PCI bus that is driven directly by the ICH9 component.  
Communication between Primary PCI and the (G)MCH occurs over DMI. Note that the  
Primary PCI bus is not PCI Bus 0 from a configuration standpoint.  
Primary PCI  
SDVO  
Serial Digital Video Out (SDVO). SDVO is a digital display channel that serially transmits  
digital display data to an external SDVO device. The SDVO device accepts this serialized  
format and then translates the data into the appropriate display format (i.e., TMDS,  
LVDS, TV-Out). This interface is not electrically compatible with the previous digital  
display channel - DVO. For the 82Q965 GMCH, it will be multiplexed on a portion of the  
x16 graphics PCI Express* interface.  
Third party codec that uses SDVO as an input. May have a variety of output formats,  
including DVI, LVDS, HDMI, TV-out, etc.  
SDVO Device  
SMI  
System Management Interrupt. SMI is used to indicate any of several system conditions  
(such as, thermal sensor events, throttling activated, access to System Management  
RAM, chassis open, or other system state related activity).  
A unit of DRAM corresponding to eight x8 SDRAM devices in parallel or four x16 SDRAM  
devices in parallel, ignoring ECC. These devices are usually, but not always, mounted on a  
single side of a DIMM.  
Rank  
1.4  
Support Options  
1.4.1  
Electronic Support Systems  
Intel’s site on the World Wide Web (http://www.intel.com/) provides up-to-date  
technical information and product support. This information is available 24 hours per  
day, 7 days per week, providing technical information whenever you need it.  
Product documentation is provided online in a variety of web-friendly formats at:  
(http://developer.intel.com/)  
1.4.2  
1.5  
Additional Technical Support  
If you require additional technical support, please contact your field sales  
representative or local distributor.  
Product Literature  
Product literature can be ordered from the following Intel literature centers:  
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About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
Table 2.  
Intel Literature Centers  
Location  
Telephone Number  
U.S. and Canada  
U.S. (from overseas)  
Europe (U.K.)  
Germany  
1-800-548-4725  
708-296-9333  
44(0)1793-431155  
44(0)1793-421333  
44(0)1793-421777  
81(0)120-47-88-32  
France  
Japan (fax only)  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features  
2.0  
Development Kit Hardware Features  
This chapter describes the features of the Intel® Q35 Development Kit. These  
recommendations would largely apply to other designs incorporating Intel® Q35  
chipset. This documentation should be used in conjunction with the datasheets,  
specification updates and platform design guides for the Intel® I/O Controller Hub 9  
(ICH9) Family and the Intel® Q35 Express Chipset. Contact your Intel representative  
for the availability of these documents.  
2.1  
Intel® Q35 Express Chipset Development Kit Overview  
Figure 1 shows overview of the major features present on the development kit board.  
Refer to next page for system block diagram of the development kit’s motherboard.  
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
Figure 1.  
Board Features  
Reset button  
PCI Slot  
PCI Express  
x1 Slot  
Power Button  
SPI EEPROM  
(Secondary)  
Port 80 LED Display  
SPI EEPROM  
(Primary)  
PCI Express  
x16 Graphics  
Slot  
LGA775 Processor  
Socket  
Intel® I/O  
Controller Hub  
(ICH)  
SATA Port  
Intel® Q35 Memory  
Controller Hub (MCH)  
2x2 Standard  
Power Supply  
2x12  
Standard  
Power Supply  
2-DIMM per channel DDR2  
667/800 (Channel-A)  
2-DIMM per channel DDR2  
667/800 (Channel-B)  
2.2  
System Block Diagram  
®
This section will document the common features that are applicable to the Intel  
TM  
®
Core 2 Duo Processor and Intel  
Q35 Express Chipset Development Kit. Figure 2  
shows a simple block diagram of the development kit.  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features  
Figure 2.  
Intel® Q35 Express Chipset Development Kit block diagram  
2.3  
Development Kit Inventory Checklists  
This section describes major hardware items which should be available on this  
development kit.  
Table 3.  
Development Kit Hardware Items  
1x 4-Layer Micro-BTX form factor (targeted dimensions: 10.5” x 10.4”) motherboard  
1x Intel® CoreTM 2 Duo E6400 Processors in the LGA775 Socket  
2x 1 GBytes DDR2 800 DIMM  
1x BTX Heatsink with fan  
1x CD-ROM contain chipset drivers (this include Intel® GMA3100 driver)  
8x hex standoffs and 4x screws for bench top usage  
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
Table 4.  
Development Kit Board Specification  
1 PCI Express x16, 2 PCIe x1, 1 PCI expansion slots  
1394a  
•
•
1 front panel headers for support of 1 port  
1 back panel port  
Universal Serial Bus 2.0  
•
•
•
2 front panel headers for support of 4 ports  
1 internal header for support of 2 ports  
6 back panel ports  
6 SATA 3 Gb/sec ports (1 port used for eSATA)  
Table 5.  
Internal I/O headers  
2x5 Front Panel I/O header  
2x7 Front Panel audio header  
1x2 Chassis intrusion header  
3 four-wire fan headers  
2x8 High Definition audio header  
Table 6.  
Supported Intel Technologies (Sheet 1 of 2)  
Technology  
Features/support  
Reference Documentation  
•
•
Enables remote, down-the-wire management  
of out-of-band networked systems regardless  
of system state, helping improve efficiency,  
asset management and system security and  
availability.  
System Defense Feature can help block  
incoming software attacks, isolate a device  
from the network if infected, and proactively  
alert embedded system vendors if critical  
software agents are missing.  
Intel® Active Management  
Technology with System  
Defense feature (Intel®  
ICH8 DO only)  
http://www.intel.com/technology/  
platform-technology/intel-amt/  
•
•
•
Dual independent display expands viewable  
workspace for devices such as point-of-sale  
terminals with two monitors.  
Provides next-generation graphics  
performance for advanced embedded  
operating systems.  
Delivers richer visual color and picture clarity  
without the need for additional discrete  
graphics cards.  
Intel® Graphics Media  
Accelerator 3000  
http://www.intel.com/products/chipsets/  
gma3000/demo/demo.html  
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Table 6.  
Supported Intel Technologies (Sheet 2 of 2)  
Technology  
Features/support  
Reference Documentation  
•
Helps improve system performance by  
optimizing use of available memory  
bandwidth and reducing latency of memory  
access by monitoring all pending read/write  
requests; allows safe and efficient  
overlapping of commands on all system bus  
interfaces.  
http://www.intel.com/products/chipsets/  
q965_q963/demo/demo.html  
Intel® Fast Memory Access  
•
With a second hard drive added, provides  
quicker access to digital photo, video and  
data files with RAID 0, 5 and 10, and greater  
data protection against a hard disk drive  
failure with RAID 1, 5 and 10.  
Intel® Matrix Storage  
Technology (Intel® ICH8  
DO only)  
http://www.intel.com/design/chipsets/  
matrixstorage_sb.htm  
•
•
Enables premium digital sound and delivers  
advanced features such as multiple audio  
streams and jack re-tasking.  
Support for microphone array enables  
enhanced voice capture for high-quality input  
to voice-driven activities.  
http://www.intel.com/design/chipsets/  
hdaudio.htm  
Intel® High Definition Audio  
Table 7.  
Additional Features  
6 Analog audio connectors and 2 digital audio connectors  
Piezo speaker for BIOS POST codes  
BIOS configuration jumper  
Clear CMOS jumper  
Power Button  
Reset Button  
XDP connector  
2.4  
Processor Support  
®
The Intel Q35 Development Kit supports the following processors in the LGA775  
Socket with FSB of 800/1067/1333 MHz.  
These processors, with long-life support are also supported by this development kit:  
®
TM  
• Intel Core  
2 Duo E6400 (Included in the development kit)  
®
TM  
• Intel Core  
2 Duo E4300  
®
®
• Intel Pentium Dual-Core Processor E2160  
®
®
• Intel Celeron 440  
Refer to this link for other processors which is also supported by Intel® Q35 Express  
Chipset.  
http://developer.intel.com/products/chipsets/Q35_Q33/index.htm  
2.5  
System Memory  
The Intel® Q35 Express Chipset supports two types of memory organization. These are  
interleaved mode and asymmetric mode. The Q35 supports:  
Listed here are the summary of the system memory supported.  
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
• Non-ECC DDR2 (667/800)  
• 512Mb, 1Gb and 2Gb technology  
• 4 DIMMs, 4GB maximum per channel, 8GB total memory  
• Dual channel (Interleaved) mode. This mode offers the highest throughput for real  
world applications. Dual channel mode is enabled when the installed memory  
capacities of both DIMM channels are equal. Technology and device width can vary  
from one channel to the other but the installed memory capacity for each channel  
must be equal. If different speed DIMMs is used between channels, the slowest  
memory timing will be used.  
• Single channel (Asymmetric) mode. This mode is equivalent to single channel  
bandwidth operation for real world applications. This mode is used when only a  
single DIMM is installed or the memory capacities are unequal. Technology and  
device width can vary from one channel to the other. If different speed DIMMs is  
used between channels, the slowest memory timing will be used.  
Figure 3 illustrates the memory channel and DIMM configuration.  
Figure 3.  
Memory Channel and DIMM Configuration  
Channel A DIMM 0  
Channel A DIMM 1  
Channel B DIMM 0  
Channel B DIMM 1  
2.5.1  
Dual Channel (Interleaved) Mode Configurations  
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the  
DIMM 0 sockets of both channels are populated with identical DIMMs.  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features  
Figure 4.  
Dual Channel (Interleaved) Mode Configuration with 2x DIMMs  
Figure 5 shows a dual channel configuration using 3 DIMMs. In this example, the  
combined capacity of the two DIMMs in Channel A equal the capacity of the single  
DIMM in the DIMM 0 socket of Channel B.  
Figure 5.  
Dual Channel (Interleaved) Mode Configuration with 3x DIMMs  
Figure 6 shows a dual channel configuration using 4 DIMMs. In this example, the  
combined capacity of the 2x DIMMs in Channel A equals the combined capacity of the  
2x DIMMs in Channel B. Also, the DIMMs are matched between DIMM 0 and DIMM 1 of  
both channels.  
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
Figure 6.  
Dual Channel (Interleaved) Mode Configuration with 4x DIMMs  
2.5.2  
Single Channel (Asymmetric) Mode Configurations  
Figure 7 shows a single channel configuration using 1x DIMM. In this example, only the  
DIMM 0 socket of Channel A is populated. Channel B is not populated.  
Figure 7.  
Single Channel (Asymmetric) Mode Configuration with 1x DIMM  
Figure 8 shows a single channel configuration using 3x DIMMs. In this example, the  
combined capacity of the 2x DIMMs in Channel A does not equal the capacity of the  
single DIMM in the DIMM 0 socket of Channel B.  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features  
Figure 8.  
Single Channel (Asymmetric) Mode Configuration with 3x DIMMs  
2.6  
Back-Panel Connectors  
Figure 9 shows back-panel connectors for the development kit.  
Figure 9.  
Back-panel Connectors  
Side  
Speaker  
Out  
Line-in Jack  
RJ-45 LAN Port  
1394a Port  
Rear  
Speaker  
Out  
Line-out  
Jack  
S/PDIF IN  
S/PDIF OUT  
USB Port  
(Total 6  
Ports)  
Center/  
Sub  
Woofer  
Speaker  
Out Jack  
Mic In Jack  
VGA Analog  
Display  
eSATA Port  
2.6.1  
Audio-Connectors  
This development kit board supports up to 7.1-channel audio configuration. It is  
backward compatible with 5.1, 2.1 and stereo (2-channel) audio configuration as well.  
Line In Jack (Light Blue)  
This audio jack is used to for line in devices, including some optical devices.  
Line Out Jack (Light Green)  
This audio jack is used for line out devices. It’s used in 2.1, 5.1 and 7.1 channel- audio  
configuration. It can be used for headphone and stereo speaker as well.  
Mic In Jack (Pink)  
This audio jack is use for microphone input.  
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Center/Subwoofer Speaker Out Jack (Orange)  
This audio jack is used to connect to center/subwoofer speakers in a 5.1 and 7.1-  
channel audio configuration.  
Rear Speaker Out (Black)  
This audio jack is used to connect to rear speakers in a 5.1 and 7.1-channel audio  
configuration.  
Side Speaker Out (Gray)  
This audio jack is used to connect to side speakers for 7.1-channel audio configuration  
only.  
2.6.2  
RJ-45 LAN Connector with Integrated LEDs  
Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 10). Table 8  
describes the LED states when the board is powered up and the Gigabit LAN subsystem  
is operating.  
Figure 10.  
LAN Connector LED locations  
Table 8.  
LAN Connector LED status  
LED  
Color  
LED State  
Condition  
LAN link is not established  
Off  
On  
Left  
Green  
LAN link is established  
Blinking  
Off  
LAN activity is occurring  
N/A  
10 Mbits/sec data rate is selected  
100 Mbits/sec data rate is selected  
1000 Mbits/sec data rate is selected  
Right  
Green  
Yellow  
On  
On  
2.6.3  
2.6.4  
USB Port  
The USB port supports the USB 1.1/2.0 specification.  
Coaxial S/PDIF In/Out Connector  
This connector provides digital audio input and output from external audio system that  
supports digital coaxial audio. Ensure that the audio system provides a coaxial digital-  
in/out connector.  
2.6.5  
eSATA Port  
This development kits support the first generation eSATA port.  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features  
2.7  
Debug Features  
2.7.1  
Extended Debug Probe (XDP)  
The reference board provides a JTAG-compliant test access port (TAP) for attachment  
of an XDP connector. The XDP connector and associated circuitry enable the use of the  
ITP for the particular processor to interrupt the boot sequence and view processor  
status.  
The XDP connector is located on the backside of the board at location J2BC. Refer to  
Figure 11 to the XDP connector location. Take notes that ITP-XDP SSA connector is  
needed. Refer to diagram below for the ITP-XDP SSA connector.  
Figure 11.  
ITP-XDP Connector location (J2BC)  
ITP-XDP  
Connector  
ITP-XDP SSA Connector is  
needed in order to  
connect to ITP-XDP2/3  
tools  
2.7.2  
Power LEDs  
Power LEDs on the board indicate when standby power is being applied to the standby  
planes. When lit they indicate that no DIMM modules should be inserted or removed. To  
install or replace DIMM modules insure that AC power to the power supply is removed  
by unplugging the AC power cord from the power supply or placing the switch on the  
power supply to the open position.  
Caution:  
Removing DIMM modules when the standby power LEDs is lit could result in damage to  
the memory devices on those modules.  
2.7.3  
Port 80 POST Code LEDs  
Two LEDs display the POST codes output from Port 80 to indicate the progress of the  
boot sequence or display the POST code of the last operation successfully completed  
during the boot sequence. Please refer to Section 3.4 for more information on Port 80  
code reference.  
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2.7.4  
Voltage Reference  
See Table 9 for details of the expected voltage levels for each voltage rail on the CRB.  
Table 9.  
Voltage Reference detail  
Voltage Rail  
VCC  
Expected Voltage  
5.0  
Voltage Rail  
V_1P25_CORE  
Expected Voltage  
1.25  
1.25  
1.25  
1.8  
VCC3  
3.3  
V_1P25_CL_MCH  
V_1P25_PCIEXPRESS  
V_SM  
+12V  
12  
-12V  
-12  
5.0  
V_5P0_STBY\G  
V_3P3_STBY\G  
V_1P5_ICH  
V_1P05_ICH_CORE  
V_FSB_VTT  
VCCP  
V_SM_VTT  
0.9  
3.3  
V_3P3_CL  
3.3  
1.5  
V_3P3_PCIVAUX  
VDD_CLK  
3.3  
1.05  
1.2  
3.3  
VCC_CLK_IO  
0.8  
Varies  
2.8  
Development Kit Major Connectors and Jumpers  
Figure 12 shows major jumpers and headers used on the development kit.  
Figure 12.  
Major Jumper and Header Locations  
J4LB/J10LB  
J6LB  
J115LB  
J14LB  
J15LB  
J16LB  
J7LB  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features  
2.8.1  
Jumper Functions  
®
TM  
Table 10 provides a list of the setting definitions for the Intel Core 2 Duo Processor  
®
and Intel  
Q35 Express Chipset Development Kit.  
®
TM  
®
Table 10.  
Intel Core  
2 Duo Processor and Intel Q35 Express Chipset Development  
Kit Board Jumpers Description  
Jumper  
Description  
Default Position  
Clear CMOS  
(1-2: Normal, 2-3: Clear CMOS)  
J6LB  
1-2  
1-2  
RTC Reset  
(1-2: Normal, 2-3: Clear)  
J115LB  
J7LB  
Config /Recovery  
(1-2: Normal, 2-3: Configure, jumper removed –  
recovery)  
1-2  
Manufacturing mode  
(enable if jumper plug-in)  
J4LB/J10LB  
Empty  
2.8.2  
USB 2.0 Front Panel  
There are 4 USB 2.0 Front Panel can be found in the development kits board. Front  
panel USB header thermistor protection is required. USB front panel is label as U14LB,  
U15LB, U16LB and U1FW on the boards. Refer to Figure 12 for header location of  
U14LB, U15LB and U16LB. Refer to Figure 13 for U1FW.  
Table 11.  
USB Front Panel  
Pin Number  
Definition  
1
5V  
5V  
2
3
USB Dx-  
USB Dy-  
USB Dx+  
USB Dy+  
GND  
4
5
6
7
8
GND  
9
No pin  
10  
No connect  
2.8.3  
1394a Header  
The development kit board supports a 1394a solution on the PCIe bus with a single  
1394a port on the back panel (see Figure 9) and another header supporting a 1394a  
port (see Figure 13). Front panel 1394a header thermistor protection is required.  
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset  
Figure 13.  
Location for 1394a Header and USB Front Panel  
J24LB  
1394a  
Header  
U1FW  
(USB Front  
Panel)  
Table 12.  
1394a Header  
Pin Number  
Definition  
NDCD A-  
1
2
3
4
5
6
7
8
9
10  
NSIN A  
NSOUT A  
NDTR A-  
GND  
NDSR A-  
NRTS A-  
NCTS A-  
NRI A-  
No Pin  
2.9  
SPI Removal / Installation Technique  
When removing or installing the SPI device, care must be taken to avoid damage to the  
SPI socket. The cap is constructed of plastic and can easily be damaged.  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features  
2.9.1  
SPI Device Removal  
To remove the SPI device from the socket, use a tweezer tip to gently pry one leg of the  
cap away from the socket. There is a small latch on the bottom of the leg of the cap.  
Once the cap latch is disengaged, the cap may be removed without causing damage to  
the latches on the ends.  
With the SPI device exposed, move the small retaining clip to release the SPI device  
from the socket (see Figure 14). The SPI device should now spring up to allow removal  
from the socket.  
Figure 14.  
SPI Socket with Retaining Clip  
1. Follow the unclench process  
to unclench the cover.  
2. Clamp the fresh IC at  
location 1 and location 2 with  
tweezers.  
3. Remove the fresh IC from  
the socket.  
2.9.2  
SPI Device Installation  
To Install an SPI device in a socket, first place the side opposite from the retaining clip  
into the socket at an angle of approximately 15 degrees. Continue to gently insert the  
device into the socket until the metal retaining clip latches the device in place, as  
shown in Figure 15. Carefully place the cap straight down over the device until both  
ends latch into the socket. The installation is now complete.  
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Figure 15.  
SPI Device Installation  
2. Close the cover.  
1. Place the fresh IC into the  
socket. Match pin 1. on the IC  
to pin 1 on the socket.  
3. Lock the cover with  
the hook.  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Setting Up and Configuring the  
Development Kit  
3.0  
Setting Up and Configuring the Development Kit  
This chapter discusses basic board set up and operation. Please refer to Chapter 2.0 for  
the board layout, jumper setting location and the component reference designator.  
3.1  
Overview  
®
The board consists of a baseboard populated with one Intel Core™ 2 Duo processor  
®
E6400, the Intel Q35 Express chipset, and other system board components and  
peripheral connectors.  
Note:  
This board is shipped as an open system allowing for maximum flexibility in changing  
hardware configuration and peripherals. Since the board is not in a protective chassis,  
take extra precaution when handling and operating the system.  
Figure 16.  
Intel® Q35 Development Kits  
3.2  
Installing Board Standoffs  
Caution:  
The evaluation board in this development kit is shipped as an open system allowing for  
maximum flexibility in changing hardware configuration and peripherals in the lab  
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Setting Up and Configuring the Development Kit—Intel Core 2 Duo Processor and Intel Q35  
Express Chipset  
environment. Since the board is not in a protective chassis, the user is required to  
observe extra precautions when handling and operating the system.  
The board is a standard uBTX form factor and provides non-plated mounting holes with  
top and bottom ground rings. If the board is not going to be used in a chassis,  
standoffs are included for bench top use in the lab environment.  
The development kit includes eight hex standoffs and for screws to attach to the board  
for bench top use. Four of the standoffs are used to mount the heatsink (refer to  
Section 3.3 for heatsink installation). Attach standoffs to the screws to the board at the  
following mounting hole locations.  
1. Insert screw through top mounting hole for the BTX Heatsink. Refer to Figure 17 for  
the mounting hole location.  
2. Place standoff on backside of board and hand tighten to screw. Refer to Figure 18  
for guide.  
3. Repeat for additional standoffs on the board until all standoffs are installed. Refer  
to Figure 17 for recommended mounting hole locations.  
Figure 17.  
Mounting Hole Locations  
J24LB  
Recommended  
Mounting Hole  
Locations  
Mounting Hole for  
BTX heatsink  
Locations  
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Setting Up and Configuring the  
Development Kit  
Figure 18.  
Mounting the Standoff for BTX Heatsink  
3.3  
BTX Heatsink Setup with SRM  
This section describes BTX casing which uses “Support and Retention Module (SRM)” as  
shown in Figure 19.  
Note:  
SRM is not included in this development kits.  
Figure 19.  
Casing with “Support and Retention Module”  
3.3.1  
SRM Alignment on any BTX Board  
Attach the BTX Thermal Module Assembly (TMA) over the processor to the Support and  
Retention Module (SRM) by following procedures described below.  
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